Method for controlling field flow decouple plating and a device thereof

Abstract

A method for controlling plating with two independent power sources, wherein the high voltage power source is used for controlling the electrical swimming speed of the metal positive ions while the other is low-voltage power source for being used to control rate of plating rate. Positively charged metal ions of the strong electric field in the plating solution can reach to the negatively charged and unevenly distributed surface of the extraction negative pole more quickly, which is in turn connected to the negative of the low voltage power source. The ions aggregate at the recess of the extraction negative pole surface and waiting incoming electrons so as to perform electric extraction and produce uniform plating. The present invention also provides the apparatus for carrying out the mentioned method and therefore achieves better plating quality.

What is claimed is:  
     
         1 . A method for controlling field flow decouple plating, comprising following steps: 
 a driving field for electrical swimming being produced in plating solution;    a pair of ionic positive pole and extraction negative pole being connected to a plating power source placed in the plating solution;    positive metal ions on the ionic positive pole being controlled by the driving field for electrical swimming to move towards the extraction negative pole and the electric extraction taking place at a recess on the extraction negative pole surface.    
     
     
         2 . The method for controlling field flow decouple plating according to  claim 1 , wherein the driving field for electrical swimming comprises a field positive pole and a field negative pole that are connected to a high voltage electric field power source and placed away from each other in the plating solution as well.  
     
     
         3 . The method for controlling field flow decouple plating according to  claim 1 , wherein the ionic positive pole and the extraction negative pole in between the electric poles of the driving field for electrical swimming are connected to the corresponding positive and negative field poles.  
     
     
         4 . An apparatus of field flow decouple plating, comprising: 
 a high voltage direct current power source for a driving field with electrical swimming, providing a first positive pole and a first negative pole;    a low voltage plating direct current power source, providing a second positive pole and a second negative pole;    plating solution, containing a driving positive pole and a driving negative pole for electrical swimming and the driving positive pole spacing apart from the driving negative pole, a driving positive pole and a driving negative pole for electric swimming, and a metal ionic positive pole and an extraction negative pole;    wherein, the first positive and first negative poles are connected to the driving positive pole and the driving negative pole respectively, the second positive pole is connected to the metal ionic positive pole and the second negative pole to the extraction negative pole, and the metal ionic positive pole and the extraction negative pole are disposed to oppose to the driving positive pole and the driving negative pole for electrical swimming respectively.    
     
     
         5 . The apparatus of field flow decouple plating according to  claim 4 , wherein the first positive pole and the first negative pole are covered with insulation material.