US2003072891A1PendingUtilityA1
Thin film forming method, optical film, polarizing film and image display method
Est. expiryApr 25, 2021(expired)· nominal 20-yr term from priority
Y02T50/60C23C 16/509B05D 1/62C23C 16/545B32B 7/025
36
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Claims
Abstract
A method of forming a layer or layers are disclosed which comprises the steps of transporting a substrate having a first surface and a second surface on the side opposite the first surface to a gap formed between a first electrode and a second electrode opposing each other, the second surface having a coefficient of kinetic friction of not more than 0.9; and subjecting the first surface of the substrate to plasma discharge treatment to form the layer at atmospheric pressure or at approximately atmospheric pressure while supplying a reactive gas to the gap.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of forming a layer or layers, the method comprising the steps of:
(a) transporting a substrate having a first surface and a second surface on the side opposite the first surface to a gap formed between a first electrode and a second electrode opposing each other, the second surface having a coefficient of kinetic friction of not more than 0.9; and (b) subjecting the first surface of the substrate to plasma discharge treatment to form the layer at atmospheric pressure or at approximately atmospheric pressure while supplying a reactive gas to the gap.
2 . A method of forming a layer or layers, the method comprising the step of:
subjecting the surface of a substrate, the substrate having a thickness of from 10 to 60 μm and having a tensile strength of not less than 1.4×10 2 N/mm 2 , to plasma discharge treatment to form the layer at atmospheric pressure or at approximately atmospheric pressure at a gap formed between a first electrode and a second electrode opposing each other while supplying a reaction gas to the gap.
3 . A method of forming a first layer, the method comprising the step of:
subjecting the surface of a substrate or a second layer provided on a substrate to plasma discharge treatment to form the first layer at atmospheric pressure or at approximately atmospheric pressure at a gap formed between a first electrode and a second electrode opposing each other while supplying a reaction gas to the gap, wherein the substrate has a moisture content of not more than 4% at 23° C. and 80% RH.
4 . A method of forming a first layer, the method comprising the step of:
subjecting the surface of a substrate or a second layer provided on a substrate to plasma discharge treatment to form the first layer at atmospheric pressure or at approximately atmospheric pressure at a gap formed between a first electrode and a second electrode opposing each other while supplying a reaction gas to the gap, wherein the substrate has been stretched in the transverse direction.
5 . The method of claim 3 or 4 , wherein the second layer provided on the substrate is a hardened resin layer in which a monomer or an oligomer each having an ethylenically unsaturated double bond has been polymerized and hardened.
6 . The method of any one of claims 1 through 5 , wherein the substrate is a cellulose ester film.
7 . The method of claim 6 , wherein the cellulose ester film comprises a cellulose ester having a total acyl substitution degree of from 2.55 to 2.95.
8 . An optical film having a layer or layers formed according to the method of claims 1 through 7 .
9 . A polarizing plate employing the optical film of claim 8 as the protective film.
10 . An image display employing the optical film of claim 8.Join the waitlist — get patent alerts
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