Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact

Abstract

Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.

We claim:  
     
         1 . A method for depositing a conductive material on substantially the whole surface of a substrate from an electrolyte that contains the conductive material comprising the steps of: 
 electrically contacting the surface using at least one contact, wherein the contact and the surface are adapted for relative motion therebetween;    electrically connecting an electrode; and    depositing the conductive material on the surface while (a) applying a voltage potential between the contact and an electrode, (b) moving the contact and the surface relative to one another, and (c) wetting the electrode and the surface with the electrolyte.    
     
     
         2 . The method of  claim 1 , further comprising the step of positioning a pad between the surface and the electrode in close proximity to the surface.  
     
     
         3 . The method of  claim 1 , further comprising the step of positioning a porous pad between the surface and the electrode in close proximity to the surface.  
     
     
         4 . The method of  claim 1 , further comprising the step of positioning a pad with openings therein between the surface and the electrode in close proximity to the surface, where the openings control the uniformity of the deposition.  
     
     
         5 . The method of  claim 3 , wherein: 
 the depositing step is further performed while (d) contacting the surface with the pad.    
     
     
         6 . The method of  claim 4 , wherein: 
 the depositing step is further performed while (d) contacting the surface with a pad.    
     
     
         7 . The method of claim I, wherein: 
 the moving step includes the step of sliding the contact and the surface relative to one another.    
     
     
         8 . The method of  claim 1 , wherein: 
 the moving step includes the step of sliding the contact while keeping the surface substantially stationary.    
     
     
         9 . The method of  claim 1 , wherein: 
 the moving step includes the step of sliding the surface while keeping the contact substantially stationary.    
     
     
         10 . A method for removing a portion of conductive material on substantially the whole surface of a substrate using a solution comprising the steps of: 
 electrically contacting the surface using at least one contact, wherein the contact and the surface are adapted for relative motion therebetween;    electrically connecting an electrode; and    removing the portion of conductive material on the surface while (a) applying a voltage potential between the contact and an electrode, and (b) moving the contact and the surface relative to one another, and (c) wetting the electrode and the surface with the solution.    
     
     
         11 . The method of  claim 10 , further comprising the step of positioning a pad between the surface and the electrode in close proximity to the surface.  
     
     
         12 . The method of  claim 10 , further comprising the step of positioning a porous pad between the surface and the electrode in close proximity to the surface.  
     
     
         13 . The method of  claim 10 , further comprising the step of positioning a pad with openings therein between the surface and the electrode in close proximity to the surface, where the openings control the uniformity of the removal.  
     
     
         14 . The method of  claim 12 , wherein: 
 the depositing step is further performed while (d) contacting the surface with the pad.    
     
     
         15 . The method of  claim 13 , wherein: 
 the depositing step is further performed while (d) contacting the surface with the pad.    
     
     
         16 . The method of  claim 10 , wherein: 
 the moving step includes the step of sliding the contact and the surface relative to one another.    
     
     
         17 . The method of  claim 10 , wherein: 
 the moving step includes the step of sliding the contact while keeping the surface substantially stationary.    
     
     
         18 . The method of  claim 10 , wherein: 
 the moving step includes the step of sliding the surface while keeping the contact substantially stationary.    
     
     
         19 . A method for electro-treating substantially the whole surface of a substrate using a solution comprising the steps of: 
 electrically contacting the surface using at least one contact, wherein the contact and the surface are adapted for relative motion therebetween;    electrically connecting an electrode; and    treating the surface while (a) applying a voltage potential between the contact and an electrode, and (b) moving the contact and the surface relative to one another, and (c) wetting the electrode and the surface with the solution.    
     
     
         20 . The method of  claim 19 , further comprising the step of positioning a pad between the surface and the electrode in close proximity to the surface.