Heat sink for a rectifier

Abstract

A heat sink for a rectifier which has two heat sink plates, multiple blind holes defined in the beat sink plates. Multiple assembly diodes each corresponding to one of the blind holes and multiple metal plates each received in the bottom of one of the blind holes and under the bottom of the nail connector. After the metal plates, diode chips and the nail connectors are placed in the blind hole of the heat sink plate, an insulating plate is filled into the blind hole to secure the location of the nail connector and the metal plate, such that because the contraction coefficient of the diode chip during the cooling process increases, the water filtration and particle contamination are avoided. Furthermore, the heat dissipation efficient of the rectifier is increased as well.

What is claimed is:  
     
         1 . A heat sink for a rectifier comprising: 
 a first heat sink plate;    a second heat sink plate securely connected with the first heat sink plate and having multiple blind holes defined therein;    multiple metal plates each corresponding to and received in one of the multiple blind holes;    multiple diode chips each corresponding to one of the metal plates;    multiple nail connectors each corresponding to one of the metal plates and received in a corresponding one of the blind holes; and    an insulating material filled in one of the blind holes to secure the location of the nail connector and the metal plate in each of the blind holes.    
     
     
         2 . The heat sink as claimed in  claim 1 , wherein each of the nail connectors is placed in the blind hole and on top of the meal plate.  
     
     
         3 . The heat sink as claimed in  claim 1 , wherein the diode chip is made of copper.