US2003070791A1PendingUtilityA1

Heat sink module

Priority: Oct 12, 2001Filed: Oct 12, 2001Published: Apr 17, 2003
Est. expiryOct 12, 2021(expired)· nominal 20-yr term from priority
Inventors:Yu-Shen Lin
H10W 40/73
36
PatentIndex Score
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Cited by
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References
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Claims

Abstract

A heat sink module has a heat dissipation performance by a thermal conducting tube with a vacuum and a cooling fluid therein. The thermal conducting tube corresponds to a center of a CPU, so most of the heat from the CPU is able to be dissipated quickly to keep the CPU in a normal operating temperature range.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A heat sink module, comprising: 
 a base adapted to be mounted on a CPU;    a thermal conducting body secured to the base, which is hollow and airtight and has a vacuum chamber, wherein cooling fluid is put into the vacuum chamber to dissipate heat from the CPU quickly.    
     
     
         2 . The heat sink module as claimed in  claim 1 , wherein a hole corresponding to a center of the CPU is defined in the base, and the thermal conducting body is retained in the hole and corresponds to the center of the CPU.  
     
     
         3 . The heat sink module as claimed in  claim 1 , wherein conducting plates are stacked together on the base and each connects to the thermal conducting body.  
     
     
         4 . The heat sink module as claimed in  claim 1 , wherein a through hole is defined in each of the conducting plates to pass around the thermal conducting body.  
     
     
         5 . The heat sink module as claimed in  claim 3 , wherein each conducting plate is U shape, when stacked together a gap is defined between two adjacent conducting plates.  
     
     
         6 . The heat sink module as claimed in  claim 1 , wherein combinations of the thermal conducting body comprise a thermal conducting tube having an open end and a cover sealed on the open end.  
     
     
         7 . The heat sink module as claimed in  claim 6 , wherein the tube further comprises a rough inner face.  
     
     
         8 . The heat sink module as claimed in  claim 1 , further comprising a fan connecting to the base and corresponds to the thermal conducting body.  
     
     
         9 . The heat sink module as claimed in  claim 3 , further comprising a fan connecting to the base and corresponds to the thermal conducting body.

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