US2003070791A1PendingUtilityA1
Heat sink module
Priority: Oct 12, 2001Filed: Oct 12, 2001Published: Apr 17, 2003
Est. expiryOct 12, 2021(expired)· nominal 20-yr term from priority
Inventors:Yu-Shen Lin
H10W 40/73
36
PatentIndex Score
0
Cited by
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References
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Claims
Abstract
A heat sink module has a heat dissipation performance by a thermal conducting tube with a vacuum and a cooling fluid therein. The thermal conducting tube corresponds to a center of a CPU, so most of the heat from the CPU is able to be dissipated quickly to keep the CPU in a normal operating temperature range.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat sink module, comprising:
a base adapted to be mounted on a CPU; a thermal conducting body secured to the base, which is hollow and airtight and has a vacuum chamber, wherein cooling fluid is put into the vacuum chamber to dissipate heat from the CPU quickly.
2 . The heat sink module as claimed in claim 1 , wherein a hole corresponding to a center of the CPU is defined in the base, and the thermal conducting body is retained in the hole and corresponds to the center of the CPU.
3 . The heat sink module as claimed in claim 1 , wherein conducting plates are stacked together on the base and each connects to the thermal conducting body.
4 . The heat sink module as claimed in claim 1 , wherein a through hole is defined in each of the conducting plates to pass around the thermal conducting body.
5 . The heat sink module as claimed in claim 3 , wherein each conducting plate is U shape, when stacked together a gap is defined between two adjacent conducting plates.
6 . The heat sink module as claimed in claim 1 , wherein combinations of the thermal conducting body comprise a thermal conducting tube having an open end and a cover sealed on the open end.
7 . The heat sink module as claimed in claim 6 , wherein the tube further comprises a rough inner face.
8 . The heat sink module as claimed in claim 1 , further comprising a fan connecting to the base and corresponds to the thermal conducting body.
9 . The heat sink module as claimed in claim 3 , further comprising a fan connecting to the base and corresponds to the thermal conducting body.Join the waitlist — get patent alerts
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