Dual wafer position loadlock chamber

Abstract

A dual wafer position loadlock chamber for a cluster tool includes a block which defines the chamber, a platen that projects into the chamber, a heat lamp assembly that radiates into the loadlock chamber and a plurality of rails for positioning a wafer within the chamber. The platen selectively cools the wafer and includes a bell portion located within the loadlock chamber. The heat lamp assembly is mounted to the block across the chamber from the bell portion. The rails extend into the loadlock chamber around the bell portion, and an upper flange and lower flange extend perpendicularly from each rail. During cooling operations, the wafer is placed on the upper flanges, which positions the wafer immediately proximate the bell portion for cooling the wafer. During degassing operations, the wafer is placed on the lower flanges and the heat lamp assembly illuminates and establishes a focal plane of uniform radiation intensity which is co-planar with the wafer. In this manner, the loadlock chamber allows both wafer degassing and wafer cooling functions to be performed within the loadlock chamber, which eliminates the need for a dedicated degassing chamber and cooling chamber in the cluster tool.

What is claimed is:  
     
         1 . A device for processing a wafer comprising: 
 a block defining a chamber;    a platen extending through said block into said chamber;    a heat lamp assembly attached to said block opposite from said platen; and,    a plurality of wafer support structures for positioning said wafer between said platen and said heat lamps.    
     
     
         2 . The device of  claim 1  wherein each said wafer support structure further comprises: 
 a tine having an upper flange and a lower flange; and,  
 said upper flanges defining a cooling plane.  
 
     
     
         3 . The device of  claim 2  wherein said cooling plane is immediately proximate said platen.  
     
     
         4 . The device of  claim 2  wherein said lower flanges define a heating plane, said heating plane being located between said upper flanges and said heat lamp assembly.  
     
     
         5 . The device of  claim 1  wherein said heat lamp assembly further comprises: 
 a curved reflector mounted to said block;  
 a first plurality of heat lamps mounted to said reflector and being oriented for illumination into said chamber; and,  
 a second plurality of heat lamps mounted to said reflector and being oriented for illumination into said chamber.  
 
     
     
         6 . The device of  claim 5  wherein said first plurality has a first spacing for establishing a first plane of uniform radiation intensity in said chamber, said first plane being co-planar with said heating plane.  
     
     
         7 . The device of  claim 6  wherein said second plurality has a second spacing for establishing a second plane of uniform radiation intensity in said chamber, said second plane being co-planar with said first plane.  
     
     
         8 . The device of  claim 1  further comprising: 
 a cylindrical reflector mounted to said block;  
 a plurality of elongated heat lamps mounted within said reflector and oriented for illumination into said chamber; and  
 
     
     
         9 . The device of  claim 1  wherein said platen has a gas supply line extending internally therethrough, said gas supply line having a first end connected to a pressurized gas source, and further having a second end in fluid communication with said chamber.  
     
     
         10 . An apparatus for processing a wafer comprising; 
 a block having a chamber defined by a top wall, a bottom wall, and a plurality of side walls;    a platen mounted to said block and having a flat surface located within said chamber;    a heat lamp assembly mounted to said block and arranged to direct radiation toward said wafer; and,    a holding means for selectively supporting a wafer in said chamber immediately proximate said flat surface and said bottom wall.    
     
     
         11 . The apparatus of  claim 10  wherein said holding means further comprises a plurality of vertical rails attached to said block in a surrounding relationship with said platen, each rail having an upper flange and a lower flange that projects outwardly from said rail.  
     
     
         12 . The apparatus of  claim 11  wherein said wafer defines an upper position when resting on said upper flanges and said wafer is parallel to said flat surface when in said upper position.  
     
     
         13 . The apparatus of  claim 11  wherein said wafer further defines a lower position when resting on said lower flanges, said lower position being located between said upper position and said heat lamp assembly.  
     
     
         14 . The apparatus of  claim 13  wherein said bottom wall allows for illumination therethrough, and said heat lamp assembly further comprises: 
 a curved reflector mounted to said bottom wall;  
 a first plurality of heat lamps mounted to said reflector and being oriented for illumination through said bottom wall and into said chamber; and,  
 a second plurality of heat lamps mounted to said reflector and being oriented for illumination through said bottom wall and into said chamber.  
 
     
     
         15 . The apparatus of  claim 14  wherein said first plurality has a first spacing for establishing a first plane of uniform radiation intensity in said chamber, said first plane being co-planar with said lower plane.  
     
     
         16 . The apparatus of  claim 15  wherein said second plurality has a second spacing for establishing a second plane of uniform radiation intensity in said chamber, said second plane being co-planar with said first plane.  
     
     
         17 . The apparatus of  claim 10  further comprising a cooling system in thermal communication with said platen.  
     
     
         18 . The apparatus of  claim 10  wherein said platen has a gas supply line extending internally therethrough, said gas supply line having a first end connected to a pressurized gas source, and further having a second end in fluid communication with said chamber.  
     
     
         19 . A method for cooling and degassing a wafer which comprises the steps of: 
 A) providing a block;    B) defining a chamber within said block;    C) mounting a platen to said block so that said platen extends through said block into said chamber;    D) attaching a heat lamp assembly to said block opposite from said platen;    E) arranging a plurality of wafer support structures around said platen and within said chamber, each wafer support structure having an upper flange and a lower flange extending from a tine, said upper flanges and said lower flanges being located between said platen and said heat lamp assembly; and,    F) selectively positioning said wafer on said upper flanges to cool said wafer within said chamber.    
     
     
         20 . The method of  claim 19  further comprising the steps of: 
 G) placing said wafer on said lower flanges; and,  
 H) illuminating said heat lamp assembly.