US2003062644A1PendingUtilityA1

Polytetrafluoroethylene film and manufacture of same

Priority: Mar 19, 2001Filed: Mar 15, 2002Published: Apr 3, 2003
Est. expiryMar 19, 2021(expired)· nominal 20-yr term from priority
Y10T428/24355C08J 5/18G03G 15/2057B32B 27/28B29K 2105/04B29K 2027/18B29L 2007/008Y10T428/265C08J 2327/18Y10T428/31544Y10T428/1352B29C 43/22B29C 55/18B29C 43/003
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Claims

Abstract

Polytetrafluoroethylene thin film comprising a thin film of polytetrafluoroethylene having thickness of ≦20 μm; surface roughness (Ra) of ≦0.1 μm; tensile strength of ≧80 N/mm 2 ; and light beam transmittance of ≧80% for light of 500 nm wavelength. A process for manufacture of polytetrafluoroethylene film comprising compressing porous polytetrafluoroethylene film at a temperature above the melting point of the film, followed by cooling to a temperature below the melting point of the film while continuing to apply pressure.

Claims

exact text as granted — not AI-modified
1 . In an electrophotographic device, including a fixing belt and a fixing apparatus, the improvement wherein at least one of the fixing roll, the fixing belt, and the fixing apparatus comprises a thin film of polytetrafluoroethylene having thickness of ≦20 μm; surface roughness (Ra) of ≦0.1 μm; tensile strength of ≧80 N/mm 2 ; and light beam transmittance of ≧80% for light of 500 nm wavelength.  
     
     
         2 . The electrophotographic device according to  claim 1  wherein porosity of said thin film is ≦10%.  
     
     
         3 . A process for manufacture of polytetrafluoroethylene film comprising the steps of compressing porous polytetrafluoroethylene film at a temperature below the melting point of said film, followed by compression at a temperature above the melting point of said film.  
     
     
         4 . A process for manufacture of polytetrafluoroethylene film comprising the steps of compressing porous polytetrafluoroethylene film while subjecting it to a temperature above the melting point of said film, followed by cooling to a temperature below the melting point of said film while continuing to apply pressure.

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