Method of inspecting newly purchased or reground materials for making printed circuit boards

Abstract

A method of inspecting newly purchased or reground materials for making printed circuit board (PCB) includes the steps of receiving the materials; sending the received materials to an automatic optical inspection system, at where the materials are inspected and graded; sending the inspected and graded materials to a packing machine to be separately packed; storing the packed good materials in a warehouse or issuing them to a production line for use; sending the packed defective materials and the good materials that have been used for a period of time to a specified place for regrinding; inspecting the reground materials with the automatic optical inspection system again; and scraping the materials that are no longer regrindable. The method enables materials for making PCBs to be always maintained in an optimal working condition to ensure production of high-quality PCBs.

What is claimed is:  
     
         1 . A method of inspecting newly purchased or reground materials for making printed circuit boards, comprising the following steps: 
 a. Receiving materials newly purchased for making printed circuit boards and putting them into a starting point in an inspection line;    b. Inspecting, grading, and classifying said newly purchased materials received in step “a” through an automatic optical inspection system, so that said materials are divided into good and defective ones; and separately recording data about said good and said defective materials;    c. Sending said good and said defective materials to a packing machine, at where recorded data about said good and said defective materials being read so that said good and said defective materials are positioned into their respective containers and sequentially packed;    d. Storing said good materials packed in step “c”, in a warehouse or issuing them to a production line for use; and, sending said good materials that having been used for a period of time to a specified place for regrinding;    e. Directly sending said defective materials detected in step “b” and packed in step “c” to said specified place for regrinding; and returning said reground materials to said automatic optical inspecting system in step “b” and repeating the same inspection procedures from step “b” to step “e”; and    f. Scraping said materials that are no longer regrindable in step  5  by directly removing them from said inspection line;    whereby said materials passing said steps “a” to “f” included in said inspection method are always maintained in an optimal working condition when they are put into a production line, enabling production of high-quality printed circuit boards and high yield of good products at less time, material, and labor for inspection and accordingly at largely reduced manufacturing cost.