US2003047658A1PendingUtilityA1
Base pad having a leveling system and a method for manufacturing the same
Est. expiryAug 27, 2021(expired)· nominal 20-yr term from priority
F16M 11/22H02B 1/50H02B 1/011
28
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Claims
Abstract
The invention provides a support structure for supporting electrical equipment. The support structure includes a top surface adapted to have the electrical equipment mounted thereto, and a level element recessed within a portion of the support structure to provide a visual indication of whether the top surface is horizontally oriented.
Claims
exact text as granted — not AI-modified1 . A support structure for supporting electrical equipment, the support structure comprising:
a plurality of side walls; a top surface connected to the plurality of side walls; and a leveling system for providing a visual indication of whether the top surface is horizontally oriented.
2 . The support structure as claimed in claim 1 , further comprising a base and wherein the plurality of side walls extend generally upward from the base at an obtuse angle from the base.
3 . The support structure as claimed in claim 1 , wherein the support structure is frusto-pyramidical in shape.
4 . The support structure as claimed in claim 1 , wherein the leveling system includes a bubble level.
5 . The support structure as claimed in claim 1 , wherein the top surface includes a recess and the leveling system includes a bubble level, the bubble level being positioned within the recess.
6 . The support structure as claimed in claim 5 , wherein the bubble level is positioned in the recess such that no part of the bubble level protrudes above the top surface.
7 . The support structure as claimed in claim 1 , further comprising a base flange and a cable opening, the base flange extending out from a bottom edge of the plurality of side walls, the base flange framing sides and top of the cable opening such that the cable opening is an open slot.
8 . The support structure as claimed in claim 7 , wherein the top of the cable opening is substantially parallel to the top surface and includes a recess, the leveling system including a bubble level that is positionable within the recess.
9 . The support structure as claimed in claim 8 , wherein no portion of the bubble level protrudes out of the recess.
10 . The support structure as claimed in claim 1 , further comprising a base that includes a recess, the leveling system including a bubble level that is positionable in the recess such that no portion of the bubble level protrudes above the base.
11 . The support structure as claimed in claim 1 , further comprising a plurality of ribs coupled to and extending generally vertically along the plurality of side walls.
12 . The support structure as claimed in claim 1 , further comprising an opening in the top surface to accommodate electrical connections to the electrical equipment, the electrical equipment being supported by the top surface.
13 . A support structure for supporting electrical equipment, the support structure comprising:
a top surface adapted to have the electrical equipment mounted thereto; a recess defined in a portion of the support structure; and a level element positioned in the recess such that no portion of the level element protrudes out of the recess, the level element providing a visual indication of whether the top surface is horizontally oriented.
14 . The support structure as claimed in claim 13 , wherein the recess is defined in the top surface.
15 . The support structure as claimed in claim 13 , further comprising a plurality of side walls, a base flange, and a cable opening, the base flange extending out from a bottom edge of the plurality of side walls and framing sides and top of the cable opening such that the cable opening is an open slot.
16 . The support structure as claimed in claim 15 , wherein the top of the cable opening is substantially parallel with the top surface and wherein the recess is defined in the top of the cable opening.
17 . The support structure as claimed in claim 13 , further comprising a base flange that is substantially parallel to the top surface, the recess being defined in the base flange.
18 . The support structure as claimed in claim 13 , wherein the level element includes a bubble level.
19 . The support structure as claimed in claim 18 , wherein the bubble level includes a longitudinal axis that is substantially parallel to the top surface when the bubble level is positioned in the recess.
20 . The support structure as claimed in claim 13 , further comprising a plurality of side walls coupled to the top surface and a plurality of ribs coupled to and extending generally vertically along the plurality of side walls.
21 . The support structure as claimed in claim 13 , further comprising an opening in the top surface to accommodate electrical connections to the electrical equipment, the electrical equipment being supported by the top surface.
22 . A method of manufacturing a support structure for supporting electrical equipment, the method comprising:
providing a mold for the support structure, the mold including a recess-defining protrusion; introducing a molding material into the mold; curing the molding material into the shape of the support structure within the mold and forming a level recess in the support structure around the recess-defining protrusion; removing the support structure from the mold; and inserting a level element into the level recess.
23 . The method as claimed in claim 22 , wherein providing a mold further includes integrally forming the recess-defining protrusion with the mold.
24 . The method as claimed in claim 22 , wherein providing a mold further includes providing a capsule and mounting the capsule to the mold to define the recess-defining protrusion.
25 . The method as claimed in claim 24 , wherein providing a capsule further includes positioning a flat surface of the capsule against the mold and spacing a round surface of the capsule away from the mold, the round surface of the capsule being complementary to the level element shape.
26 . The method as claimed in claim 24 , wherein mounting the capsule further includes affixing the capsule within the mold with an adhesive.
27 . The method as claimed in claim 22 , wherein inserting a level element further includes inserting a level element into the level recess such that no portion of the level element protrudes out of the level recess.
28 . The method as claimed in claim 22 , wherein providing a mold includes forming the recess-defining protrusion out of aluminum.
29 . The method as claimed in claim 22 , further comprising applying a release agent to the mold after providing a mold and prior to introducing a molding material.
30 . The method as claimed in claim 29 , further comprising applying a gelcoat over the release agent prior to introducing the molding material.
31 . The method as claimed in claim 22 , wherein introducing a molding material into the mold further includes introducing a molding material into the mold with a chopper gun.
32 . The method as claimed in claim 22 , further comprising placing a plurality of ribs into the molding material after introducing the molding material into the mold and prior to completion of the curing step.
33 . The method as claimed in claim 22 , further comprising compressing the molding material in the mold to ensure the molding material is substantially uniform and to remove air bubbles from the molding material.
34 . The method as claimed in claim 22 , wherein introducing a molding material further includes introducing fiberglass, resin, and a catalyst into the mold.
35 . The method as claimed in claim 22 , wherein inserting a level element into the level recess further includes inserting a bubble level into the level recess.Join the waitlist — get patent alerts
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