US2003040259A1PendingUtilityA1

Polishing material, grinding particle body for abrasion-grinding, method for producing a polishing material, and method for polishing or grinding, and polishing apparatus

Assignee: NISCA CORPPriority: Jun 10, 1999Filed: Jul 30, 2002Published: Feb 27, 2003
Est. expiryJun 10, 2019(expired)· nominal 20-yr term from priority
B24D 99/00B24B 1/002B24B 1/005B24B 29/02B24B 31/112B24B 35/005C09G 1/02
38
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Claims

Abstract

This invention provides a polishing apparatus using a polishing material freely varying its shape in a tri-dimensional space in accordance with the shape of a work, and capable of polishing a narrow, recessed surface inaccessible to human hands or a tool, and a polishing method used therefor. A fluid containing grinding particles is solidified or gelatinized in accordance with the shape of a work; and the resulting solid body is moved relative to the work, thereby polishing or grinding the work. The fluid containing grinding particles is a magnetic fluid capable of controlling the orientation of grinding particles in the presence of a magnetic field; and the fluid is solidified or gelatinized while being exposed to a magnetic field. Alternatively, the grinding particles are dielectric grinding particles capable of polarizing in the presence of an electric field, and the fluid containing dielectric grinding particles is solidified or gelatinized while being exposed to an electric field. Further, a fluid containing grinding particles is poured on the surface of a work to be processed; and the fluid is solidified or gelatinized while it takes a shape in accordance with that of the surface of work to be processed, thereby producing a polishing material. A fluid containing grinding particles is solidified or gelatinized while it takes a shape in accordance with that of a work; and the resulting solid is moved relative to the work, thereby polishing or grinding the work.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A polishing material prepared such that a fluid containing grinding particles is solidified or gelatinized in accordance with the shape of a work, and the resulting solid or gel material is moved relative to the work, thereby polishing or grinding the work.  
     
     
         2 . A polishing material as described in  claim 1  wherein the fluid containing grinding particles is a magnetic fluid capable of controlling the orientation of grinding particles in the presence of a magnetic field, and is solidified or gelatinized while being in the presence of a magnetic field.  
     
     
         3 . A polishing material as described in  claim 1  wherein the fluid containing grinding particles is an electric rheology fluid capable of controlling the orientation of grinding particles in the presence of an electric field, and is solidified or gelatinized in the presence of an electric field.  
     
     
         4 . A polishing material as described in claims  1  and  3  wherein the grinding particles polarize in the presence of an electric field.  
     
     
         5 . A polishing material as described in  claims 1  to  4  wherein the fluid, containing water as a substrate, solidifies by being exposed to a temperature not higher than its solidification point, and liquefies by being exposed to a temperature higher than the solidification point.  
     
     
         6 . A polishing material as described in  claims 1  to  4  wherein the fluid, containing as a substrate a substance capable of polymerizing in the presence of light, solidifies or gelatinizes by being exposed to light.  
     
     
         7 . A polishing material as described in  claim 5  wherein the substance capable of polymerizing is at least one arbitrarily chosen from the group comprising styrene, methyl methacrylate and vinyl acetate.  
     
     
         8 . Method for preparing a polishing material comprising the steps of: 
 pouring a fluid containing grinding particles on the surface of a work to be processed; and    solidifying or gelatinizing the fluid in accordance with the shape of the surface of work to be processed.    
     
     
         9 . Method for polishing or grinding a work comprising the steps of: 
 solidifying or gelatinizing a fluid containing grinding particles in accordance with the shape of a work; and    moving the resulting solid or gel material relative to the work.    
     
     
         10 . Method for polishing or grinding as described in  claim 9  wherein the relative movement occurs as a mechanical vibration between the material and the work.  
     
     
         11 . Method for polishing or grinding a work comprising the steps of: 
 solidifying or gelatinizing a magnetic fluid capable of controlling the orientation of grinding particles in the presence of a magnetic field, in accordance with the shape of a work;    solidifying or gelatinizing the fluid while it is exposed to a magnetic field; and    moving the resulting solid or gel matter relative to the work.    
     
     
         12 . Method for polishing or grinding as described in  claim 11  wherein the relative movement is evoked by alternate magnetic fields.  
     
     
         13 . Method for polishing or grinding a work comprising the steps of: 
 solidifying or gelatinizing a fluid containing dielectric grinding particles capable of polarizing in the presence of an electric field, in accordance with the shape of a work;    solidifying or gelatinizing the fluid while it is exposed to an electric field; and    moving the resulting solid or gel material relative to the work.    
     
     
         14 . Method for polishing or grinding as described in  claim 13  wherein the relative movement is evoked by alternate electric fields.  
     
     
         15 . Polishing method as described in  claim 9 ,  11  or  13  comprising the steps of: 
 solidifying the fluid;  
 liquefying again part of the solid material on the surface in contact with a work to be processed; and  
 moving the solid material relative to the work.  
 
     
     
         16 . A grinding particle body for abrasion-grinding wherein: 
 the main ingredient of solvent contains at least one of the compounds represented by the following general formula,    R1—COO—R2    where R1=CaH2a+1, 10 a 25, and R2=CbH2b+1, 1 b 25.    
     
     
         17 . A grinding particle body for abrasion-grinding as described in  claim 16  wherein the main ingredient of solvent contains at least one out of stearic acid esters or myristic acid esters.  
     
     
         18 . A grinding particle body for abrasion-grinding as described in  claim 16  wherein the grinding particles contain at least one out of aluminum oxide or diamond whose particle diameter distribution has the central point at 2 to 9 μm.  
     
     
         19 . A grinding particle body for abrasion-grinding as described in  claim 16  wherein the grind particle orientation material contains as its main ingredient ferrite particles whose particle distribution has the central point at 2 μm or less.  
     
     
         20 . A grinding particle body for abrasion-grinding as described in  claim 16  wherein reversible phase transition occurs between liquid and solid states with the melting point of the solvent serving as the phase boundary.  
     
     
         21 . A grinding particle body for abrasion-grinding as described in  claim 16  wherein the grinding particle body turning into a solid as a result of phase transition serves as a polishing material.  
     
     
         22 . Polishing apparatus using a polishing material formed in accordance with the shape of the surface of a work to be processed which comprises means of moving the polishing material relative to the work.  
     
     
         23 . Polishing apparatus as described in  claim 22  wherein the polishing material is obtained by solidifying or gelatinizing a fluid containing grinding particles.  
     
     
         24 . Polishing apparatus as described in claims  22  and  23  wherein the relative movement occurs as a mechanical vibration of a polishing material against a work.  
     
     
         25 . Polishing apparatus as described in  claims 22  to  24  wherein: 
 a magnetic fluid capable of controlling the orientation of grinding particles in the presence of a magnetic field is used;  
 the magnetic fluid is solidified or gelatinized while it is exposed to a magnetic field; and  
 the relative movement is evoked by alternate magnetic fields.  
 
     
     
         26 . Polishing apparatus as described in  claims 22  to  24  wherein: 
 the polishing material is obtained by solidifying or gelatinizing a fluid containing grinding particles capable of polarizing in the presence of an electric field; and  
 the relative movement is evoked by alternate electric fields.  
 
     
     
         27 . Polishing apparatus as described in  claims 22  to  26  wherein the relative movement occurs in a uni-, two- or tri-dimensional direction.  
     
     
         28 . Polishing apparatus as described in  claim 27  wherein the relative movement occurring in a uni-, two- or tri-dimensional direction proceeds from one dimension to another in a sequential order.  
     
     
         29 . Polishing apparatus as described in  claim 27  wherein the relative movement occurring in a uni-, two- or tri-dimensional direction proceeds along the dimensions at the same time.  
     
     
         30 . Polishing apparatus comprising: 
 a driving means for evoking a relative movement between a polishing material formed in accordance with the shape of the surface of a work to be processed, and the work;    a pressure detection means for detecting pressure generated on the work by the polishing material during the relative movement; and    a control means for controlling the stroke distance of relative movement according to the value of pressure detected by the pressure detection means.    
     
     
         31 . Polishing apparatus as described in  claim 30  which is so configured that: 
 a specific value of pressure has been fed to the control means; and  
 the control means controls the driving means such that the value of pressure during the relative movement corresponds with the specified value.

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