Electrical connector

Abstract

In a socket used to house semiconductor die during testing, a recessed socket contact is provided that avoids pinching the die's contacts. Also provided are socket contacts that allow for smaller socket holes and, therefore, denser arrays of socket contacts. In one embodiment, the body of the socket contact comprises a head, a spring coupled to the head, and a shaft coupled to the spring; no outer shell is needed for the spring, as the non-conductive sides of the socket hole serve that function. In another embodiment, the body of the socket contact comprises a metal shaft having an aperture. Compression causes the shaft to close around the slit, thereby decreasing the amount of lateral buckling. In yet another embodiment, semiconductor fabrication techniques are used to construct a dense array of contacts.

What is claimed is:  
     
         1 . A method of supporting electrical communication through a socket between an IC chip and a printed circuit board, comprising: 
 interposing a semiconductive shaft between said IC chip and said printed circuit board;    connecting said shaft to said printed circuit board with an adhesive material; and    allowing electrical conductivity through said adhesive material in response to a compression between said shaft and said printed circuit board.    
     
     
         2 . A method electrical communication through a socket between an integrated circuit chip and a printed circuit board, comprising: 
 interposing a portion of a semiconductive shaft between said integrated circuit chip and said printed circuit board;    connecting said shaft to said printed circuit board using an adhesive material; and    compressing said adhesive material between said shaft and said printed circuit board for allowing electrical conductivity through said adhesive material.    
     
     
         3 . A method for electrical communication between an integrated circuit chip and a printed circuit board, comprising: 
 interposing a portion of a semiconductive shaft between said integrated circuit chip and said printed circuit board;    connecting said shaft to said printed circuit board using an adhesive material; and    compressing said adhesive material for allowing electrical conductivity through said adhesive material.