Heat-relaxable substrates and arrays

Abstract

Articles, such as high density arrays, on heat-relaxable substrates that can be relaxed by exposure to thermal energy are disclosed, along with methods of manufacturing the arrays, and systems/apparatus for relaxing arrays using electromagnetic energy. The arrays may themselves include electromagnetic energy sensitive material in their construction, in which case exposure of the arrays to suitable electromagnetic energy can provide the thermal energy required to cause the arrays to relax. In other embodiments, the arrays may not include an electromagnetic energy sensitive material in their construction, in which case the arrays may be heated indirectly, i.e., by locating the arrays within a system or apparatus that includes an electromagnetic energy sensitive material and transferring the thermal energy from the electromagnetic energy sensitive material to the array by, e.g., conduction.

What is claimed is:  
     
         1 . A method of relaxing an array, comprising: 
 providing an array comprising a heat-relaxable substrate and reactants affixed thereto;    providing electromagnetic energy sensitive material in thermal communication with the substrate;    directing electromagnetic energy towards the electromagnetic energy sensitive material, wherein the electromagnetic energy is converted into thermal energy and conducted to the heat-relaxable material, thereby causing the heat-relaxable material in the substrate to relax.    
     
     
         2 . The method of  claim 1 , wherein the array further comprises linking agents.  
     
     
         3 . The method of  claim 2 , wherein the linking agents are included in a linking agent coating on the substrate.  
     
     
         4 . The method of  claim 2 , wherein the linking agents comprise an azlactone moiety.  
     
     
         5 . The method of  claim 2 , wherein the reactants are affixed to the linking agents at the plurality of binding sites.  
     
     
         6 . The method of  claim 1 , wherein the reactants are selected from the group consisting of nucleic acids, proteins, and carbohydrates.  
     
     
         7 . The method of  claim 1 , wherein the reactants comprise oligonucleotides.  
     
     
         8 . The method of  claim 1 , wherein the reactants comprise cDNA.  
     
     
         9 . The method of  claim 1 , wherein the electromagnetic energy sensitive material comprises a Curie point material.  
     
     
         10 . The method of  claim 9 , wherein the heat-relaxable material of the substrate has a relaxation temperature, and further wherein the Curie point material has a Curie temperature of at least about the relaxation temperature.  
     
     
         11 . The method of  claim 9 , further comprising providing an electrically conductive ground plane in proximity with the Curie point material.  
     
     
         12 . The method of  claim 1 , further comprising contacting the heat-relaxable material with the electromagnetic energy sensitive material.  
     
     
         13 . The method of  claim 12 , further comprising removing the array from contact with the electromagnetic energy sensitive material after directing electromagnetic energy towards the electromagnetic energy sensitive material.  
     
     
         14 . The method of  claim 1 , wherein the electromagnetic energy sensitive material is on the substrate.  
     
     
         15 . The method of  claim 14 , wherein the electromagnetic energy sensitive material comprises a layer comprising one or more metals, one or more metallic compounds, or combinations of one or more metals and one or more metallic compounds.  
     
     
         16 . The method of  claim 14 , wherein the substrate comprises first and second major surfaces, and further wherein the electromagnetic energy sensitive material contacts substantially all of at least one of the first and second major surfaces.  
     
     
         17 . The method of  claim 1 , wherein the substrate comprises a coating including particulates of the electromagnetic energy sensitive material.  
     
     
         18 . The method of  claim 17 , wherein the coating further comprises linking agents.  
     
     
         19 . The method of  claim 1 , wherein the energy-sensitive material is provided in particulate form, and further wherein the electromagnetic energy-sensitive material particulates are located within the heat-relaxable material of the substrate.  
     
     
         20 . A heat-relaxable array comprising: 
 a substrate comprising heat-relaxable material;    reactants affixed to the substrate; and    electromagnetic energy sensitive material comprising Curie point material in thermal communication with the heat-relaxable material.    
     
     
         21 . The array of  claim 20 , wherein the electromagnetic energy sensitive material is in contact with the substrate.  
     
     
         22 . The array of  claim 20 , wherein the electromagnetic energy sensitive material is on the substrate.  
     
     
         23 . The array of  claim 22 , wherein the substrate comprises first and second major surfaces, and further wherein the electromagnetic energy sensitive material contacts substantially all of at least one of the first and second major surfaces.  
     
     
         24 . The array of  claim 20 , further comprising a coating of linking agents on the substrate.  
     
     
         25 . The array of  claim 24 , wherein the Curie point material is located within the linking agent coating.  
     
     
         26 . The array of  claim 20 , wherein the electromagnetic energy sensitive material is provided in particulate form, and further wherein electromagnetic energy sensitive material is located within the heat-relaxable material of the substrate.  
     
     
         27 . An apparatus for relaxing a heat-relaxable substrate, the apparatus comprising: 
 a first surface;    a second surface opposed to and spaced from the first surface; and    electromagnetic energy sensitive material in thermal communication with the first surface, whereby heating of the electromagnetic energy sensitive material by electromagnetic energy increases the temperature of the first surface.    
     
     
         28 . The apparatus of  claim 27 , wherein the first surface comprises the electromagnetic energy sensitive material.  
     
     
         29 . The apparatus of  claim 27 , wherein the electromagnetic energy sensitive material is provided in particulate form, and further wherein the first surface comprises particles of the electromagnetic energy sensitive material.  
     
     
         30 . The apparatus of  claim 27 , wherein the first and second surfaces comprise the electromagnetic energy sensitive material.  
     
     
         31 . The apparatus of  claim 30 , wherein the electromagnetic energy sensitive material is provided in particulate form, and further wherein the second surface comprises particles of the electromagnetic energy sensitive material.  
     
     
         32 . The apparatus of  claim 27 , wherein the electromagnetic energy sensitive material comprises Curie point material.  
     
     
         33 . The apparatus of  claim 32 , further comprising an electrically conductive ground plane proximate the electromagnetic energy sensitive material.  
     
     
         34 . The apparatus of  claim 27 , further comprising a spacing mechanism spacing the first surface from the second surface.  
     
     
         35 . The apparatus of  claim 34 , wherein the spacing mechanism comprises an adjustable spacing mechanism, wherein spacing between the first and second surfaces can be adjusted.  
     
     
         36 . The apparatus of  claim 34 , wherein the spacing mechanism comprises at least one shim.  
     
     
         37 . The apparatus of  claim 27 , wherein the first and second surfaces comprise a low surface energy material.  
     
     
         38 . An article for use in manufacturing an array, the article comprising: 
 a substrate comprising heat-relaxable material; and    electromagnetic energy sensitive material comprising Curie point material in thermal communication with the heat-relaxable material.    
     
     
         39 . The article of  claim 38  further comprising linking agents.  
     
     
         40 . The article of  claim 39  further comprising reactants affixed to said substrate.  
     
     
         41 . The article of  claim 38 , wherein the electromagnetic energy sensitive material is in contact with the substrate.  
     
     
         42 . The article of  claim 38 , wherein the electromagnetic energy sensitive material is on the substrate.  
     
     
         43 . The article of  claim 38 , wherein the substrate comprises first and second major surfaces, and further wherein the electromagnetic energy sensitive material contacts substantially all of at least one of the first and second major surfaces.  
     
     
         44 . The article of  claim 39  wherein said linking agents are coated on said substrate.  
     
     
         45 . The article of  claim 44 , wherein the Curie point material is located within the linking agent coating.  
     
     
         46 . The article of  claim 38 , wherein the electromagnetic energy sensitive material is provided in particulate form, and further wherein electromagnetic energy sensitive material is located within the heat-relaxable material of the substrate.