Resin-sealed type semiconductor device

Abstract

A semiconductor device includes (a) a printed wiring board, (b) a semiconductor chip mounted on the printed wiring board, (c) a molded resin formed on the printed wiring board, covering the semiconductor chip therewith, and (d) at least one metal wiring formed on the printed wiring board and extending externally beyond the molded resin. The metal wiring is plated with a metal having a small adhesion force with the molded resin. An interfacial surface between the metal and the molded resin acts as a path through which moisture contained in the semiconductor device escapes outside when the semiconductor device is heated.

What is claimed is:  
     
         1 . A semiconductor device comprising: 
 (a) a printed wiring board;    (b) a semiconductor chip mounted on said printed wiring board;    (c) a molded resin formed on said printed wiring board, covering said semiconductor chip therewith; and    (d) at least one metal wiring formed on said printed wiring board and extending externally beyond said molded resin, said metal wiring being plated with a metal having a small adhesion force with said molded resin,    wherein an interfacial surface between said metal and said molded resin acts as a path through which moisture contained in said semiconductor device escapes outside when said semiconductor device is heated.    
     
     
         2 . The semiconductor device as set forth in  claim 1 , further comprising a solder resist formed in an area other than an area plated with said metal.  
     
     
         3 . The semiconductor device as set forth in  claim 1 , wherein said metal is a noble metal.  
     
     
         4 . The semiconductor device as set forth in  claim 3 , wherein said metal is gold, platinum or palladium.  
     
     
         5 . The semiconductor device as set forth in  claim 1 , wherein said molded resin is a transparent resin.  
     
     
         6 . A semiconductor device comprising: 
 (a) a printed wiring board;    (b) a semiconductor chip mounted on said printed wiring board; and    (c) a molded resin formed on said printed wiring board, covering said semiconductor chip therewith,    wherein said printed wiring board is formed with at least one through-hole,    said through-hole is filled with said molded resin or another resin with said through-hole being plated at an inner wall thereof with a metal having a small adhesion force with said molded resin or said another resin, and    an interfacial surface between said metal and said molded resin or said another resin acts as a path through which moisture contained in said semiconductor device escapes outside when said semiconductor device is heated.    
     
     
         7 . The semiconductor device as set forth in  claim 6 , further comprising a solder resist formed in an area other than an area plated with said metal.  
     
     
         8 . The semiconductor device as set forth in  claim 6 , wherein said metal is a noble metal.  
     
     
         9 . The semiconductor device as set forth in  claim 8 , wherein said metal is gold, platinum or palladium.  
     
     
         10 . The semiconductor device as set forth in  claim 6 , wherein said molded resin is a transparent resin.  
     
     
         11 . A semiconductor device comprising: 
 (a) a printed wiring board;    (b) a semiconductor chip mounted on said printed wiring board; and    (c) a molded resin formed on said printed wiring board, covering said semiconductor chip therewith,    wherein said printed wiring board has a first area in which a solder resist is not formed,    said first area is formed such that a metal wiring formed in the first area and plated with a metal extends externally beyond said molded resin, and    an interfacial surface between said metal wiring and said molded resin acts as a path through which moisture contained in said semiconductor device escapes outside when said semiconductor device is heated.    
     
     
         12 . A semiconductor device comprising: 
 (a) a printed wiring board;    (b) a semiconductor chip mounted on said printed wiring board;    (c) a molded resin formed on said printed wiring board, covering said semiconductor chip therewith; and    (d) at least one metal wiring formed on said printed wiring board and extending externally beyond said molded resin, said metal wiring being plated with a first metal having a small adhesion force with said molded resin,    wherein said printed wiring board is formed with at least one through-hole,    said through-hole is filled with said molded resin dr another resin with said through-hole being plated at an inner wall thereof with a second metal having a small adhesion force with said molded resin or said another resin, and    an interfacial surface between said first metal and said molded resin and an interfacial surface between said second metal and said molded resin or said another resin act as paths through which moisture contained in said semiconductor device escapes outside when said semiconductor device is heated.    
     
     
         13 . A semiconductor device comprising: 
 (a) a printed wiring board;    (b) a semiconductor chip mounted on said printed wiring board; and    (c) a molded resin formed on said printed wiring board, covering said semiconductor chip therewith,    wherein said printed wiring board has a first area in which a solder resist is not formed,    said first area is formed such that a metal wiring formed in the first area and plated with a metal extends externally beyond said molded resin,    said printed wiring board is formed with at least one through-hole,    said through-hole is filled with said molded resin or another resin with said through-hole being plated at an inner wall thereof with a second metal having a small adhesion force with said molded resin or said another resin, and    an interfacial surface between said metal and said molded resin and an interfacial surface between said second metal and said molded resin or said another resin act as paths through which moisture contained in said semiconductor device escapes outside when said semiconductor device is heated.