Package for semiconductor photoelectric device

Abstract

An optoelectronic device is placed in a through hole of an upper substrate and mounted on a lower substrate, which is stacked under the upper substrate. The through hole forms a focusing cup for the optoelectronic device. A metallic base plate can be inserted between the optoelectronic device and the lower substrate to enhance light reflection and heat removal. The through hole can be lined with metallic coating to enhance light reflection.

1 . A package for semiconductor photoelectric device, comprising: 
 a semiconductor photoelectric device having a semiconductor body, two electrodes and a top surface;    at least one of said electrodes being located at the top surface; and    a transparent cover pressing against said top surface,    said transparent cover having a bottom surface printed with underlying electrical wiring for circuit interconnection and bonding pads to contact electrically said electrodes at said top surface.    
     
     
         2 . A package as described in  claim 1 , further comprising a substrate over which said semiconductor photoelectric device presses.  
     
     
         3 . A package as described in  claim 1 , wherein second one of said electrodes is located at the bottom of said semiconductor body.  
     
     
         4 . A package as described in  claim 2 , wherein said substrate has second printed circuit wiring to contact the second one of said electrodes.  
     
     
         5 . A package as described in  claim 4 , wherein said second printed circuit wiring has at least a contact pad to contact the second one of said electrodes.  
     
     
         6 . A package as described in  claim 1 , wherein transparent cover is made of material selected from the group consisting of: glass, quartz, sapphire, plastic, mica, resin, Teflon, and fiber.  
     
     
         7 . A package as described in  claim 1 , wherein both said electrodes are located at the top surface of said semiconductor photoelectric device.  
     
     
         8 . A package as described in  claim 7 , wherein said first printed wiring has pads to contact both said electrodes.  
     
     
         9 . A package as described in  claim 1 , wherein said photoelectric semiconductor device is a light emitting diode.  
     
     
         10 . A package as described in  claim 1 , wherein said semiconductor photoelectric device is a laser diode..  
     
     
         11 . A package as described in  claim 1 , wherein said semiconductor photoelectric device is an image sensor.  
     
     
         12 . A package as described in claim, wherein said semiconductor photoelectric device is a photo-diode.  
     
     
         13 . A package as described in  claim 1 , wherein a plurality of said semiconductor photoelectric devices are sandwiched between said transparent and said substrate.  
     
     
         14 . A package as described in  claim 13 , wherein said substrate serves as a motherboard.