Device for attaching a semiconductor chip to a chip carrier

Abstract

Device for attaching a semiconductor chip to a chip carrier In a device for attaching a semiconductor chip ( 10 ) to a chip carrier ( 12 ), thereby producing an electrically conducting connection between contact areas ( 22, 24 ) arranged on a surface of the semiconductor chip ( 10 ) and contact areas ( 26, 28 ) on the chip carrier ( 12 ) by means of an anisotropically conducting film ( 16 ) or an anisotropically conducting paste ( 16 ), a pressure die ( 18 ) is used for the application of the pressure to the chip ( 10 ) with an adjustable pressing force against the chip carrier ( 12 ). A counter-pressure support ( 14 ) accepts the chip carrier ( 12 ) with the semiconductor chip ( 10 ) arranged on it with the interposition of the anisotropically conducting film ( 16 ) or the anisotropically conducting paste ( 16 ). An elastic body ( 20 ) is arranged either between the pressure die ( 14 ) and the semiconductor chip ( 10 ) or between the chip carrier ( 12 ) and the counter-pressure support ( 14 ).

1 . Device for attaching a semiconductor chip to a chip carrier, thereby producing an electrically conducting connection between contact areas arranged on a surface of the semiconductor chip and contact areas on the chip carrier by means of an anisotropically conducting film ( 16 ) or an anisotropically conducting paste ( 16 ), characterized by a pressure die ( 18 ) for the application of the pressure to the chip ( 10 ) with an adjustable pressing force against the chip carrier ( 12 ), a counter-pressure support ( 14 ), for receiving the chip carrier ( 12 ) with the semiconductor chip ( 10 ) arranged on it with the interposition of the anisotropically conducting film ( 16 ) or the anisotropically conducting paste ( 16 ), and an elastic body ( 20 ;  34 ;  36 ) arranged either between the pressure die ( 14 ) and the semiconductor chip ( 10 ) or between the chip carrier ( 12 ) and the counter-pressure support ( 14 ).  
     
     
         2 . Device according to  claim 1 , whereby the elastic body ( 20 ) is fitted to the face of the pressure die ( 18 ).  
     
     
         3 . Device according to  claim 1 , whereby the elastic body ( 36 ) is fitted to the surface of the counter-pressure support ( 14 ) which is to receive the chip carrier ( 12 ).  
     
     
         4 . Device according to  claim 1 , whereby the elastic body ( 34 ) is a band extending between the face of the pressure die ( 18 ) and the surface of the semiconductor chip ( 10 ).  
     
     
         5 . Device according to any one of the previous claims, whereby the counter-pressure support ( 14 ) is heated.  
     
     
         6 . Device according to any one of the previous claims, whereby the elastic body consists of heat-resistant silicone.