Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface

Abstract

A plurality of chips are mounted on a substrate, coupling portions between the chips and the substrate are sealed, the chips have rear surfaces thereof collectively polished, and the substrate with the chips thereon are separated into independent semiconductor devices.

What is claimed is:  
     
         1 . A semiconductor device having a thin semiconductor element mounted thereon, the semiconductor element being obtained by mounting a plurality of semiconductor elements on a substrate, polishing rear surfaces of the semiconductor elements after sealing coupling portions, and separating the substrate with the semiconductor elements thereon into independent semiconductor devices.  
     
     
         2 . The semiconductor device according to  claim 1 , wherein a reinforcing plate is fixed on the substrate, and the substrate with the semiconductor elements thereon are separated into the independent semiconductor devices after assembly.  
     
     
         3 . The semiconductor device according to  claim 1 , wherein a reinforcing plate is fixed on the substrate, the reinforcing plate comprising a metallic plate and a wiring plate in layered fashion, and conduction is made between the wiring plate and wiring on the substrate.  
     
     
         4 . A semiconductor device having thin semiconductors element mounted thereon, the semiconductor elements being obtained by mounting a plurality of semiconductor elements, sealing the semiconductor elements, providing a laminate on rear surfaces of the semiconductor elements to form a wiring layer with the semiconductor elements included therein after polishing the rear surfaces of the semiconductor elements, and wiring, followed by repeating the same step.