Circuit assembly for battery pack or the like, and method of making the same

Abstract

A circuit assembly includes a first substrate formed with a first wiring pattern, a second substrate formed with a second wiring pattern, and a joint member for electrically and/or mechanically connecting the first substrate to the second substrate. The joint member includes a set of separated leads extending generally parallel to each other, and a first and a second retainers transversely connecting the leads to each other. The first and the second retainers are formed by molding a resin so that they are integral with the leads by allowing the molding resin to enter the spaces between the leads.

1 . A circuit assembly comprising: 
 a first substrate formed with a first wiring pattern;    a second substrate formed with a second wiring pattern; and    a joint member for electrically and/or mechanically connecting the first and the second substrates;    wherein the joint member includes a set of separated leads extending generally parallel to each other, and a retainer transversely connecting the leads to each other; and    wherein the retainer is formed by molding a resin so as to be integral with the leads, part of the molding resin filling spaces between the leads.    
     
     
         2 . The circuit assembly according to  claim 1 , wherein the set of leads are bent at a position avoiding the retainer.  
     
     
         3 . A circuit assembly comprising: 
 a first substrate formed with a first wiring pattern;    a second substrate formed with a second wiring pattern; and    a joint member for electrically and/or mechanically connecting the first and the second substrates;    wherein the joint member includes a set of separated leads extending generally parallel to each other, and a first and a second retainers for transversely connecting the leads to each other; and    wherein each of the first and the second retainers is formed by molding a resin so as to be integral with the leads, the molding resin filling spaces between the leads.    
     
     
         4 . The circuit assembly according to  claim 3 , wherein the set of leads are bent between the first retainer and the second retainer.  
     
     
         5 . The circuit assembly according to  claim 3 , wherein the first retainer is arranged adjacent to the first substrate, the second retainer being arranged adjacent to the second substrate.  
     
     
         6 . The circuit assembly according to  claim 3 , wherein the joint member further includes insulating tapes sandwiching the set of leads from above and below between the first retainer and the second retainer.  
     
     
         7 . A battery pack comprising: 
 a housing for accommodating a set of batteries; and    a circuit assembly accommodated in the housing at a corner of the housing, the circuit assembly including a first substrate formed with a first wiring pattern, a second substrate formed with a second wiring pattern, and a joint member for electrically and/or mechanically connecting the first and the second substrates;    wherein the joint member includes a set of separated leads extending generally parallel to each other, and a retainer transversely connecting the leads to each other; and    wherein the retainer is formed by molding a resin so as to be integral with the leads, the molding resin filling spaces between the leads.    
     
     
         8 . A battery pack comprising: 
 a housing for accommodating a set of batteries; and a circuit assembly accommodated in the housing at a corner thereof, the circuit assembly including a first substrate formed with a first wiring pattern, a second substrate formed with a second wiring pattern, and a joint member for electrically and/or mechanically connecting the first and the second substrates;    wherein the joint member includes a set of separated leads extending generally parallel to each other, and a first and a second retainers transversely connecting the leads to each other; and    wherein each of the first and the second retainers is formed by molding a resin so as to be integral with the leads, the molding resin filling spaces between the leads.    
     
     
         9 . The circuit assembly according to  claim 8 , wherein the set of leads are bent between the first retainer and the second retainer.  
     
     
         10 . The circuit assembly according to  claim 8 , wherein the first retainer is arranged adjacent to the first substrate, the second retainer being arranged adjacent to the second substrate.  
     
     
         11 . The circuit assembly according to  claim 8 , wherein the joint member further includes insulating tapes sandwiching the set of leads from above and below between the first retainer and the second retainer.  
     
     
         12 . The circuit assembly according to  claim 11 , wherein said corner of the housing has an inner surface formed with fixing grooves for fixing the first retainer and the second retainer of the joint member.  
     
     
         13 . A method of making a circuit assembly comprising the steps of: making a bendable joint member; and electrically and/or mechanically connecting a first substrate to a second substrate with the joint member; 
 wherein in the joint member making step a resin material is injected into a mold in which an elongated conductor frame including plural sets of leads is inserted, so that a retainer is formed to be integral with the leads and extends longitudinally of the conductor frame across the plural sets of leads; and    wherein each set of the leads is cut from the conductor frame after the resin material hardens, the retainer being also cut from the conductor frame for the respective sets of leads.