Method for manufacturing a semiconductor device and a plating apparatus and a sputtering apparatus therefor

Abstract

An apparatus for plating a substrate includes plural plating baths that are each separately provided with (a) an individual temperature adjuster that includes a heater, a cooling jacket, and a temperature controller, or (b) an individual pressure application device for distorting the substrate.

What is claimed:  
     
         1 . A sputtering apparatus comprising a chamber equipped with an exhaust system; a target placed in a given position in the chamber; an electrode generating sputter discharge for sputtering the target; and a substrate holder for retaining a substrate to be treated facing and parallel to the target, the substrate holder having a means for distorting the substrate.  
     
     
         2 . A sputtering apparatus as claimed in  claim 1 , where the means for distorting the substrate to be treated is a pressing means for applying pressure to the substrate on its rear face and the pressing means applies a pressure to the center of the substrate different from that to its side.