Interlayer dielectric film

Abstract

An interlayer dielectric film is made from an organic/inorganic hybrid film. The organic/inorganic hybrid film has a main chain in which a first site of siloxane and a second site of an organic molecule are alternately bonded to each other.

What is claimed is:  
     
         1 . An interlayer dielectric film comprising an organic/inorganic hybrid film having a main chain in which a first site of siloxane and a second site of an organic molecule are alternately bonded to each other.  
     
     
         2 . The interlayer dielectric film of  claim 1 , 
 wherein pores are dispersed in said organic/inorganic hybrid film.    
     
     
         3 . The interlayer dielectric film of  claim 1 , 
 wherein said first site is represented by the following general formula (1):                          wherein R 1 , R 2  and R 3  are an oxygen atom or an organic group.    
     
     
         4 . The interlayer dielectric film of  claim 1 , 
 wherein said first site is represented by the following general formula (2):                          wherein R is an organic group; and R 1  and R 2  are an oxygen atom or an organic group, which is selected from the group consisting of an alkyl group, an aryl group and an aryl group    
     
     
         5 . The interlayer dielectric film of  claim 1 , 
 wherein said second site is polyimide, polyamide, polyimidazole, polyoxazole, polyphenylene, polyarylene, polyaryl ether, polyalkane or a fluorinated polymer of any of these polymers.    
     
     
         6 . An interlayer dielectric film comprising an organic/inorganic hybrid film composed of a plurality of first sites of siloxane and a plurality of second sites of an organic molecule, 
 wherein said first sites are bonded to said second sites alone and said second sites are bonded to said first sites alone.    
     
     
         7 . The interlayer dielectric film of  claim 6 , 
 wherein pores are dispersed in said organic/inorganic hybrid film.    
     
     
         8 . The interlayer dielectric film of  claim 6 , 
 wherein each of said plurality of first sites is represented by the following general formula (1):                          wherein R 1 , R 2  and R 3  are an oxygen atom or an organic group.    
     
     
         9 . The interlayer dielectric film of  claim 6 , 
 wherein each of said plurality of first sites is represented by the following general formula (2):                          wherein R is an organic group; and R 1  and R 2  are an oxygen atom or an organic group, which is selected from the group consisting of an alkyl group, an aryl group and an aryl group.    
     
     
         10 . The interlayer dielectric film of  claim 6 , 
 wherein each of said plurality of second sites is polyimide, polyamide, polyimidazole, polyoxazole, polyphenylene, polyarylene, polyaryl ether, polyalkane or a fluorinated polymer of any of these polymers.    
     
     
         11 . An interlayer dielectric film comprising an organic/inorganic hybrid film composed of a plurality of first sites of siloxane and a plurality of second sites of an organic molecule, 
 wherein each of said plurality of first sites is surrounded with said plurality of second sites.    
     
     
         12 . The interlayer dielectric film of  claim 11 , 
 wherein pores are dispersed in said organic/inorganic hybrid film.    
     
     
         13 . The interlayer dielectric film of  claim 11 , 
 wherein each of said plurality of first sites is represented by the following general formula (1):                          wherein R 1 , R 2  and R 3  are an oxygen atom or an organic group.    
     
     
         14 . The interlayer dielectric film of  claim 11 , 
 wherein each of said plurality of first sites is represented by the following general formula (2):                          wherein R is an organic group; and R 1  and R 2  are an oxygen atom or an organic group, which is selected from the group consisting of an alkyl group, an aryl group and an aryl group.    
     
     
         15 . The interlayer dielectric film of  claim 11 , 
 wherein each of said plurality of second sites is polyimide, polyamide, polyimidazole, polyoxazole, polyphenylene, polyarylene, polyaryl ether, polyalkane or a fluorinated polymer of any of these polymers.    
     
     
         16 . An interlayer dielectric film comprising an organic/inorganic hybrid film composed of a plurality of first sites of siloxane and a plurality of second sites of an organic molecule, 
 wherein each of said plurality of second sites is surrounded with said plurality of first sites.    
     
     
         17 . The interlayer dielectric film of  claim 16 , 
 wherein pores are dispersed in said organic/inorganic hybrid film.    
     
     
         18 . The interlayer dielectric film of  claim 16 , 
 wherein each of said plurality of first sites is represented by the following general formula (1):                          wherein R 1 , R 2  and R 3  are an oxygen atom or an organic group.    
     
     
         19 . The interlayer dielectric film of  claim 16 , 
 wherein each of said plurality of first sites is represented by the following general formula (2):                          wherein R is an organic group; and R 1  and R 2  are an oxygen atom or an organic group, which is selected from the group consisting of an alkyl group, an aryl group and an aryl group.    
     
     
         20 . The interlayer dielectric film of  claim 16 , 
 wherein each of said plurality of second sites is polyimide, polyamide, polyimidazole, polyoxazole, polyphenylene, polyarylene, polyaryl ether, polyalkane or a fluorinated polymer of any of these polymers.    
     
     
         21 . An interlayer dielectric film comprising a plurality of first sites of siloxane and a plurality of second sites of an organic molecule, 
 wherein said plurality of second sites together form an organic polymer film, and    said plurality of first sites are dispersed in said organic polymer film.    
     
     
         22 . The interlayer dielectric film of  claim 21 , 
 wherein a largest distance between said plurality of first sites is smaller than a distance between a pair of copper interconnects disposed with said organic polymer film sandwiched therebetween.    
     
     
         23 . The interlayer dielectric film of  claim 21 , 
 wherein pores are dispersed in said organic polymer film.    
     
     
         24 . The interlayer dielectric film of  claim 21 , 
 wherein each of said plurality of first sites is represented by the following general formula (1):                          wherein R 1 , R 2  and R 3  are an oxygen atom or an organic group.    
     
     
         25 . The interlayer dielectric film of  claim 21 , 
 wherein each of said plurality of first sites is represented by the following general formula (2):                          wherein R is an organic group; and R 1  and R 2  are an oxygen atom or an organic group, which is selected from the group consisting of an alkyl group, an aryl group and an aryl group.    
     
     
         26 . The interlayer dielectric film of  claim 21 , 
 wherein each of said plurality of second sites is polyimide, polyamide, polyimidazole, polyoxazole, polyphenylene, polyarylene, polyaryl ether, polyalkane or a fluorinated polymer of any of these polymers.    
     
     
         27 . An interlayer dielectric film comprising a multi-layer film in which a first layer of siloxane and a second layer of an organic molecule are alternately stacked on each other.