US2003003012A1PendingUtilityA1

Tin-silver soldering alloy

Assignee: MITSUI MINING & SMELTING COPriority: Mar 19, 2001Filed: Jan 17, 2002Published: Jan 2, 2003

Est. expiryMar 19, 2021(expired)· nominal 20-yr term from priority

Inventors:Yuunosuke Nakahara Ryuuji Ninomiya

B23K 35/262C22C 13/02

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References

Claims

Abstract

A tin—silver soldering alloy comprising 3 to 4% by weight of silver, 5 to 10% by weight of bismuth, 0 to 5% by weight of indium, and 0.1 to 1.5% by weight of zinc, with the balance being tin.

Claims

exact text as granted — not AI-modified

What is claimed is:  
     
         1 . A tin—silver soldering alloy comprising 3 to 4% by weight of silver, 5 to 10% by weight of bismuth, and 0.1 to 1.5% by weight of zinc, with the balance being tin.  
     
     
         2 . A tin—silver soldering alloy comprising 3 to 4% by weight of silver, 5 to 10% by weight of bismuth, 5% by weight or less of indium, and 0.1 to 1.5% by weight of zinc, with the balance being tin.

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