Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

Abstract

A semiconductor device is disclosed which includes a tub ( 5 ) for use in supporting a semiconductor chip ( 8 ), a seal section ( 12 ) as formed by sealing the semiconductor chip ( 8 ) with a resin material, more than one tub suspension lead ( 4 ) for support of the tub ( 5 ), a plurality of electrical leads ( 2 ) which have a to-be-connected portion as exposed to outer periphery on the back surface of the seal section ( 12 ) and a thickness reduced portion as formed to be thinner than said to-be-connected portion and which are provided with an inner groove ( 2 e ) and outer groove ( 2 f ) in a wire bonding surface ( 2 d ) as disposed within the seal section ( 12 ) of said to-be-connected portion, and wires ( 10 ) for electrical connection between the leads ( 2 ) and pads ( 7 ) of the semiconductor chip ( 8 ), wherein said thickness reduced portion of the leads ( 2 ) is covered by or coated with a sealing resin material while causing the wires ( 10 ) to be contacted with said to-be-connected portion at specified part lying midway between the outer groove ( 2 f ) and inner groove ( 2 e ) to thereby permit said thickness reduced portion of leads ( 2 ) and the outer groove ( 2 f ) plus the inner groove ( 2 e ) to prevent occurrence of any accidental lead drop-down detachment.

What is claimed is:  
     
         1 . A semiconductor device comprising a tub supported by a plurality of suspension leads, a plurality of leads disposed to surround periphery of said tub, a semiconductor chip mounted on one principal surface of said tub and electrically connected to one principal surface of said plurality of leads, and a sealing resin for sealing said plurality of leads and said semiconductor chip plus said tub, characterized in that a remaining principal surface opposite to said one principal surface of said plurality of leads is exposed from said sealing resin and that said tub is less in thickness than said plurality of leads.  
     
     
         2 . A semiconductor device comprising a tub supported by a plurality of suspension leads, a plurality of leads disposed to surround periphery of said tub, a semiconductor chip mounted on said tub and electrically connected to said plurality of leads, and a sealing resin for sealing said plurality of leads and said semiconductor chip plus said tub while causing said plurality of leads to be exposed on a lower surface side thereof, characterized in that said tub is thinner than said leads thereby permitting a lower surface side of said tub to be covered by said sealing resin.  
     
     
         3 . A semiconductor device comprising a semiconductor chip mounted over a tub, a sealing resin for sealing said tub and said semiconductor chip, and more than one lead being electrically connected to said semiconductor chip and partly exposed from said sealing resin, characterized in that said tub is formed to be thinner than said lead.  
     
     
         4 . The semiconductor device as recited in  claim 1 , characterized in that said leads are flat.  
     
     
         5 . The semiconductor device as recited in  claim 1 , characterized in that said tub is formed by a half etching technique to be thin.  
     
     
         6 . The semiconductor device as recited in  claim 1 , characterized in that said tub is formed by a coining process to be thin.  
     
     
         7 . A semiconductor device comprising a semiconductor chip mounted over a tub, a sealing resin for sealing said tub and said semiconductor chip, a lead being exposed from a lower surface of said sealing resin and electrically connected to said semiconductor chip, characterized in that said tub and a tub side end of said lead are formed to be thinner than a remaining end of said lead.  
     
     
         8 . The semiconductor device as recited in claim  1 , characterized in that a tub side end of said lead is formed to be thinner than a remaining end thereof.  
     
     
         9 . The semiconductor device as recited in  claim 7 , characterized in that said tub and the tub side end of said lead are formed by half etching to be thin.  
     
     
         10 . The semiconductor device as recited in  claim 7 , characterized in that said tub and the tub side end of said lead are formed by coining to be thin.  
     
     
         11 . The semiconductor device as recited in  claim 1 , characterized in that the leads exposed from said sealing resin are subjected to metallization using Pb—Sn or Sn—Ag or Sn—Zn or Pd-based materials.  
     
     
         12 . A method of manufacturing a semiconductor device comprising the steps of: 
 preparing a matrix lead frame including a plurality of lead frames each having a plurality of leads and a tub less in thickness than said plurality of leads plus a suspension lead for support of said tub;    performing die bonding for mounting a semiconductor chip on or over the tub of each said lead frame;    performing wire bonding for connection by wires between said semiconductor chip and the plurality of leads of said lead frame;    sealing with a sealing resin said lead frame and said semiconductor chip plus said wires to permit said plurality of leads to be exposed on a lower surface side thereof; and    cutting said matrix lead frame into a plurality of unitary lead portions at part-in close proximity to a seal region as sealed at said step of sealing with the sealing resin to thereby obtain a plurality of semiconductor devices.    
     
     
         13 . The method of manufacturing a semiconductor device as recited in  claim 12 , wherein the leads of said matrix lead frame are subject to external packaging processing.  
     
     
         14 . The method of manufacturing a semiconductor device as recited in  claim 13 , wherein said external packaging processing is a Pd metal plating process.  
     
     
         15 . A method of manufacturing a semiconductor device comprising the steps of: 
 preparing a matrix lead frame including a plurality of lead frames each having a plurality of leads and a tub less in thickness than said plurality of leads plus a suspension lead for support of said tub;    performing die bonding for mounting a semiconductor chip on or over the tub of each said lead frame;    performing wire bonding for connection by wires between said semiconductor chip and the plurality of leads of said lead frame;    sealing with a sealing resin said lead frame and said semiconductor chip plus said wires to permit said plurality of leads to be exposed on a lower surface side thereof;    applying external packaging to the plurality of leads as exposed from a seal region sealed at said step of sealing with a sealing resin; and    cutting said matrix lead frame into a plurality of unitary lead portions at part in close proximity to a seal region as sealed at said step of sealing with the sealing resin to thereby obtain a plurality of semiconductor devices.    
     
     
         16 . The method of manufacturing a semiconductor device as recited in  claim 12 , wherein said step of sealing with a sealing resin is done by a transfer molding method.  
     
     
         17 . The method of manufacturing a semiconductor device as recited in  claim 12 , wherein said step of cutting said matrix lead frame is done using a cutting metal mold structure.  
     
     
         18 . The method of manufacturing a semiconductor device as recited in  claim 12 , wherein said step of cutting said matrix lead frame is done using a dicing blade.  
     
     
         19 . The method of manufacturing a semiconductor device as recited in  claim 15 , wherein said step of applying external packaging is a-metal plating process using a Pb—Sn or Sn—Ag or Sn—Zn or Pd-based material.  
     
     
         20 . The semiconductor device as recited in  claim 1 , wherein the remaining principal surface of said lead is connected by a bonding material to a lead pattern on a mount substrate.  
     
     
         21 . A resin sealed semiconductor device comprising: 
 a tub for support of a semiconductor chip;    a seal section as formed by resin sealing of said semiconductor chip;    a plurality of tub suspension leads including a supporting portion for use in supporting said tub and an exposed portion as coupled thereto and exposed to a surface on a semiconductor device mount side surface of said seal section, said supporting portion being formed to be thinner than said exposed portion;    a plurality of leads disposed around said tub and exposed to said semiconductor device mount side surface of said seal section;    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads; and    said tub suspension leads being coupled together via said tub.    
     
     
         22 . The semiconductor device as recited in  claim 21 , wherein said exposed portion of said tub suspension leads is disposed at an end on said semiconductor device mount side surface of said seal section.  
     
     
         23 . The semiconductor device as recited in  claim 21 , wherein said supporting portion of said tub suspension leads is covered by a sealing resin while letting said exposed portion be disposed at outer is periphery of said semiconductor device mount side surface of said lead section with a chip support surface of said tub and chip mount side surfaces of said tub suspension leads being formed on an identical plane.  
     
     
         24 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip and being smaller than said semiconductor chip;    a seal section as formed by resin sealing of said semiconductor chip;    a supporting portion for support of said tub;    a plurality of leads disposed around said tub and exposed to a semiconductor device mount side surface of said seal section;    a connection member for connection between more than one surface electrode of said semiconductor chip and a corresponding one of said leads; and    said tub and said semiconductor chip being in contact with each other at an inside location relative to said surface electrode of said semiconductor chip.    
     
     
         25 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip;    a seal section as formed by resin sealing of said semiconductor chip;    a tub suspension lead for support of said tub;    a plurality of leads disposed around said tub and exposed to a semiconductor device mount side surface of said seal section, said leads having a thickness increased portion and a thickness reduced portion thinner than said thickness increased portion for formation of a step-like difference in a thickness direction; and    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads.    
     
     
         26 . The semiconductor device as recited in  claim 25 , wherein said thickness increased portion of said leads is exposed to outer periphery of said semiconductor device mount side surface of said seal section whereas said thickness reduced portion is covered by a sealing resin.  
     
     
         27 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip;    a seal section as formed by resin sealing of said semiconductor chip;    a plurality of tub suspension leads including a supporting portion for use in supporting said tub and an exposed portion as coupled thereto and exposed to a surface on a semiconductor device mount side surface of said seal section, said supporting portion being formed to be thinner than said exposed portion;    a plurality of leads disposed around said tub and exposed to said semiconductor device mount side surface of said seal section, said leads having a thickness increased portion and a thickness reduced portion thinner than said thickness increased portion for formation of a step-like difference in a thickness direction;    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads; and    said plurality of tub suspension leads being coupled together via said tub.    
     
     
         28 . The semiconductor device as recited in  claim 27 , wherein said exposed portion of said tub suspension leads is the same in thickness as said thickness increased portion.  
     
     
         29 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip;    a seal section as formed by resin sealing of said semiconductor chip;    a tub suspension lead for support of said tub;    a plurality of leads disposed around said tub and exposed to a semiconductor device mount side surface of said seal section; and    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads,    wherein said plurality of leads include a lead being disposed neighboring said tub suspension lead and having a distal end on a tub suspension lead side at which a cutaway portion is provided for formation of a gap extending along this between it and said tub suspension lead.    
     
     
         30 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip;    a seal section as formed by-resin sealing of said semiconductor chip;    a tub suspension lead for use in supporting said tub and having an exposed portion as exposed to an end of a semiconductor device mount side surface of said seal section;    a plurality of leads disposed around said tub and exposed to periphery of said semiconductor device mount surface side of said seal section;    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads; and    said exposed portion of said tub suspension lead being less than said to-be-connected portion in length along an elongate direction thereof.    
     
     
         31 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip;    a seal section as formed by resin sealing of said semiconductor chip;    a tub suspension lead for support of said tub;    a plurality of leads disposed around said tub, said leads having an extension portion as disposed in close proximity to said tub toward a specified part near a center of said tub and also a to-be-connected portion as exposed to outer periphery of a semiconductor device mount side surface of said seal section; and    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads, wherein 
 said extension portion at said leads is formed to be thinner than said to-be-connected portion and covered by a sealing resin while causing a groove to is be formed in a surface on an opposite side to an exposure side of said to-be-connected portion as disposed within said seal section.  
   
     
     
         32 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip;    a seal section as formed by resin sealing of said semiconductor chip;    a tub suspension lead for support of said tub;    a plurality of leads having a to-be-connected portion exposed to outer periphery of a semiconductor device mount side surface of said seal section and a thickness reduced portion as formed at said tub side end to be thinner than said to-be-connected portion while providing a groove in a surface on an opposite side to an exposure side of said to-be-connected portion as disposed within said seal section; and    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads, wherein 
 said thickness reduced portion of said leads is covered by a sealing resin while letting said connection member be in contact with said to-be-connected portion at an inside location relative to said groove.  
   
     
     
         33 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip;    a seal section as formed by resin sealing of said semiconductor chip;    a tub suspension lead for support of said tub;    a plurality of leads having a to-be-connected portion exposed to outer periphery of a semiconductor device mount side surface of said seal section and a thickness reduced portion as formed at said tub side end to be thinner than said to-be-connected portion while providing a groove in a surface on an opposite side to an exposure side of said to-be-connected portion as disposed within said seal section; and    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads, wherein 
 said thickness reduced portion of said leads is covered by a sealing resin while letting said connection member be in contact with said to-be-connected portion at an outside location relative to said groove.  
   
     
     
         34 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip;    a seal section as formed by resin sealing of said semiconductor chip;    a tub suspension lead for support of said tub;    a plurality of leads having a to-be-connected portion exposed to outer periphery of a semiconductor device mount side surface of said seal section and a thickness reduced portion as formed at said tub side end to be thinner than said to-be-connected portion while providing inner and outer grooves in a surface on an opposite side to an exposure side of said to-be-connected portion as disposed within said seal section; and    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads, wherein 
 said thickness reduced portion of said leads is covered by a sealing resin while-letting said connection member be in contact with said to-be-connected portion at a location lying midway between said outer groove and said inner groove.  
   
     
     
         35 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip;    a seal section as formed by resin sealing of said semiconductor chip;    a tub suspension lead for support of said tub;    a plurality of leads including a to-be-connected portion as exposed to outer periphery of a semiconductor device mount side surface of said seal section with a metallized layer and a groove being formed at a surface of said to-be-connected portion on an opposite side to an exposure side as disposed within said seal section; and    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads, wherein 
 said groove is capable of blocking metallization flowage during fabrication of said metallized layer.  
   
     
     
         36 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip;    a seal section as formed by-resin sealing of said semiconductor chip;    a tub suspension lead supporting said tub and including an exposed portion as exposed to an end of a semiconductor device mount side surface of said seal section and a thickness reduced portion linking between inside and outside of the outer periphery of said seal section;    a plurality of leads disposed around said tub, said leads having a to-be-connected portion as exposed to outer periphery of said semiconductor device mount side surface of said seal section; and    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads.    
     
     
         37 . A resin sealed semiconductor device comprising: 
 a tub supporting a semiconductor chip;    a seal section as formed by resin sealing of said semiconductor chip;    a tub suspension lead supporting said tub and including an exposed portion as exposed to an end of a semiconductor device mount side surface of said seal section and a groove bridging between inside and outside of the outer periphery of said seal section;    a plurality of leads disposed around said tub and including a to-be-connected portion as exposed to outer periphery of said semiconductor device mount side surface of said seal section; and    a connection member for connection between a surface electrode of said semiconductor chip and a corresponding one of said leads.    
     
     
         38 . The semiconductor device as recited in  claim 36 , wherein one of said thickness reduced portion and said groove is formed in an exposure side surface on an opposite side to a chip mount side of said tub suspension lead.  
     
     
         39 . The semiconductor device as recited in  claim 36 , wherein one of said thickness reduced portion and said groove is formed into an elliptical shape as elongated in an extending direction of said tub suspension lead.  
     
     
         40 . The semiconductor device as recited in  claim 36 , wherein in said tub suspension lead, one of said thickness reduced portion and said groove is surrounded by a side wall.  
     
     
         41 . A method of manufacturing a resin sealed semiconductor device comprising the steps of: 
 preparing a lead frame including a tub capable of supporting a semiconductor chip, a plurality of tub suspension leads having a support section for use in supporting said tub and an exposed portion coupled thereto with said support section being thinner than said exposed portion, and a plurality of leads as disposed around said tub;    adherently securing said tub and said semiconductor chip together;    using a connection member to connect a surface electrode of said semiconductor chip to a corresponding one of said leads;    forming a seal section by causing a sealing resin to flow onto an opposite surface to a chip support surface of said tub while covering a thickness reduced portion of said tub suspension lead with said sealing resin and then by disposing said plurality of leads and said exposed portion of said tub suspension lead on a semiconductor device mount side surface to thereby resin-mold said semiconductor chip; and    subdividing said tub suspension lead into portions at said exposed portion of said tub suspension lead while separating said plurality of leads from a frame body of said lead frame.    
     
     
         42 . A method of manufacturing a resin sealed semiconductor device comprising the steps of: 
 preparing a lead frame including a tub capable of supporting this chip, said tub being smaller than said semiconductor chip, a tub suspension lead having a support section for use in supporting said tub and an exposed portion coupled thereto with said support section being thinner than said exposed portion, and a plurality of leads as disposed around said tub;    adherently securing said tub and said semiconductor chip together at an inside location relative to a surface electrode of said semiconductor chip;    using a connection member to connect said surface electrode of said semiconductor chip to a corresponding one of said leads;    forming a seal section by causing a sealing resin to flow onto an opposite surface to a chip support surface of said tub while covering a thickness reduced portion of said tub suspension lead with said sealing resin and then by disposing said plurality of leads and said exposed portion of said tub suspension lead on a semiconductor device mount side surface to thereby resin-mold said semiconductor chip; and    subdividing said tub suspension lead into portions at said exposed portion of said tub suspension lead while separating said plurality of leads from a frame body of said lead frame.    
     
     
         43 . A method of manufacturing a resin sealed semiconductor device comprising the steps of: 
 preparing a lead frame including a tub capable of supporting a semiconductor chip, a tub suspension lead having a support section supporting said tub and an exposed portion coupled thereto, and a plurality of leads being disposed around said tub and having a thickness increased portion and a thickness reduced portion thinner than said thickness increased portion for formation of a step-like difference with respect to a thickness direction;    adhering said tub and said semiconductor chip together;    using a connection member to connect a surface electrode of said semiconductor chip to a corresponding one of said leads;    forming a seal section by causing a sealing resin to flow onto an opposite surface to a chip support surface of said tub while covering said thickness reduced portion of said leads and said support portion of said tub suspension lead with said sealing resin and then by disposing said thickness increased portion of said plurality of leads and said exposed portion of said tub suspension lead on a semiconductor device mount side surface at outer periphery thereof to thereby resin-mold said semiconductor chip; and    subdividing said tub suspension lead into portions at said exposed portion of said tub suspension lead while separating said plurality of leads from a frame body of said lead frame.    
     
     
         44 . A method of manufacturing a resin sealed semiconductor device comprising the steps of: 
 preparing a lead frame including a tub capable of supporting a semiconductor chip, a tub suspension lead supporting said tub, and a plurality of leads as disposed around said tub with inner and outer grooves being provided in a surface opposite to an exposure side of a to-be-connected portion;    adhering said tub and said semiconductor chip together;    using a connection member to connect a surface electrode of said semiconductor chip to a corresponding one of said leads at a location lying between said inner and outer grooves at said to-be-connected portion;    forming a seal section by causing a sealing resin to move onto an opposite surface to a chip support surface of said tub while disposing said plurality of leads on a semiconductor device mount side surface to thereby resin-mold said semiconductor chip; and    separating said tub suspension lead and said plurality of leads from a frame body of said lead frame.    
     
     
         45 . A method of manufacturing a resin sealed semiconductor device comprising the steps of: 
 preparing a lead frame including a tub capable of supporting a semiconductor chip, a tub suspension lead supporting said tub and having an exposed portion and a groove as defined therein, and a plurality of leads being disposed around said tub and having a to-be-connected portion as exposed to outer periphery of a semiconductor device mount side surface of a seal section;    adhering said tub and said semiconductor chip together;    using a connection member to connect a surface electrode of said semiconductor chip to a corresponding one of said leads;    forming said seal section by causing a sealing resin to move onto an opposite surface to a chip support surface of said tub while disposing on said semiconductor device mount side surface said plurality of leads and said exposed portion of said tub suspension lead to thereby resin-mold said semiconductor chip while letting said groove of said tub suspension lead corresponding to outer periphery of said seal section; and    subdividing said tub suspension lead into portions at said exposed portion of said tub suspension lead while separating said plurality of leads from a frame body of said lead frame.