Thermomechanical process for producing a planar resist structure

Abstract

In a thermomechanical process for planarizing a resist layer applied to a partly elevated carrier area, a resist structure, in particular an encapsulation for electronic components, is obtained. In this case, a dry resist sheet, formed of a composite of a temperature-resistant protective sheet and a photosensitive layer, is applied by its photosensitive layer to a surface of the carrier and the dry resist sheet is planarized under pressure and with heat. After which the photosensitive layer is exposed, and the protective sheet is removed and the photosensitive layer is developed.

1 . A thermomechanical process for producing a planar resist structure, which comprises the steps of: 
 providing a carrier having a surface and elevations disposed on the surface;    applying a dry resist sheet formed of a composite of a temperature-resistant protective sheet and a photosensitive layer to the surface of the carrier such that the photosensitive layer is applied to the surface of the carrier;    subjecting the dry resist sheet to pressure and heat resulting in the photosensitive layer being planarized;    exposing the photosensitive layer;    removing the temperature-resistant protective sheet; and    developing the photosensitive layer resulting in a developed photosensitive layer.    
     
     
         2 . The process according to  claim 1 , which comprises providing electronic components as the elevations formed on the carrier.  
     
     
         3 . The process according to  claim 1 , which comprises: 
 applying a photosensitive layer side of a further dry resist sheet, formed of a composite having a protective sheet and the photosensitive layer, to the developed photosensitive layer;    exposing the photosensitive layer of the further dry resist sheet;    removing the protective sheet of the further dry resist sheet; and    developing the photosensitive layer of the further dry resist sheet resulting in a further developed photosensitive layer.    
     
     
         4 . The process according to  claim 1 , which comprises applying a photosensitive layer side of a further dry resist sheet, formed of a composite of a protective sheet and the photosensitive layer, to the developed photosensitive layer; 
 drawing off the protective sheet of the further dry resist sheet; and    exposing and developing the photosensitive layer of the second dry resist sheet resulting in a further developed photosensitive layer.    
     
     
         5 . The process according to  claim 4 , which comprises curing the developed photosensitive layer and the further developed photosensitive layer.  
     
     
         6 . The process according to  claim 1 , which comprises disposing and compressing the dry resist sheet together with the carrier between hot plates.  
     
     
         7 . The process according to  claim 1 , which comprises using a polyester sheet as the temperature-resistant protective sheet.  
     
     
         8 . A thermomechanical process for producing a surface acoustic wave component, which comprises the steps of: 
 providing a wafer having a surface and elevations disposed on the surface;    applying a dry resist sheet formed of a composite of a temperature-resistant protective sheet and a photosensitive layer to the surface of the wafer such that the photosensitive layer is applied to the surface of the wafer;    subjecting the dry resist sheet to pressure and heat resulting in the photosensitive layer being planarized;    exposing the photosensitive layer;    removing the temperature-resistant protective sheet; and    developing the photosensitive layer resulting in a developed photosensitive layer.    
     
     
         9 . A thermomechanical process for producing a planar resist structure, which comprises the steps of: 
 providing a carrier having a surface and elevations disposed on the surface;    applying a dry resist sheet formed of a composite of a non-temperature-resistant protective sheet and a photosensitive layer to the surface of the carrier such that the photosensitive layer is applied to the surface of the carrier;    separating and removing the non-temperature-resistant protective sheet from the photosensitive layer;    applying a temperature-resistant separating sheet having a non-adhering layer on the photosensitive layer such that the non-adhering layer resides on the photosensitive layer;    subjecting the temperature-resistant separating sheet together with the photosensitive layer to pressure and heat such that the photosensitive layer is planarized;    removing the temperature-resistant separating sheet;    exposing the photosensitive layer; and    developing the photosensitive layer.    
     
     
         10 . The process according to  claim 9 , which comprises disposing and compressing the carrier coated with the photosensitive layer together with the temperature-resistant separating sheet, between hot plates.  
     
     
         11 . The process according to  claim 9 , which comprises using a polyolefin sheet as the non-temperature-resistant protective sheet.  
     
     
         12 . The process according to  claim 9 , which comprises forming the non-adhering layer of the temperature-resistance separating sheet from silicone.  
     
     
         13 . The process according to  claim 9 , which comprises forming the non-adhering layer of the temperature-resistance separating sheet from polytetrafluoroethylene (PTFE).