US2003000609A1PendingUtilityA1
Processes for producing articles with stress-free slit edges
Priority: Nov 30, 1998Filed: Aug 29, 2002Published: Jan 2, 2003
Est. expiryNov 30, 2018(expired)· nominal 20-yr term from priority
C22F 1/08C22F 1/02C22C 9/04C21D 9/561C21D 1/30C21D 1/74C22C 9/02
35
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
Processes for producing articles with stress-free edges which comprise slitting a copper or copper alloy sheet to provide strips of the copper material, heating the strips in a furnace at a temperature of 200-250° C. under a protective atmosphere, and cooling the strips to room temperature, the strips so produced being useful to make stamped articles.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A process for producing articles with stress-free slit edges, which method comprises slitting a copper-based sheet to produce strips of the copper-based material, heating the strips in a furnace under a protective atmosphere at a temperature of from about 200° C. to about 250° C. for a period of time to free the strip of stresses, and cooling the strips to room temperature.
2 . A process according to claim 1 wherein the copper-based sheet is copper or a copper alloy.
3 . A process according to claim 2 wherein the alloy is an alloy of copper and zinc or an alloy of copper and tin.
4 . A process according to claim 1 wherein the temperature is from about 200° C. to about 240° C.
5 . A process according to claim 1 wherein the heating is carried out for from one hour to ten hours.
6 . A process according to claim 1 wherein the heating is carried out for from about four hours to about eight hours.
7 . A process according to claim 1 wherein the protective atmosphere comprises an inert gas.
8 . A process according to claim 1 wherein the protective atmosphere comprises nitrogen.
9 . A process according to claim 1 wherein the protective atmosphere is a reducing atmosphere.
10 . A process according to claim 9 wherein the atmosphere contains from about one to about 30 percent by volume of hydrogen.
11 . A process according to claim 10 wherein the protective atmosphere contains from 70 to 99 percent by volume of nitrogen and the remainder of the atmosphere is hydrogen.
12 . A process according to claim 1 wherein the width of the strips is from about one-quarter inch to four inches.
13 . A process according to claim 1 wherein the width of the strips is from one to two inches.
14 . A process according to claim 1 wherein the sheet thickness is from 0.010 to 0.020 inches.
15 . An article prepared according to claim 1 .
16 . A copper strip that has been annealed under a protective atmosphere at a temperature between about 200° C. and 250° C. for one to ten hours and then stamped or cut into a desired shape, the copper strip after annealing stamping being essentially free of camber or twist.Join the waitlist — get patent alerts
Track US2003000609A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.