Transparent electromagnetic radiation shield material and method of producing the same

Abstract

A transparent electromagnetic radiation shield material includes a transparent base material, an optional transparent adhesive layer on the transparent base material, and a first black layer, a metallic layer and a second black layer of identical mesh pattern successively laminated in alignment on the transparent base material, directly or via the optional transparent adhesive layer, a portion of the second black layer being removed as required.

What is claimed is:  
     
         1 . A transparent electromagnetic radiation shield material comprising: 
 a transparent base material,    an optional transparent adhesive layer on the transparent base material, and    a first black layer, a metallic layer and a second black layer of identical mesh pattern successively laminated in alignment on the transparent base material, directly or via the optional transparent adhesive layer,    a portion of the second black layer being removed as required.    
     
     
         2 . A transparent electromagnetic radiation shield material according to  claim 1 , wherein the mesh pattern is a grid pattern of lines of a width of 50 μm or less, interval (opening width) of less than 200 μm and thickness of 50 μm or less.  
     
     
         3 . A transparent electromagnetic radiation shield material according to  claim 1 , wherein the first black layer and the second black layer are black metallic oxide layers.  
     
     
         4 . A method of producing a transparent electromagnetic radiation shield material comprising: 
 an optional step of forming an optional transparent adhesive layer on a transparent base material,    a step of successively forming on the transparent base material, directly or via the optional transparent adhesive layer, a first black layer selected from among a black resin layer, a black inorganic layer and a black metallic oxide layer, a metallic layer, and a second black layer selected from among a black resin layer, a black inorganic layer and a black metallic oxide layer,    a step of providing a mesh-like resist layer on the second black layer,    a step of removing portions of the first black layer, metallic layer and second black layer not protected by the resist layer by sand-blasting and/or dissolution with an etching solution to form a mesh pattern corresponding to the mesh-like resist layer, and    an optional step of peeling off the resist layer and/or coating the mesh-like pattern side (side opposite the transparent base material) with transparent resin.    
     
     
         5 . A method of producing a transparent electromagnetic radiation shield material according to  claim 4 , wherein the metallic layer is formed by direct electroplating on the first black layer having a surface resistance of 10 Ωor less.  
     
     
         6 . A method of producing a transparent electromagnetic radiation shield material according to  claim 4 , wherein the black metallic oxide layer is formed by one or a combination of two or more processes selected from among ion plating, sputtering, vacuum deposition, electroless plating and electroplating.  
     
     
         7 . A method of producing a transparent electromagnetic radiation shield material comprising: 
 a step of forming resist on a transparent base material in a reverse-mesh pattern,    a step of successively forming thereon (on the surface of the transparent base material portion and the resist portion) a first black layer, a metallic layer and a second black layer, and    a step of removing only the first black layer, metallic layer and second black layer on the resist portion surface by peeling off the resist (liftoff process).    
     
     
         8 . A method of producing a transparent electromagnetic radiation shield material according to  claim 7 , wherein the first black layer and the second black layer are black metallic oxide layers.  
     
     
         9 . A method of producing a transparent electromagnetic radiation shield material according to  claim 7 , wherein the total thickness (line thickness) of the first black layer, metallic layer and second black layer is 5 μm or less.