Conductive shape memory metal deployment latch hinge deployment method

Abstract

A conductive hinge is made of a superelastic shape memory alloy such as nitinol (NiTi) having a large elastic strain limit for enabling the hinge to bend to a small radius during stowage for flexible return to a trained rigid hinge position by training the shape memory alloy to assume a predetermined deployed configuration when released from a stowage configuration. The hinge is trained by forging at a temperature above a training temperature. The hinge is released to deploy solar cell panels as the hinges unfold to the forged trained deployed configuration.

What is claimed is:  
     
         1 . A method of forming a hinge for moving panels from a stowed position to a deploy position for forming a hinged surface of panels, the method comprising the steps of, 
 heating a shape memory alloy to above a crystal transition temperature,    deforming the shape memory alloy as the hinge when above the training temperature to train the shape memory alloy to the deployed position, the hinge being trained to return to the deployed position when release from the stowed position, and    cooling the shape memory alloy to below the crystal transition temperature.    
     
     
         2 . The method of  claim 1  wherein, 
 the deforming trains the hinge to return to the deployed position by unbending about a hinge axis, the hinge for bending about the hinge axis when placing the hinge in the stowed position, the hinge returning to the deployed position when release from the stowed position.  
 
     
     
         3 . The method of  claim 1  further comprising the steps of, 
 securing a proximal end of hinge to a first panel of the panels,  
 securing a distal end of the hinge to a second panel of the panels, and  
 bending the hinge to position the hinge and the first and second panels in the stowed position.  
 
     
     
         4 . The method of  claim 1  further comprising the steps of, 
 securing a proximal end of hinge to a first panel of the panels,  
 securing a distal end of the hinge to a second panel of the panels,  
 bending the hinge to position the hinge and the first and second panels in the stowed position, and  
 releasing the hinge to return the hinge to the deployed position for moving the panels to the deployed position for forming the hinged surface.  
 
     
     
         5 . The method of  claim 4  further comprising the step of, 
 deforming the shape memory alloy to above the training temperature to train the shape memory alloy to lock in the deployed position, the hinge being trained to unbend about a latch axis to lock the hinge into the deployed position for locking the panels in the deployed position.  
 
     
     
         6 . The method of  claim 4  further comprising the step of, 
 deforming the shape memory alloy to above the training temperature to train the shape memory alloy to lock in the deployed position, the hinge being trained to unbend about a latch axis to lock the hinge into the deployed position for locking the panels in the deployed position, the latch axis being orthogonal to the hinge axis.  
 
     
     
         7 . The method of  claim 4  wherein, 
 the panels are solar panels, and  
 the shape memory alloy is nitinol.  
 
     
     
         8 . The method of  claim 4  further comprising the step of, 
 plating the shape memory alloy to increase the conductivity of the shape memory alloy.  
 
     
     
         9 . A method of forming a hinged surface of panels, the method comprising the steps of, 
 forming hinges from a shape memory alloy, each of the hinges having a proximal end for securing to a first panel of the panels and a distal end for securing to a second panel of the panels,    heating each of the hinges to above a training temperature of the shape memory alloy,    deforming the hinges when above the training temperature to train the hinges to a deployed position, the hinges being trained to return to the deployed position when released from a stowed position, and    cooling the hinges to below the training temperature, and    securing the hinges to the panels, the panels forming the hinged surface when interconnected together by the hinges when in the deployed position.    
     
     
         10 . The method of  claim 9  wherein, 
 the shape memory alloy is conductive, and  
 the panels are solar panels,  
 the method further comprising the steps of,  
 interconnecting together the hinges for forming a power bus for conducting current from the solar panels.  
 
     
     
         11 . The method of  claim 9  further comprising the step of, 
 deforming the hinges when above the training temperature to train the hinges to unbend about a latch axis for locking the hinges into the deployed position for locking the panels into the deployed position.  
 
     
     
         12 . The method of  claim 9  further comprising the step of, 
 bending the hinges about a hinge axis for bending the hinges into a stowed position.  
 
     
     
         13 . The method of  claim 9  further comprising the step of, 
 bending the hinges about a hinge axis for bending the hinges into a stowed position, and  
 releasing the hinges for unbending about the hinge axis to return the hinges to the deployed position for deploying the panels to the deployed position for forming the hinged surface.  
 
     
     
         14 . The method of  claim 9  wherein, 
 the shape memory alloy is nitinol,  
 the panels are solar panels, and  
 the hinged surface is a solar cell array.  
 
     
     
         15 . The method of  claim 9  wherein, 
 the shape memory alloy is nitinol,  
 the panels are solar panels, and  
 the hinged surface is a powerbox.  
 
     
     
         16 . The method of  claim 9  wherein, 
 the shape memory alloy is nitinol,  
 the panels are solar panels, and  
 the hinged surface is a powersphere.