US2002189790A1PendingUtilityA1
Heat sink
Priority: Jun 15, 2001Filed: Jun 13, 2002Published: Dec 19, 2002
Est. expiryJun 15, 2021(expired)· nominal 20-yr term from priority
Inventors:Chee Wong
H10W 70/027H10W 40/226Y10T29/4935B23P 15/26F28F 3/022B23P 2700/10Y10T29/4913B21J 5/068
28
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A heat sink is manufactured by forming a fin 2 for dissipating heat by separating a length of material from a substrate 1 while leaving the proximal end attached to the substrate 1. The fins are cut from the substrate by stamping process using the stamping single or progressive die tooling cutting the substrate 1 along dotted line 16. The heat sink is a unitary construction, with the fins 2 being integrally formed with the substrate 1.
Claims
exact text as granted — not AI-modified1 . A method of forming a heat sink, including forming a fin for dissipating heat by separating a length of material from a substrate while leaving the proximal end attached to the substrate.
2 . A method according to claim 1 , wherein the fin is arcuate or planar.
3 . A method according to claim 1 or 2 , wherein the fin extends generally perpendicularly to the plane of the substrate.
4 . A method according to claim 1 , 2 or 3 , including forming a ridge in the surface of the substrate for engagement with a cutting tool to form the fin.
5 . A method according to claim 4 , wherein the ridge forms the distal end of the fin.
6 . A method according to any one of the preceding claims, wherein the fin is formed by single or progressive stamping processes by using the single or progressive die tooling.
7 . A method according to any one of the preceding claims, including forming a plurality of said fins on the substrate.
8 . A method according to claim 7 , wherein said plurality of said fins are formed in a series of spaced apart rows.
9 . A heat sink having a substrate and a plurality of fins for dissipating heat integrally formed therewith.
10 . A heat sink according to claim 9 , wherein each fin is a single layer of material extending from the substrate.
11 . A heat sink according to claim 9 or 10 , wherein the substrate comprises aluminium or copper.
12 . A method of forming a heat sink, substantially as hereinbefore described with reference to any one of or combination of the accompanying drawings.
13 . A heat sink substantially as hereinbefore described with reference to and/or substantially as illustrated in any one of or any combination of the accompanying drawings.Join the waitlist — get patent alerts
Track US2002189790A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.