Substrate treating method

Abstract

A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.

What is claimed is:  
     
         1 . A substrate treating method for performing predetermined treatment for a substrate coated with a coating solution, comprising the steps of: 
 (a) heating the substrate coated with the coating solution at a first predetermined temperature;    (b) lowering the temperature of the substrate by at least one of positively cooling the substrate and naturally releasing the heat thereof after said step (a); and    (c) heating the substrate at a second predetermined temperature after said step (b).    
     
     
         2 . The method as set forth in  claim 1 , 
 wherein a heat treatment temperature of the substrate in each of said steps (a) and (c) is set at a temperature which fulfills a condition of tha temperature in said step (a)≦the temperature in said step (c).    
     
     
         3 . The method as set forth in  claim 1 , 
 wherein said step (a) is performed before exposing the substrate and said step (c) is performed after exposing the substrate.    
     
     
         4 . The method as set forth in  claim 1 , 
 wherein treatment for drying the substrate while supplying gas thereto is performed for the substrate before said step (a) or between said step (a) and said step (c).    
     
     
         5 . The method as set forth in  claim 1 , 
 wherein drying treatment under reduced pressure is performed for the substrate before said step (a) or between said step (a) and said step (c).    
     
     
         6 . The method as set forth in  claim 1 , 
 wherein a coating film on the substrate is gelatinized before said step (a) or between said step (a) and said step (c).    
     
     
         7 . The method as set forth in  claim 1 , 
 wherein a solvent is coated on the substrate to exchange a solvent of the coating film before said step (a) or between said step (a) and said step (c).    
     
     
         8 . The method as set forth in  claim 1 , 
 wherein treatment for removing at least a part of a coating film formed on the substrate is performed before said step (a) or between said step (a) and said step (c).    
     
     
         9 . The method as set forth in  claim 1 , 
 wherein said step (a) and said step (c) are performed in the same treatment unit and are different from each other in space between a heating body and the substrate.    
     
     
         10 . A substrate treating method for performing predetermined treatment for substrates coated with a coating solution, comprising the steps of: 
 (a) heating the substrates coated with the coating solution one by one at a first predetermined temperature;    (b) lowering the temperature of the substrates by at least one of positively cooling the substrates and naturally releasing the heat thereof one by one after said step (a);    (c) heating the substrates one by one at a second predetermined temperature after said step (b);    (d) lowering the temperature of the substrates by at least one of positively cooling the substrates and naturally releasing the heat thereof one by one after said step (c); and    (e) heating the substrates one by one or plural substrates at a time at a third predetermined temperature after said step (d).    
     
     
         11 . The method as set forth in  claim 10 , 
 wherein a heat treatment temperature of the substrate in each of said heating steps (a), (c), and (e) is set at a temperature which fulfills each condition of a temperature in said step (a)≦a temperature in said step (c), and a temperature in said step (a)≦a temperature in said step (c)≦a temperature in said step (e).    
     
     
         12 . The method as set forth in  claim 10 , 
 wherein said step (a) is performed before exposing the substrate and said step (c) is performed after exposing the substrate.    
     
     
         13 . The method as set forth in  claim 10 , 
 wherein treatment for drying the substrate while supplying gas thereto is performed for the substrate before said step (a) or between said step (a) and said step (c).    
     
     
         14 . The method as set forth in  claim 10 , 
 wherein drying treatment under reduced pressure is performed for the substrate before said step (a) or between said step (a) and said step (c).    
     
     
         15 . The method as set forth in  claim 10 , 
 wherein a coating film on the substrate is gelatinized before said step (a) or between said step (a) and said step (c).    
     
     
         16 . The method as set forth in  claim 10 , 
 wherein a solvent is coated on the substrate to exchange a solvent of the coating film before said step (a) or between said step (a) and said step (c).    
     
     
         17 . The method as set forth in  claim 10 , 
 wherein treatment for removing at least a part of a coating film formed on the substrate is performed before said step (a) or between said step (a) and said step (c).    
     
     
         18 . The method as set forth in  claim 10 , 
 wherein said step (a) and said step (c) are performed in the same treatment unit and are different from each other in space between a heating body and the substrate.    
     
     
         19 . A substrate treating method for performing predetermined treatment for a substrate coated with a coating solution, comprising the steps of: 
 (a) heating the substrate coated with the coating solution; and    (b) putting the substrate in a non-heated state after said step (a), said steps (a) and (b) being repeated a plurality of times.    
     
     
         20 . The method as set forth in  claim 19 , 
 wherein when said steps are repeated a plurality of times, a treatment temperature in said heating step (a) is set in a higher range.    
     
     
         21 . The method as set forth in  claim 19 , 
 wherein treatment for drying the substrate while supplying gas thereto is performed for the substrate before said step (a) or between said step (a) and said step (b).    
     
     
         22 . The method as set forth in  claim 19 , 
 wherein drying treatment under reduced pressure is performed for the substrate before said step (a) or between said step (a) and said step (b).    
     
     
         23 . The method as set forth in  claim 19 , 
 wherein a coating film on the substrate is gelatinized before said step (a) or between said step (a) and said step (b).    
     
     
         24 . The method as set forth in  claim 19 , 
 wherein a solvent is coated on the substrate to exchange a solvent of the coating film before said step (a) or between said step (a) and said step (b).    
     
     
         25 . The method as set forth in  claim 19 , 
 wherein treatment for removing at least a part of a coating film formed on the substrate is performed before said step (a) or between said step (a) and said step (b).    
     
     
         26 . The method as set forth in  claim 19 , 
 wherein said repeated steps (a) are performed in the same treatment unit and are different from each other in space between a heating body and the substrate.    
     
     
         27 . The method as set forth in  claim 19 , further comprising the step of: 
 supplying a cleaning fluid to the substrate to be cleaned before and/or after said steps.