Desiccant containing product carrier

Abstract

Disclosed is a product carrier having a desiccant incorporated therein and a method for making the same. The inventive carrier reduces the number of steps required to package a semiconductor device.

What is claimed:  
     
         1 . A carrier for a semiconductor device, the carrier comprising: 
 a material containing a desiccant embedded therein; and    a holding region for the semiconductor device.    
     
     
         2 . The carrier of  claim 1 , wherein the desiccant is montmorillonite (bentonite) clay.  
     
     
         3 . The carrier of  claim 1 , wherein the material can withstand temperatures from about −125° C. to about 150° C.  
     
     
         4 . The carrier of  claim 1 , comprising: 
 at least two layers of material.    
     
     
         5 . The carrier of  claim 1 , wherein the material comprises about 5% to about 30% recycled materials.  
     
     
         6 . The carrier of  claim 1 , wherein the carrier is selected from the group consisting of a tube, a tray, a reel, and a jewel box.  
     
     
         7 . The carrier of  claim 1 , wherein the carrier is configured to accommodate a single semiconductor device.  
     
     
         8 . A method for manufacturing a carrier for a semiconductor device, the method comprising the steps of: 
 mixing a desiccant with molten plastic;    molding the mixture into a product carrier.    loading a device into the product carrier; and    dry packing the loaded product carrier in a bag.    
     
     
         9 . The method of  claim 8 , comprising: 
 mixing sufficient desiccant with the molten plastic such that the dry packed product carrier comprises from about 32 grams of desiccant to about 64 grams of desiccant.    
     
     
         10 . The method of  claim 8 , comprising: 
 mixing sufficient desiccant with the molten plastic such that an environment within the dry packed bag is maintained at no greater than about 20 percent relative humidity for about 12 months.    
     
     
         11 . The method of  claim 8 , comprising: 
 molding the product carrier into a form selected from the group consisting of a tube, a tray, a reel and a jewel box.    
     
     
         12 . The method of  claim 8 , comprising: 
 molding the product carrier into a form configured for holding one semiconductor device.    
     
     
         13 . The method of  claim 8 , comprising: 
 molding the product carrier into a form configured for holding a plurality of semiconductor devices.    
     
     
         14 . The method of  claim 8 , further comprising the step of: 
 including a card comprising a humidity sensitive element in the dry packed bag.    
     
     
         15 . The method of  claim 8 , further comprising: 
 labeling an outside of the dry pack bag;    packing the dry pack bag in a box; and    labeling an outside of the box with a moisture-sensitivity caution label.