Angle mounted fan-sink

Abstract

An angle-mounted fan sink for an electronic device, such as the processor of a computer system, or the like includes a heat sink coupled to a surface of the electronic device for conducting heat away from the electronic device. A fan assembly is mounted in an oblique orientation to the base of the heat sink. The fan assembly circulates a cooling medium such as air over the heat sink at an angle that is generally oblique to the surface of the electronic device for dissipating heat from the heat sink.

What is claimed is:  
     
         1 . A fan sink for an electronic device, comprising: 
 a heat sink suitable for being coupled to a surface of the electronic device for conducting heat away from the electronic device; and    a fan assembly for circulating a cooling medium over the heat sink,    wherein the fan assembly circulates the cooling medium through the heat sink at an angle that is generally oblique to the surface of the electronic device.    
     
     
         2 . The fan sink as claimed in  claim 1 , wherein the fan assembly is mounted to the heat sink at an oblique angle to the surface of the electronic device.  
     
     
         3 . The fan sink as claimed in  claim 1 , wherein the heat sink includes a base suitable for being mounted to the surface of the electronic device and at least one fin extending outwardly from the base, the cooling medium being circulated over the at least one fin for dissipating heat therefrom.  
     
     
         4 . The fan sink as claimed in  claim 3 , wherein the at least one fin comprises an edge obliquely angled to the base, the fan assembly being abutted to the edge so that it is mounted at an oblique angle to the surface of the electronic device.  
     
     
         5 . The fan sink as claimed in  claim 1 , wherein the fan assembly comprises a radial fan.  
     
     
         6 . The fan sink as claimed in  claim 1 , wherein the electronic device comprises a processor.  
     
     
         7 . The fan sink as claimed in  claim 1 , wherein the cooling medium comprises air.  
     
     
         8 . A fan sink for an electronic device, comprising: 
 a heat sink suitable for being coupled to a surface of the electronic device for conducting heat away from the electronic device; and    a fan assembly mounted to the heat sink at an oblique angle to the surface of the electronic device, the fan assembly for circulating a cooling medium over the heat sink,    wherein the fan assembly circulates the cooling medium through the heat sink at an angle that is generally oblique to the surface of the electronic device.    
     
     
         9 . The fan sink as claimed in  claim 8 , wherein the heat sink includes a base suitable for being mounted to the surface of the electronic device and a plurality of fins extending outwardly from the base, the cooling medium being circulated over the plurality of fins for dissipating heat therefrom.  
     
     
         10 . The fan sink as claimed in  claim 9 , wherein the plurality of fins comprise edges obliquely angled to the base, the fan assembly being abutted to the edges.  
     
     
         11 . The fan sink as claimed in  claim 8 , wherein the fan assembly comprises a radial fan.  
     
     
         12 . The fan sink as claimed in  claim 8 , wherein the electronic device comprises a processor.  
     
     
         13 . The fan sink as claimed in  claim 8 , wherein the cooling medium comprises air.  
     
     
         14 . A fan sink for an electronic device, comprising: 
 means suitable for being coupled to a surface of the electronic device for conducting heat away from the electronic device; and    means for circulating a cooling medium over conducting means,    wherein the circulating means circulates the cooling medium through the conducting means at an angle that is generally oblique to the surface of the electronic device.    
     
     
         15 . The fan sink as claimed in  claim 14 , wherein the circulating means is mounted to the conducting means at an oblique angle to the surface of the electronic device.  
     
     
         16 . The fan sink as claimed in  claim 14 , wherein the conducting means includes a base mounted to the surface of the electronic device and at least one fin extending outwardly from the base, the cooling medium being circulated over the at least one fin for dissipating heat therefrom.  
     
     
         17 . The fan sink as claimed in  claim 16 , wherein the at least one fin comprises an edge obliquely angled to the base, the fan assembly being abutted to the edge so that it is mounted at an oblique angle to the surface of the electronic device.  
     
     
         18 . The fan sink as claimed in  claim 1 , wherein the circulating means comprises a radial fan.  
     
     
         19 . The fan sink as claimed in  claim 1 , wherein the electronic device comprises a processor.  
     
     
         20 . The fan sink as claimed in  claim 1 , wherein the cooling medium comprises air.