Electronic module or label with a fixing adhesive forming a barrier for coating resin, and a medium including a module or label of this kind

Abstract

An electronic module or label which is adapted to be rendered adhesive including a support film having an insulative film and at a communication interface disposed on the insulative film, at least one microcircuit, the communication interface being connected to the microcircuit by connections, an adhesive tape including an activatable adhesive adhered to the insulative film and a perforation coinciding with a predetermined area of the support film that includes the microcircuit and connections, a coating resin protecting the microcircuit and the connections and covering the predetermined area within the perforation. The adhesive tape can also include a removable protective film. After removing the removable protective film, the module or label can be adhered to a card body, forming a electronic card such as a smart card. In other embodiments, adhesive is applied to the support film so as to form a delimitation in which the coating resin is applied.

1 . An electronic module or label which is adapted to be rendered adhesive comprising: 
 a support film having an insulative film and at a communication interface disposed on the insulative film,    at least one microcircuit,    the communication interface being connected to the microcircuit by connections,    an adhesive tape including an activatable adhesive adhered to the insulative film,    the adhesive tape having a perforation coinciding with a predetermined area of the support film that includes the microcircuit and connections,    a coating resin protecting the microcircuit and the connections, the coating resin covering the predetermined area within the perforation.    
     
     
         2 . An electronic module or label as in  claim 1 , wherein the communication interface is an antenna or contacts.  
     
     
         3 . An electronic module or label as in  claim 1 , wherein the microcircuit is fixed to the support film.  
     
     
         4 . An electronic module or label as in  claim 1 , wherein the adhesive tape comprises a removable protective film.  
     
     
         5 . An electronic module or label as in  claim 4 , wherein the adhesive tape comprises glass fibers.  
     
     
         6 . An electronic module or label as in  claim 1 , wherein the thickness of the adhesive tape is at least equal to a desired thickness of the coating resin.  
     
     
         7 . An electronic module as in  claim 1  in combination with a card body and forming an electronic card or token, wherein the electronic module is enclosed within a cavity of the card body with a surface of the electronic module being flush with a surface of the card body.  
     
     
         8 . An electronic module or label as in  claim 1  in combination with a card body and forming an electronic card or token, 
 wherein the card body has a cavity adapted to receive the microcircuit, the connections, and the coating resin,  
 wherein the electronic module is arranged with the microcircuit, the connections, and the coating resin within the cavity,  
 and wherein the support film is fixed to a surface of the card body outside the cavity with the activatable adhesive.  
 
     
     
         9 . A plurality of electronic modules or labels as claimed in  claim 3  arranged in a spool or roll.  
     
     
         10 . An electronic module or label as in  claim 1 , wherein the activatable adhesive is heat-activated.  
     
     
         11 . An electronic module or label as in  claim 1 , wherein the activatable adhesive is activated by irradiation.  
     
     
         12 . An electronic module or label as in  claim 1 , wherein the activatable adhesive is a heat-activated thermoplastic.  
     
     
         13 . An electronic module or label as in  claim 1 , wherein the activatable adhesive is a thermoplastic film.  
     
     
         14 . An electronic module or label as in  claim 1 , wherein the activatable adhesive is heat-activated and the coating resin is a resin which can be polymerized at a temperature of 70° C. or less.  
     
     
         15 . An electronic module or label as in  claim 1 , wherein the communication interface is an antenna, and the antenna comprises conductive metal tape chemically etched or stamped on a dielectric material.  
     
     
         16 . An electronic module or label as in  claim 1 , wherein the communication interface is an antenna, and the antenna is on a same side of the support film as the microcircuit, and the antenna is covered by the adhesive tape.  
     
     
         17 . An electronic module or label as in  claim 1 , wherein the communication interface is an antenna, the antenna is on one side of the support film and the microcircuit is on an opposite side of the support film.  
     
     
         18 . An electronic module or label as in  claim 17 , wherein a protective film is applied to the support film covering the antenna.  
     
     
         19 . An electronic label comprising: 
 a support film having an insulative film and an antenna comprising conductive metal turns disposed on the insulative film,    at least one microcircuit,    the antenna being connected to the microcircuit by connections,    an adhesive tape including an activatable adhesive adhered to an insulative film,    the adhesive tape having a perforation coinciding with a predetermined area of the support film that includes the microcircuit and the connections,    a coating resin protecting the microcircuit and the connections, said coating resin covering the predetermined area within the perforation.    
     
     
         20 . An electronic module or label which is adapted to be rendered adhesive comprising: 
 a support film having an insulative film and a communication interface disposed on the insulative film,    at least one microcircuit,    the communication interface being connected to the microcircuit by connections,    an activatable adhesive distributed over the support film and forming a delimitation around a predetermined area that includes the microcircuit and connections,    and a coating resin protecting the microcircuit and the connections, the coating resin being disposed within the delimitation over the predetermined area.    
     
     
         21 . An electronic module or label as in claim  20 , wherein the adhesive is distributed in stripes and/or spots.