Method of cooling devices

Abstract

It is intended to extend life spans of devices as a whole by reducing differences of temperatures of devices which are mounted on a printed circuit board by plural number without increasing the volume of cooling gas. In the method of cooling multiple driver's ICs which are continuously mounted on a printed circuit board, the devices having heat sinks provided with multiple radiating fins disposed thereon in parallel with one another, each radiating fin is positioned relative to a blowing direction of cooling gas at a given inclination angle θ.

What is claimed is:  
     
         1 . A method of cooling devices continuously mounted on a printed circuit board, the devices having heat sinks provided with multiple radiating fins disposed thereon in parallel with one another, wherein each radiating fin is positioned relative to a blowing direction of cooling gas at a given inclination angle θ.  
     
     
         2 . The method of cooling devices according to  claim 1 , wherein the devices are driver's ICs used in a test head of a semiconductor integrated circuit testing device for outputting testing signals to devices under test.  
     
     
         3 . The method of cooling devices according to  claim 2 , wherein the driver's ICs are mounted in a row on a printed circuit board and cooling gas is blown out from a given direction along the surface of the printed circuit board.  
     
     
         4 . The method of cooling devices according to  claim 1 , wherein the heat sinks are mounted onto the devices by a heat conductive adhesive.  
     
     
         5 . The method of cooling devices according to  claim 1 , wherein the cooling gas is air.  
     
     
         6 . The method of cooling devices according to  claim 1 , wherein the inclination angle θ is set at 30 degrees.  
     
     
         7 . The method of cooling devices according to  claim 2 , wherein the heat sinks are mounted onto the devices by a heat conductive adhesive.  
     
     
         8 . The method of cooling devices according to  claim 3 , wherein the heat sinks are mounted onto the devices by a heat conductive adhesive.  
     
     
         9 . The method of cooling devices according to  claim 2 , wherein the cooling gas is air.  
     
     
         10 . The method of cooling devices according to  claim 3 , wherein the cooling gas is air.  
     
     
         11 . The method of cooling devices according to  claim 4 , wherein the cooling gas is air.  
     
     
         12 . The method of cooling devices according to  claim 7 , wherein the cooling gas is air.  
     
     
         13 . The method of cooling devices according to  claim 8 , wherein the cooling gas is air.  
     
     
         14 . The method of cooling devices according to  claim 2 , wherein the inclination angle θ is set at 30 degrees.  
     
     
         15 . The method of cooling devices according to  claim 3 , wherein the inclination angle θ is set at 30 degrees.  
     
     
         16 . The method of cooling devices according to  claim 4 , wherein the inclination angle θ is set at 30 degrees.  
     
     
         17 . The method of cooling devices according to  claim 5 , wherein the inclination angle θ is set at 30 degrees.