Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film

Abstract

A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

What is claimed is:  
     
         1 . A photo curable resin composition, which provides a cured film having an elastic modulus of 1 to 100 MPa in dynamic viscoelasticity measurement in a region of 200° to 220° C.  
     
     
         2 . A photo curable resin composition, which comprises (A) acid-modified vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, wherein the acid-modified vinyl group-containing epoxy resin (A) is a resin obtained by reacting at least one resin (a) selected from the group consisting of novolak epoxy resin represented by the following formula (I), bisphenol A epoxy resin or bisphenol F epoxy resin represented by the following formula (II) and salicylaldehyde epoxy resin represented by the formula (III) with a vinyl group-containing monocarboxylic acid (b) and further reacting the resulting resin with a saturated group of unsaturated group-containing polybasic acid anhydride (c),  
       
         
           
           
               
               
           
         
       
       wherein X is a hydrogen atom or a glycidyl group; R is a hydrogen atom or a methyl group; and n is an integer of 1 or more.  
     
     
         3 . A photo curable resin composition according to  claim 2 , wherein the elastomer (B) is at least one member selected from the group consisting of styrene-based elastomers, olefinic elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, acrylic elastomers and silicone-based elastomers.  
     
     
         4 . A photosensitive element, which comprises a support and a layer of photocurable resin composition of  claim 3  laid on the support.  
     
     
         5 . A photo curable resin composition according to  claim 2 , wherein the component (B) is contained in an amount of 2 to 30 parts by weight per 100 parts by weight of the component (A), the component (C) is contained in an amount of 0.5 to 20 parts by weight, the component (D) is contained in an amount of 5 to 80 parts by weight, and the component (E) is contained in an amount of 2 to 50 parts by weight, based on 100 parts by weight of the composition, respectively.  
     
     
         6 . A photosensitive element, which comprises a support and a layer of photocurable resin composition of  claim 2  laid on the support.  
     
     
         7 . A photo curable resin composition, which comprises (A) acid-modified vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, wherein the elastomer (B) is at least one member selected from the group consisting of styrene-based elastomers, olefinic elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, acrylic elastomers and silicone-based elastomers.