US2002168805A1PendingUtilityA1
Thin film transistor substrate and fabricating method thereof
Est. expiryDec 31, 2019(expired)· nominal 20-yr term from priority
Inventors:Hyun-Jung Lee
H10D 30/6725H10D 30/673H10D 30/67G02F 1/1368G02F 1/133357G02F 1/136222
36
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Claims
Abstract
A thin film transistor substrate having a structure in which a thin film transistor array is formed on color filters. In the substrate, a thin film transistor is formed on the color filters. A smoothing layer compensates for step coverage between the color filters and is provided with a recess in which a gate electrode of the thin film transistor is to be formed. Accordingly, step coverage in the gate electrode is eliminated, so that it becomes possible to manufacture a large-dimension panel without a limitation to the thickness and profile of the gate electrode.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A thin film transistor substrate including color filters, comprising:
a thin film transistor formed on the color filters; and a smoothing layer compensating for a step coverage between the color filters and being provided with a recess in which a gate electrode of the thin film transistor is to be formed.
2 . The thin film transistor substrate according to claim 1 , wherein the recess of the smoothing layer has the same bulk as the gate electrode.
3 . A method of fabricating a thin film transistor substrate having a thin film transistor formed on color filters, comprising the steps of:
forming the color filters on a transparent substrate; forming a smoothing layer on the color filters and then pattering it to thereby define a recess in which a gate electrode of the thin film transistor is to be formed; and forming the thin film transistor on the smoothing layer.
4 . The method according to claim 3 , wherein the recess of the smoothing layer has the same bulk as the gate electrode.
5 . The method according to claim 3 , wherein said step of forming the thin film transistor includes:
forming the gate electrode in the recess of the smoothing layer; and sequentially forming a gate insulating film, a semiconductor layer and source and drain electrodes on the gate electrode and the smoothing layer.Join the waitlist — get patent alerts
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