US2002168805A1PendingUtilityA1

Thin film transistor substrate and fabricating method thereof

Assignee: LG PHILIPS LCD CO LTDPriority: Dec 31, 1999Filed: Jun 24, 2002Published: Nov 14, 2002
Est. expiryDec 31, 2019(expired)· nominal 20-yr term from priority
Inventors:Hyun-Jung Lee
H10D 30/6725H10D 30/673H10D 30/67G02F 1/1368G02F 1/133357G02F 1/136222
36
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Claims

Abstract

A thin film transistor substrate having a structure in which a thin film transistor array is formed on color filters. In the substrate, a thin film transistor is formed on the color filters. A smoothing layer compensates for step coverage between the color filters and is provided with a recess in which a gate electrode of the thin film transistor is to be formed. Accordingly, step coverage in the gate electrode is eliminated, so that it becomes possible to manufacture a large-dimension panel without a limitation to the thickness and profile of the gate electrode.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A thin film transistor substrate including color filters, comprising: 
 a thin film transistor formed on the color filters; and    a smoothing layer compensating for a step coverage between the color filters and being provided with a recess in which a gate electrode of the thin film transistor is to be formed.    
     
     
         2 . The thin film transistor substrate according to  claim 1 , wherein the recess of the smoothing layer has the same bulk as the gate electrode.  
     
     
         3 . A method of fabricating a thin film transistor substrate having a thin film transistor formed on color filters, comprising the steps of: 
 forming the color filters on a transparent substrate;    forming a smoothing layer on the color filters and then pattering it to thereby define a recess in which a gate electrode of the thin film transistor is to be formed; and    forming the thin film transistor on the smoothing layer.    
     
     
         4 . The method according to  claim 3 , wherein the recess of the smoothing layer has the same bulk as the gate electrode.  
     
     
         5 . The method according to  claim 3 , wherein said step of forming the thin film transistor includes: 
 forming the gate electrode in the recess of the smoothing layer; and    sequentially forming a gate insulating film, a semiconductor layer and source and drain electrodes on the gate electrode and the smoothing layer.

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