Heating element of a printhead having resistive layer over conductive layer

Abstract

10006488 A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.

1 . A heating element of a printhead comprising: 
 a substrate;    a conductive layer deposited over the substrate; and    a resistive layer deposited over and in electrical contact with the conductive layer.    
     
     
         2 . The heating element of  claim 1  further comprising a resistor formed of the resistive material, wherein the resistor couples sections of the conductive material.  
     
     
         3 . The heating element of  claim 1  wherein the conductive layer has a first section and a second section that is discontinuous with the first section, and the resistive layer is deposited over the conductive layer in between the first and second sections.  
     
     
         4 . The heating element of  claim 1  wherein the conductive layer has an opening, and beveled surfaces adjacent the opening, wherein the resistive layer is deposited over the opening and the beveled surfaces.  
     
     
         5 . The heating element of  claim 1  further comprising a barrier layer deposited in between the conductive layer and the substrate.  
     
     
         6 . The heating element of  claim 1  further comprising an insulating layer deposited in between the conductive layer and the substrate.  
     
     
         7 . The heating element of  claim 1  further comprising at least one of titanium and a titanium alloy layer deposited in between the conductive layer and the substrate.  
     
     
         8 . A printhead comprising: 
 a substrate;    a conductive layer deposited over the substrate;    a resistive layer deposited over and in electrical contact with the conductive layer; and    a top layer deposited over the resistive layer, wherein the top layer has an orifice through which fluid is capable of being ejected.    
     
     
         9 . The printhead of  claim 8  wherein the conductive layer defines a conductive trace having first and second sections, wherein the resistive layer defines a resistor that couples the first and second sections of the conductive trace, wherein the orifice is formed substantially above the resistor.  
     
     
         10 . The printhead of  claim 9  wherein each of the first and second sections has an end surface and two opposing side surfaces, wherein the end surface of the first section faces the end surface of the second section, wherein the end surface of each section is beveled, wherein the two opposing side surfaces have an angle with the substrate that is one of equal to and greater than the angle between the substrate and the end surface.  
     
     
         11 . The printhead of  claim 10  wherein the end surface has an angle between about 35 to 55 degrees with the substrate and the side surfaces have an angle between about 35 to 80 degrees with the substrate.  
     
     
         12 . The printhead of  claim 9  wherein the conductor trace has a top surface with a width, wherein a resistor width is substantially the same as the top surface width.  
     
     
         13 . The printhead of  claim 9  wherein the conductor trace has a top surface with a width, wherein a resistor width is greater than the top surface width, such that the resistor encapsulates opposing side surfaces of the conductor trace.  
     
     
         14 . A method of fabricating a printhead comprising: 
 depositing conductive material over a substrate;    etching the conductive material to define at least one of a conductor trace and a resistor length;    depositing resistive material over the conductor trace; and    depositing a top layer over the resistive material, wherein the top layer has an orifice through which fluid is capable of being ejected.    
     
     
         15 . The method of  claim 14  further comprising depositing photoresist over the conductive material and photomasking before etching the conductive material; and removing the photoresist material before depositing the resistive material.  
     
     
         16 . The method of  claim 14  further comprising: 
 depositing photoresist over the resistive material and photomasking;  
 etching the resistive material to define a resistor width and a cap width on the conductor traces; and  
 removing the photoresist material.  
 
     
     
         17 . The method of  claim 14  wherein the conductor trace has first and second sections, wherein an end surface of the first section faces an end surface of the second section, the method further comprising beveling the end surface of each section.  
     
     
         18 . The method of  claim 17  further comprising forming the end surface using photomasking techniques.  
     
     
         19 . The method of  claim 16  further comprising encapsulating the conductor trace, wherein the cap width is greater than a width of the conductor trace.  
     
     
         20 . The method of  claim 19  wherein the conductor trace has first and second sections, each section having an end surface and two opposing side surfaces, wherein the end surface of the first section faces the end surface of the second section, the method further comprising covering the side surfaces of the conductor traces with the cap width.