Process for electroplating a work piece coated with an electrically conducting polymer

Abstract

The object of the invention is to provide a process for electroplating a work piece ( 1 ) which is coated with an electrically conducting or modified polymer, wherein, independently of the work piece to be electroplated, it is possible to simultaneously reduce the current density and shorten the electroplating time. The invention includes, as a first step, that the work piece is connected to a current source ( 8 ) by multiple adjoining contact elements ( 5 ) and covered with a thin metallic coat, except at the points covered by the contact elements and that subsequently, in a second step, the contact elements are removed and an unbroken metal coat ( 10 ) is formed.

1 . A process for electroplating a work piece coated with an electrically conducting or modified polymer characterized by the work piece, in a first process step, being connected by multiple adjoining contact elements to a current source and coated with a thin metal layer, except at the contact points covered by the contact elements and subsequently, in a second process step, the contact elements being removed an unbroken metal coat is formed.  
     
     
         2 . A process in accordance with  claim 1 , characterized by the individual contact elements being arranged next to each other, lattice-like on the surface of the work piece to be electroplated.  
     
     
         3 . A process in accordance with claims  1  and  2 , characterized by adjoining contact elements being located equidistant to each other.  
     
     
         4 . A process in accordance with  claim 1  to  3 , characterized by a contact element carrier with multiple contact elements for the arrangement of the contact elements being used.  
     
     
         5 . A process in accordance with  claim 4 , characterized by a frame with contact elements attached being used as the contact element carrier.  
     
     
         6 . A process in accordance with  claim 5 , characterized by several frames being used next to each other and/or on both sides of the work piece to be electroplated for large area coverage of the surface to be electroplated.  
     
     
         7 . A process in accordance with  claim 4 , characterized by a rack with several contact elements attached being used as a contact element carrier.  
     
     
         8 . A process in accordance with  claim 1  to  7 , characterized by the contact elements being adjustable in their relative position to the contact element carrier and located for connecting the work piece to be electroplated to the current source, depending on the work piece geometry.  
     
     
         9 . A process in accordance with  claim 4 , characterized by a metallic grate being used as the contact element carrier.  
     
     
         10 . A process in accordance with  claim 9 , characterized by the grate being placed on the surface of the work piece to be electroplated, and that the work piece is guided through the electrolyte together with the grate.  
     
     
         11 . A process in accordance with  claim 10 , characterized by the metal deposited on the metallic contact points being dissolved by means of counter anodes.  
     
     
         12 . A process in accordance with one of the foregoing claims, characterized by the metal coat being formed in a thickness, which can be selected.  
     
     
         13 . A fixture for carrying out the process in accordance with one of the  claims 1  to  12 , characterized by at least one contact clement carrier with multiple adjoining contact elements being provided for connection of the work piece to be galvanized with a current source.  
     
     
         14 . A fixture in accordance with  claim 13 , characterized by the individual contact elements being installed on the contact element carrier in such a manner that their position on the contact element carrier is adjustable.  
     
     
         15 . A fixture in accordance with  claim 13  and  14 , characterized by the contact element carrier being designed as a frame or a rack.  
     
     
         16 . A fixture in accordance with  claim 13  and  14 , characterized by the contact element carrier being a metallic grate onto which the work piece to be electroplated may be placed.  
     
     
         17 . A fixture in accordance with  claim 16 , characterized by the metal grate forming and endless band.  
     
     
         18 . A fixture in accordance with  claim 17 , characterized by the grate simultaneously serving as a work piece conveyor.  
     
     
         19 . A fixture in accordance with  claim 16  to  18 , characterized by counter anodes being provided in order to avoid galvanizing of the contact points.