Retaining ring of a wafer carrier

Abstract

A retaining ring of a wafer carrier includes a polymer containing abrasives. The abrasives can be released from the polymer by the friction between the polymer and the polishing pad. Therefore, it is convenient to maintain the wafer and is possible to prevent abrasives from aggregating in the polishing slurry. Meanwhile, the time for replacing the polishing slurry can be reduced and the polishing operation as a whole can be simplified so as to reduce the cost and promote productive efficiency.

What is claimed is:  
     
         1 . A retaining ring of a wafer carrier applicable to maintain a wafer on a wafer carrier, said retaining ring including a polymer and characterized by said polymer containing abrasives therein.  
     
     
         2 . The retaining ring of a wafer carrier as claimed in  claim 1 , wherein the abrasive is SiO 2 .  
     
     
         3 . The retaining ring of a wafer carrier as claimed in  claim 1 , wherein the abrasive is Al 2 O 3 .  
     
     
         4 . The retaining ring of a wafer carrier as claimed in  claim 1 , wherein the abrasive is CeO 2 .