Method of manufacturing wiring board

Abstract

The present invention provides a method of manufacturing a wiring board, including the steps of preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof, laminating at least the composite sheet on a wiring layer having a wiring pattern formed on an insulating layer, and heating and pressurizing the laminated product thus obtained or heating and pressurizing it after the pressurization to integrate the laminated product. The present invention provides a composite sheet for manufacturing a wiring board which is laminated on a wiring layer having a wiring pattern formed on an insulating layer and is thus used, wherein an adherent sheet containing a thermosetting resin is adhered to a porous film or at least a part thereof is impregnated therein. The present invention provides a wiring board having a lamination structure in which a wiring layer having a wiring pattern formed on an insulating layer and a composite insulating layer obtained by curing a thermosetting resin impregnated in a porous film are laminated and integrated, the wiring pattern being put in the porous film.

What is claimed is:  
     
         1 . A method of manufacturing a wiring board, comprising the steps of: 
 preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof;    laminating at least the composite sheet on a wiring layer having a wiring pattern formed on an insulating layer; and    heating and pressurizing the laminated product thus obtained or heating and pressurizing it after the pressurization to integrate the laminated product.    
     
     
         2 . The method of manufacturing a wiring board according to  claim 1 , wherein the composite sheet having the adherent sheet adhered to a porous film is used and the laminating step is carried out by arranging the porous film side of the composite sheet onto the wiring layer.  
     
     
         3 . The method of manufacturing a wiring board according to  claim 1 , wherein the composite sheet having a porous film impregnated with a part of the adherent sheet and the laminating step is carried out by arranging the porous film side of the composite sheet onto the wiring layer.  
     
     
         4 . The method of manufacturing a wiring board according to  claim 1 , wherein the composite sheet having a porous film impregnated with the whole adherent sheet is used.  
     
     
         5 . The method of manufacturing a wiring board according to  claim 1 , wherein the composite sheet having a releasing resin film attached to the adherent sheet is used.  
     
     
         6 . A composite sheet for manufacturing a wiring board which is laminated on a wiring layer having a wiring pattern formed on an insulating layer and is used, wherein an adherent sheet containing a thermosetting resin is adhered to a porous film or at least a part thereof is impregnated therein.  
     
     
         7 . The composite sheet for manufacturing a wiring board according to  claim 6 , wherein a releasing resin film is further attached to the adherent sheet.  
     
     
         8 . The composite sheet for manufacturing a wiring board according to  claim 6 , wherein the porous film comprises polyimide or aromatic polyamide.  
     
     
         9 . A wiring board having a lamination structure in which a wiring layer having a wiring pattern formed on an insulating layer and a composite insulating layer obtained by curing a thermosetting resin impregnated in a porous film are laminated and integrated, the wiring pattern being put in the porous film.  
     
     
         10 . The wiring board according to  claim 9 , wherein the porous film comprises polyimide or aromatic polyamide.