Cover with gapped adhesive preform

Abstract

A cover according to the invention comprises a cover having a bonding surface defining a closed bonding pattern, and a bonding pattern of adhesive on the bonding surface of the cover, wherein the bonding pattern of adhesive has at least one gap therein, wherein the gap is sufficiently small as to be filled by the adhesive when the adhesive flows.

What is claimed is:  
     
         1 . A cover comprising: 
 a cover having a bonding surface defining a closed bonding pattern; and    a bonding pattern of adhesive on the bonding surface of said cover, wherein said bonding pattern of adhesive has at least one gap therein, wherein the gap is sufficiently small as to be filled by said adhesive when said adhesive flows.    
     
     
         2 . The cover of  claim 1  wherein said bonding pattern of adhesive is formed by a method selected from the group consisting of mesh screening, stencil screening, contact screening, mask screening and ink-jet printing.  
     
     
         3 . The cover of  claim 1  wherein said bonding pattern of adhesive is one of dried and B-staged.  
     
     
         4 . The cover of  claim 1  wherein said adhesive is selected from the group consisting of thermoplastic adhesives and thermosetting adhesives.  
     
     
         5 . The cover of  claim 1  wherein the at least one gap is at least at one of a corner and a side of said bonding pattern of adhesive.  
     
     
         6 . The cover of  claim 1  wherein said cover is of a hollow rectangular shape having an open end, the edges at the open end thereof providing a bonding surface defining a rectangular bonding pattern.  
     
     
         7 . The cover of  claim 1  wherein said adhesive has a melting temperature at which its bond strength substantially decreases, which melting temperature is substantially less than the melting temperature of solder.  
     
     
         8 . A cover having a gapped adhesive preform disposed on a bonding surface thereof and adapted to flow for attaching the cover to a substrate comprising: 
 a cover having a bonding surface adapted for receiving adhesive and defining a closed bonding pattern;    a preform of flowable adhesive in the shape of the bonding pattern disposed on the bonding surface of said cover, wherein said flowable adhesive preform has at least one gap therein, wherein the at least one gap is sufficiently small as to be filled by said flowable adhesive when said adhesive flows for attaching the cover to a substrate.    
     
     
         9 . The cover of  claim 8  wherein said adhesive preform is formed by a method selected from the group consisting of mesh screening, stencil screening, contact screening, mask screening and ink-jet printing.  
     
     
         10 . The cover of  claim 8  wherein said adhesive preform is one of dried and B-staged.  
     
     
         11 . The cover of  claim 8  wherein said flowable adhesive is selected from the group consisting of thermoplastic adhesives and thermosetting adhesives.  
     
     
         12 . The cover of  claim 8  wherein the at least one gap is at least at one of a corner and a side of said adhesive preform  
     
     
         13 . The cover of  claim 8  wherein said cover is of a hollow rectangular shape having an open end, the edges at the open end thereof providing a bonding surface defining a rectangular bonding pattern.  
     
     
         14 . The cover of  claim 1  wherein said flowable adhesive has a melting temperature at which its bond strength substantially decreases, which melting temperature is substantially less than the melting temperature of solder.  
     
     
         15 . A hollow cover having a gapped adhesive preform disposed on a bonding surface thereof and adapted to flow for attaching the cover to a substrate comprising: 
 a hollow cover having an open end defining a bonding surface adapted for receiving adhesive and defining a closed bonding pattern;    a preform of melt-flowable adhesive formed in the shape of the bonding pattern and disposed on the bonding surface of said hollow cover, wherein said flowable adhesive preform has two or more gaps therein, wherein each of the plural gaps is sufficiently small as to be filled by said melt-flowable adhesive when said melt-flowable adhesive flows for attaching the cover to a substrate.    
     
     
         16 . The hollow cover of  claim 15  wherein said preform of melt-flowable adhesive is formed by a method selected from the group consisting of mesh screening, stencil screening, contact screening, mask screening and ink-jet printing.  
     
     
         17 . The hollow cover of  claim 15  wherein said melt-flowable adhesive includes one of a dried thermoplastic adhesive, a B-staged thermoplastic adhesive, a dried thermosetting adhesive, and a B-staged thermosetting adhesive.  
     
     
         18 . The hollow cover of  claim 15  wherein the plural gaps of said preform are at a corner of the bonding pattern, along a side of the bonding pattern and/or at one or more corners and along one or more sides of the bonding pattern.  
     
     
         19 . The hollow cover of  claim 15  wherein said hollow cover is of a hollow rectangular shape.  
     
     
         20 . The hollow cover of  claim 15  wherein said melt-flowable adhesive has a melt-flow temperature at which its bond strength substantially decreases, which melt-flow temperature is substantially less than the melting temperature of solder.