Process and apparatus for sequential multi-beam laser processing of materials

Abstract

A method of processing a substrate by first processing the diamond surface with a laser operating at a first wavelength, and then by processing the diamond surface with a laser operating at a second wavelength.

I claim:  
     
         1 . A method for processing a substrate having an initial surface roughness R 0  to modify the surface roughness to a final surface roughness R F , comprising: 
 (a) applying a first wavelength of laser light to the substrate surface to modify the surface roughness on at least a portion of the surface to an intermediate surface roughness R I ; and    (b) applying a second wavelength of laser light to said portion of the substrate surface having an intermediate surface roughness R I , to modify the surface roughness of on at least a part of said portion to an final surface roughness R F .    
     
     
         2 . The method of  claim 1  wherein the first wavelength is greater than the second wavelength.  
     
     
         3 . The method of  claim 1  wherein the first wavelength is less than the second wavelength.  
     
     
         4 . A method for processing a substrate, comprising: 
 (a) applying a first wavelength of laser light to a portion of the substrate; and    (b) applying a second wavelength of laser light to said portion of the substrate.