Methods of manufacturing microfabricated substrates

Abstract

The present invention is directed to improved methods and apparatuses for manufacturing microfabricated devices, and particularly, microfluidic devices. In general the methods and apparatuses of the invention provide improved methods of bonding substrates together by applying a vacuum to the space between the substrates during the bonding process.

What is claimed is:  
     
         1 . A method of fabricating microfluidic devices comprising: 
 providing a first substrate and a second substrate, wherein the second substrate has a plurality of apertures;    applying a vacuum to the apertures to hold the first substrate in contact with the second substrate; and    bonding the first substrate to the second substrate.    
     
     
         2 . The method of  claim 1 , wherein the bonding step comprises heating the first and second substrates to bond a first surface of the first substrate to a first surface of the second substrate.  
     
     
         3 . The method of  claim 2 , wherein the step of heating the substrates comprises heating the first and second substrates to a temperature between about 80° C. and 200° C.  
     
     
         4 . The method of  claim 3 , wherein the first and second substrates comprise polymeric substrates.  
     
     
         5 . The method of  claim 2 , wherein the first and second substrates comprise silica-based substrates, and wherein the bonding step comprises heating the first and second substrates to between about 90 and 200° C., followed by the step of heating the first and second substrates to a temperature between about 500° C. and 1400° C.  
     
     
         6 . The method of  claim 1 , wherein the bonding step comprises applying an adhesive to at least one of a first surface of the first substrate or a first surface of the second substrate prior to applying a vacuum to the apertures of the second substrate.  
     
     
         7 . The method of  claim 1 , wherein the first and second substrates comprise glass.  
     
     
         8 . The method of  claim 1 , wherein the first and second substrates are comprised of polymeric materials.  
     
     
         9 . The method of  claim 1 , wherein the first substrate includes a plurality of discrete microscale channel networks disposed on a first surface of the first substrate.  
     
     
         10 . The method of  claim 9 , wherein the first substrate includes at least four discrete microscale channel networks disposed on the first surface of the first substrate.  
     
     
         11 . The method of  claim 9  wherein the first substrate includes at least ten discrete microscale channel networks disposed on the first surface of the first substrate.  
     
     
         12 . The method of  claim 9  wherein the first and second bonded substrates form a unitary bonded substrate, the method further comprising separating a first portion of the bonded substrate containing at least a first discrete channel network from a second portion of the bonded substrate containing at least a second discrete channel network.  
     
     
         13 . The method of  claim 12 , wherein the bonded substrate comprises a thinned region between at least the first and second discrete channel networks, and the separating step comprises breaking the first discrete channel network from at least the second discrete channel network along the thinned region.  
     
     
         14 . The method of  claim 12 , wherein the bonded substrate comprises a perforated region between at least the first and second discrete channel networks, and the separating step comprises breaking the first discrete channel network from at least the second discrete channel network along the perforated region.  
     
     
         15 . The method of  claim 9  wherein the plurality of apertures are positioned in fluidic communication with the plurality of discrete microscale channel networks prior to said bonding step.  
     
     
         16 . The method of  claim 1  further comprising aligning the first substrate with the second substrate prior to said applying vacuum.  
     
     
         17 . The method of  claim 1  wherein said applying vacuum is performed by placing the second substrate upon a platform surface which includes a plurality of grooves fabricated therein which extend laterally from one or more vacuum ports in the platform surface, and applying a vacuum to the one or more vacuum ports.  
     
     
         18 . The method of  claim 1  wherein said applying vacuum is performed by placing the second substrate upon a platform surface which includes a plurality of vacuum ports fabricated therein, and applying a vacuum to the plurality of vacuum ports.