Thermal, bi-modal heat-pump and cushioning shoe insole

Abstract

A bi-modal thermal insole heat pump and shock cushioner which can selectively be reversibly deployed in a shoe to act, with regard to its heat-pump capabilities, either as a heat-deliverer or as a heat-remover with respect to the underside of a user's foot.

We claim:  
     
         1 . A bi-modal, reversibly and removably deployable, shoe-insole heat-pump structure in the form of a generally planar plural-layer assembly comprising 
 a heat-delivery layer formed of a material wherein deliverable heat develops internally as a consequence of dynamic deformations that take place in the material during wearing use inside a shoe, said heat-delivery layer having one facial expanse defining a heat-delivery side for said heat-pump structure, and an opposite facial expanse, and    a heat-removal, cooling layer formed of a low-surface-friction, moisture-wicking material having one facial expanse joined to said opposite facial expanse in said heat-delivery layer, and an opposite facial expanse defining a heat-removing side for said heat-pump structure,    said layers, as joined into said assembly, having an appropriate, laterally reversible, left-shoe/right-shoe perimetral outline, depending upon which of the layers constitutes the upper, foot-engaging layer as installed removably in a shoe, whichever one of the layers that is deployed as the upper layer in a particular use installation determining whether the wearer experiences heating or cooling with regard to the assembly that includes that layer    
     
     
         2 . The heat-pump structure of  claim 1 , wherein said heat-delivery layer is specifically formed of one or more acceleration-rate-sensitive material(s).  
     
     
         3 . The heat-pump structure of  claim 2 , wherein said acceleration-rate-sensitive material is a viscoelastic material.