US2002141328A1PendingUtilityA1
High density optical disk and a method of high density recording
Priority: Dec 5, 1995Filed: Mar 25, 2002Published: Oct 3, 2002
Est. expiryDec 5, 2015(expired)· nominal 20-yr term from priority
G11B 7/007G11B 11/10584G11B 7/24079G11B 7/00718G11B 7/26
42
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Claims
Abstract
The current invention is directed to a high density disk and a method of manufacturing the high density disk. The high density is accomplished by narrowing the pitch and increasing the groove depth so as not to sacrifice any desirable features of the high density optical disk medium.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of manufacturing optical disks for substantially reducing cross-talk during input and output operations to and from the optical disks each having grooves and lands, data being stored on both the grooves and lands, comprising the steps of:
a) specifying a track pitch between the grooves and the lands; b) selecting a depth of the grooves d in relation to the lands to satisfy a first relation, d=λ/(an) where a is a parameter variable, λ is a laser wavelength used during the operations and n is a refraction index of an optical disk substrate; and c) further selecting said depth d so as to make the cross-talk equal to or less than −25 dB while said first relation in said step b) is maintained.
2 . The method of substantially reducing cross-talk according to claim 1 wherein said parameter a is equal to or less than 4.
3 . The method of substantially reducing cross-talk according to claim 1 wherein said track pitch is equal to or less than 1.1 λ.
4 . The method of substantially reducing cross-talk according to claim 1 wherein said track pitch is equal to or less than 0.96 λ.
5 . The method of substantially reducing cross-talk according to claim 1 wherein said track pitch is equal to or less than 0.81 λ.
6 . The method of substantially reducing cross-talk according to any one of claims 3 , 4 , and 5 wherein said wavelength is equal to or less than 690 nm.
7 . A method of manufacturing optical disks for substantially reducing cross-talk during input and output operations to and from the optical disks each having grooves and lands, data being stored on both the grooves and lands, comprising the steps of:
a) specifying a track pitch between the grooves and the lands; and b) selecting a depth of the grooves d in relation to the lands to satisfy a first relation, d=λ/(an) where a is a parameter variable, λ is a laser wavelength used during the operations and n is a refraction index of an optical disk substrate, said parameter ranges from 2.8 to 3.4.
8 . The method of substantially reducing cross-talk according to claim 7 wherein said track pitch is equal to or less than 1.1 λ.
9 . The method of substantially reducing cross-talk according to claim 7 wherein said track pitch is equal to or less than 0.96 λ.
10 . The method of substantially reducing cross-talk according to claim 7 wherein said track pitch is equal to or less than 0.81 λ.
11 . The method of substantially reducing cross-talk according to any one of claims 8 , 9 , and 10 wherein said wavelength is equal to or less than 690 nm.
12 . A method of manufacturing optical disks for substantially reducing cross-talk during input and output operations to and from the optical disks each having grooves and lands, data being stored on both the grooves and lands, comprising the steps of:
a) specifying a track pitch between the grooves and the lands; b) selecting a depth of the grooves d in relation to the lands to satisfy a first relation, d=λ/(an)+mλ/(bn) where a and b are parameter variables, λ is a laser wavelength used during the operations, m is an integer and n is a refraction index of an optical disk substrate, wherein said parameter a satisfies 5.2≦a≦6.8 while said parameter b satisfies 1.8≦b≦2.1, m being a natural number.
13 . The method of substantially reducing cross-talk according to claim 12 wherein said parameter a satisfies 2.8 s a s 3.4 while said parameter b satisfies 1.8≦b≦2.1, m being a positive integer including 0.
14 . The method of substantially reducing cross-talk according to claim 12 wherein said track pitch is equal to or less than 1.1 λ.
15 . The method of substantially reducing cross-talk according to claim 12 wherein said track pitch is equal to or less than 0.96 λ.
16 . The method of substantially reducing cross-talk according to claim 12 wherein said track pitch is equal to or less than 0.81 λ.
17 . The method of substantially reducing cross-talk according to any one of claims 14 , 15 and 16 wherein said wavelength is equal to or less than 690 nm.
18 . A method of manufacturing optical disks for substantially reducing thermal cross-talk during input and output operations to and from the optical disks each having grooves and lands comprising the steps of:
a) specifying a track pitch between the grooves and the lands to be equal or less than 1.1 λ where λ is a laser wavelength used during the operations; and b) selecting a depth of the grooves d in relation to the lands to satisfy a first relation, d=λ/(an) where a is a parameter variable and n is a refraction index of an optical disk substrate.
19 . The method of manufacturing optical disks according to claim 18 wherein said parameter a ranges from 2.159 to 3.778.
20 . The method of manufacturing optical disks according to claim 18 wherein said parameter a ranges from 2.061 to 3.487.
21 . The method of manufacturing optical disks according to claim 18 wherein said parameter a ranges from 2.061 to 3.022.
22 . The method of manufacturing optical disks according to claim 18 wherein said parameter a ranges from 1.365 to 1.959.
23 . The method of manufacturing optical disks according to claim 18 wherein said parameter a ranges from 0.776 to 1.288.
24 . The method of manufacturing optical disks according to claim 18 wherein said wavelength λ is equal to or less than 690 nm.
25 . A method of manufacturing optical disks for substantially reducing thermal cross-talk during input and output operations to and from the optical disks each having grooves and lands comprising the steps of:
a) specifying a track pitch between the grooves and the lands to be equal or less than 0.96 λ where λ is a laser wavelength used during the operations; and b) selecting a depth of the grooves d in relation to the lands to satisfy a first relation, d=λ/(an) where a is a parameter variable and n is a refraction index of an optical disk substrate.
26 . The method of manufacturing optical disks according to claim 25 wherein said parameter a ranges from 2.159 to 3.778.
27 . The method of manufacturing optical disks according to claim 25 wherein said parameter a ranges from 2.159 to 3.238.
28 . The method of manufacturing optical disks according to claim 25 wherein said parameter a ranges from 2.061 to 3.487.
29 . The method of manufacturing optical disks according to claim 25 wherein said parameter a ranges from 2.061 to 2.667.
30 . The method of manufacturing optical disks according to claim 25 wherein said parameter a ranges from 1.365 to 1.959.
31 . The method of manufacturing optical disks according to claim 25 wherein said parameter a ranges from 0.776 to 1.288.
32 . The method of manufacturing optical disks according to claim 25 wherein said wavelength λ is equal to or less than 690 nm.
33 . A method of manufacturing optical disks for substantially reducing thermal cross-talk during input and output operations to and from the optical disks each having grooves and lands comprising the steps of:
a) specifying a track pitch between the grooves and the lands to be equal or less than 0.81 λ where λ is a laser wavelength used during the operations; and b) selecting a depth of the grooves d in relation to the lands to satisfy a first relation, d=λ/(an) where a is a parameter variable and n is a refraction index of an optical disk substrate.
34 . The method of manufacturing optical disks according to claim 33 wherein said parameter a ranges from 2.267 to 3.778.
35 . The method of manufacturing optical disks according to claim 33 wherein said parameter a ranges from 2.159 to 3.022.
36 . The method of manufacturing optical disks according to claim 33 wherein said parameter a ranges from 2.159 to 3.238.
37 . The method of manufacturing optical disks according to claim 33 wherein said parameter a ranges from 2.159 to 2.386.
38 . The method of manufacturing optical disks according to claim 33 wherein said parameter a ranges from 1.365 to 1.959.
39 . The method of manufacturing optical disks according to claim 33 wherein said parameter a ranges from 0.776 to 1.288.
40 . The method of manufacturing optical disks according to claim 33 wherein said wavelength λ is equal to less than 690 nm.
41 . A method of manufacturing optical disks for substantially reducing thermal cross-talk during input and output operations to and from the optical disks each having grooves and lands comprising the steps of:
a) specifying a track pitch between the grooves and the lands to be equal or less than 1.1 λ where λ is a laser wavelength used during the operations; and b) selecting a depth of the grooves d in relation to the lands to satisfy a first relation, d>λ/(4n) where n is a refraction index of an optical disk substrate.
42 . The method of manufacturing optical disks according to claim 41 wherein said wavelength λ is equal to or less than 690 nm.
43 . The method of manufacturing optical disks according to claim 41 further comprising a step c) of further selecting said depth d so as to make I PP /I O ≧0.2.
44 . The method of manufacturing optical disks according to claim 41 further comprising a step c) of further selecting said depth d so as to make I G /I O ≧0.5.
45 . The method of manufacturing optical disks according to claim 41 further comprising a step c) of further selecting said depth d so as to make Pe/Pp≧1.2.
46 . The method of manufacturing optical disks according to claim 41 further comprising a step c) of further selecting said depth d so as to make Pe/Pp≧1.3.
47 . A method of manufacturing optical disks for substantially reducing thermal cross-talk during input and output operations to and from the optical disks each having grooves and lands, data being stored on both the grooves and lands, comprising the steps of:
a) specifying a track pitch between the grooves and the lands at a predetermined width ratio of the grooves and the lands; and b) selecting a depth of the grooves d in relation to the lands to satisfy a first relation, d>λ/(4n) where λ is a laser wavelength used during the operations and n is a refraction index of an optical disk substrate.
48 . The method of manufacturing optical disks according to claim 47 wherein said wavelength λ is equal to or less than 690 nm.
49 . The method of manufacturing optical disks according to claim 47 wherein said predetermined width ratio is larger than 1.
50 . The method of manufacturing optical disks according to claim 47 wherein said predetermined width ratio is equal to or larger than 1.05.
51 . The method of manufacturing optical disks according to claim 47 wherein said predetermined width ratio is equal to or larger than 1.08.
52 . The method of manufacturing optical disks according to claim 47 wherein said predetermined width ratio is equal to or larger than 1.1.
53 . The method of manufacturing optical disks according to claim 47 wherein said track pitch is equal to or less than 1.1 λ.
54 . The method of manufacturing optical disks according to claim 47 wherein said track pitch is equal to or less than 0.96 λ.
55 . The method of manufacturing optical disks according to claim 47 wherein said track pitch is equal to or less than 0.81 λ.
56 . The method of manufacturing optical disks according to claim 47 further comprising a step b) of further selecting said depth d so as to make Pp(groove)/Pp(land)≧80.
57 . The method of manufacturing optical disks according to claim 38 further comprising a step b) of further selecting said depth d so as to make Pp(groove)/Pp(land)≧85.
58 . An optical disk for substantially reducing cross-talk during its input and output operations to and from the optical disks, comprising:
grooves and lands located on the disk for storing data on both said grooves and said lands, a predetermined distance between said grooves and said lands being defined as a predetermined track pitch, wherein said grooves having a depth d in relation to said lands, wherein said depth is related to a parameter variable a, a laser wavelength λ which is used during the operations and a refraction index n of an optical disk substrate in a relation as (d)>λ/(an), said depth d is further determined so that cross-talk is equal to or less than −25 dB while said relation is maintained.
59 . The optical disk for substantially reducing cross-talk according to claim 58 wherein said parameter a is equal to or less than 4.
60 . The optical disk for substantially reducing cross-talk according to claim 58 wherein said predetermined track pitch is equal to or less than 1.1 λ.
61 . The optical disk for substantially reducing cross-talk according to claim 58 wherein said track pitch is equal to or less than 0.96 λ.
62 . The optical disk for substantially reducing cross-talk according to claim 58 wherein said track pitch is equal to or less than 0.81 λ.
63 . The optical disk for substantially reducing cross-talk according to any one of claims 60 , 61 and 62 wherein said wavelength is equal to or less than 690 nm.
64 . An optical disk for substantially reducing cross-talk during its input and output operations to and from the optical disks, comprising:
grooves and lands located on the disk for storing data on both said grooves and said lands, a predetermined distance between said grooves and said lands being defined as a predetermined track pitch, wherein said grooves having a depth d in relation to said lands, wherein said depth is related to a parameter variable a, a laser wavelength λ which is used during the operations and a refraction index n of an optical disk substrate in a relation as (d)>λ/(an), wherein said parameter a ranges from 2.8 to 3.4.
65 . The optical disk for substantially reducing cross-talk according to claim 64 wherein said predetermined track pitch is equal to or less than 1.1 λ.
66 . The optical disk for substantially reducing cross-talk according to claim 64 wherein said track pitch is equal to or less than 0.96 λ.
67 . The optical disk for substantially reducing cross-talk according to claim 64 wherein said track pitch is equal to or less than 0.81 λ.
68 . The optical disk for substantially reducing cross-talk according to any one of claims 65 , 66 and 67 wherein said wavelength is equal to or less than 690 nm.
69 . An optical disks for substantially reducing cross-talk during input and output operations to and from the optical disks, comprising:
grooves and lands located on the disk for storing data on both said grooves and said lands, a predetermined distance between said grooves and said lands being defined as a predetermined track pitch, wherein said grooves having a depth d in relation to said lands, wherein said depth-is related to parameter variables a, b and m, a laser wavelength λ which is used during the operations and a refraction index n of an optical disk substrate in a relation as d=λ/(an)+mλ/(bn), wherein said parameter a satisfies 5.2≦a≦6.8 while said parameter b satisfies 1.8≦b≦2.1, m being a natural number.
70 . The optical disks for substantially reducing cross-talk according to claim 69 wherein said parameter a satisfies 2.8≦a≦3.4 while said parameter b satisfies 1.8≦b≦2.1, m being a positive integer including 0.
71 . The optical disks for substantially reducing cross-talk according to claim 69 wherein said track pitch is equal to or less than 1.1 λ.
72 . The optical disks for substantially reducing cross-talk according to claim 69 wherein said track pitch is equal to or less than 0.96 λ.
73 . The optical disks for substantially reducing cross-talk according to claim 69 wherein said track pitch is equal to or less than 0.81 λ.
74 . The optical disks for substantially reducing cross-talk according to any one of claims 71 , 72 and 73 wherein said wavelength is equal to or less than 690 nm.
75 . An optical disks for substantially reducing thermal cross-talk during input and output operations to and from the optical disks, comprising:
grooves and lands located on the disk, a predetermined distance between said grooves and said lands being defined as a predetermined track pitch, wherein said predetermined track pitch is equal to or less than 1.1 λwhere λ is a laser wavelength used during the operations, said grooves having a depth d in relation to said lands, wherein said depth is related to a parameter variable a and a refraction index n of an optical disk substrate in a relation as d=λ/(an).
76 . The optical disks according to claim 75 wherein said parameter a ranges from 2.159 to 3.778.
77 . The optical disks according to claim 75 wherein said parameter a ranges from 2.061 to 3.487.
78 . The optical disks according to claim 75 wherein said parameter a ranges from 2.061 to 3.022.
79 . The optical disks according to claim 75 wherein said parameter a ranges from 1.365 to 1.959.
80 . The optical disks according to claim 75 wherein said parameter a ranges from 0.776 to 1.288.
81 . The optical disks according to claim 75 wherein said wavelength λ is equal to or less than 690 nm.
82 . An optical disks for substantially reducing thermal cross-talk during input and output operations to and from the optical disks, comprising:
grooves and lands located on the disk, a predetermined distance between said grooves and said lands being defined as a predetermined track pitch, wherein said predetermined track pitch is equal to or less than 0.96 λ where λ is a laser wavelength used during the operations, said grooves having a depth d in relation to said lands, wherein said depth is related to a parameter variable a and a refraction index n of an optical disk substrate in a relation as d=λ/(an).
83 . The optical disks according to claim 82 wherein said parameter a ranges from 2.159 to 3.778.
84 . The optical disks according to claim 82 wherein said parameter a ranges from 2.159 to 3.238.
85 . The optical disks according to claim 82 wherein said parameter a ranges from 2.061 to 3.487.
86 . The optical disks according to claim 82 wherein said parameter a ranges from 2.061 to 2.667.
87 . The optical disks according to claim 82 wherein said parameter a ranges from 1.365 to 1.959.
88 . The optical disks according to claim 82 wherein said parameter a ranges from 0.776 to 1.288.
89 . The optical disks according to claim 82 wherein said wavelength λ is equal to or less than 690 nm.
90 . An optical disks for substantially reducing thermal cross-talk during input and output operations to and from t he optical disks, comprising:
grooves and lands located on the disk, a predetermined distance between said grooves and said lands being defined as a predetermined track pitch, wherein said predetermined track pitch is equal to or less than 0.81 λ where λ is a laser wavelength used during the operations, said grooves having a depth d in relation to said lands, wherein said depth is related to a parameter variable a and a refraction index n of an optical disk substrate in a relation as d=λ/(an).
91 . The optical disks according to claim 90 wherein said parameter a ranges from 2.267 to 3.778.
92 . The optical disks according to claim 90 wherein said parameter a ranges from 2.159 to 3.022.
93 . The optical disks according to claim 90 wherein said parameter a ranges from 2.159 to 3.238.
94 . The optical disks according to claim 90 wherein said parameter a ranges from 2.159 to 2.386.
95 . The optical disks according to claim 90 wherein said parameter a ranges from 1.365 to 1.959.
96 . The optical disks according to claim 90 wherein said parameter a ranges from 0.776 to 1.288.
97 . The optical disks according to claim 90 wherein said wavelength λ is equal to less than 690 nm.
98 . An optical disks for substantially reducing thermal cross-talk during input and output operations to and from the optical disks, comprising:
grooves and lands located on the disk, a predetermined distance between said grooves and said lands being defined as a predetermined track pitch, wherein said predetermined track pitch is equal to or less than 1.1 λ where λ is a laser wavelength used during the operations, said grooves having a depth d in relation to said lands; wherein said depth is related to a refraction index n of an optical disk substrate in a relation as d>λ/(4n).
99 . The optical disks according to claim 98 wherein said wavelength λ is equal to or less than 690 nm.
100 . The optical disks according to claim 98 wherein said depth d is selected so as to make I PP /I O ≧0.2.
101 . The optical disks according to claim 98 wherein said depth d is selected so as to make I G /I O ≧0.5.
102 . The optical disks according to claim 98 wherein said depth d is selected so as to make Pe/Pp≧1.2.
103 . The optical disks according to claim 98 wherein said depth d is selected so as to make Pe/Pp≧1.3.
104 . An optical disks for substantially reducing thermal cross-talk during input and output operations to and from the optical disks, comprising:
grooves and lands located on the disk for storing data on both said grooves and said lands, a predetermined distance between said grooves and said lands being defined as a predetermined track pitch, wherein said predetermined track pitch is also specified by a predetermined width ratio of said grooves and said lands, said grooves having a depth d in relation to said lands, wherein said depth is related to a laser wavelength λ used during the operations and a refraction index n of an optical disk substrate in a relation as d>λ/(4n).
105 . The optical disks according to claim 104 wherein said wavelength λ is equal to or less than 690 nm.
106 . The optical disks according to claim 104 wherein said predetermined width ratio is larger than 1.
107 . The optical disks according to claim 104 wherein said predetermined width ratio is equal to or larger than 1.05.
108 . The optical disks according to claim 104 wherein said predetermined width ratio is equal to or larger than 1.08.
109 . The optical disks according to claim 104 wherein said predetermined width ratio is equal to or larger than 1.1.
110 . The optical disks according to claim 104 wherein said track pitch is equal to or less than 1.1 λ.
111 . The optical disks according to claim 104 wherein said track pitch is equal to or less than 0.96 λ.
112 . The optical disks according to claim 104 wherein said track pitch is equal to or less than 0.81 λ.
113 . The optical disks according to claim 104 wherein said depth d is selected so as to make Pp(groove)/Pp(land)≧80.
114 . The optical disks according to claim 104 wherein said depth d is selected so as to make pp(groove)/Pp(land)≧85.Join the waitlist — get patent alerts
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