US2002127957A1PendingUtilityA1

Chemical mechanical polish pad conditioning device

34
Priority: Dec 20, 2000Filed: Dec 20, 2000Published: Sep 12, 2002
Est. expiryDec 20, 2020(expired)· nominal 20-yr term from priority
Inventors:Kevin ShipleyRick MesserWilliam D. Spencer
B24D 18/00B24B 53/017B24B 53/14
34
PatentIndex Score
0
Cited by
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References
0
Claims

Abstract

A chemical mechanical polish pad conditioning device is disclosed. The device includes a conditioning substrate made of stainless steel forming a predetermined pattern on a surface. Also, a method of producing a chemical mechanical polish pad conditioning device is disclosed. The method includes providing a conditioning substrate made of stainless steel forming a predetermined pattern on a surface, and applying a hardening process to the surface of the conditioning substrate. The invention further discloses a method of conditioning a chemical mechanical polish pad. The method includes providing a conditioning substrate forming a predetermined pattern on a surface, fixing the conditioning substrate to a conditioning arm, and contacting the surface of the conditioning substrate with a polish pad and moving the conditioning substrate on the polish pad with a predetermined downforce at a predetermined rate of speed. Because the conditioning substrate does not use a diamond layer bonded to the substrate, there is no risk that detached diamonds may become embedded in the polish pad in the course of polishing. Under the configurations of the conditioning device, production of a custom conditioning device that meets specified cut-rate or surface roughness specifications can be achieved

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A chemical mechanical polish pad conditioning device, comprising: 
 a stainless steel conditioning substrate having a predetermined pattern formed on a surface thereof.    
     
     
         2 . The device according to  claim 1 , further comprising: 
 a base;    wherein the conditioning substrate is fixed in flat relation to the base.    
     
     
         3 . The device according to  claim 2 , wherein a surface of the base is provided with a plurality of grooves and the conditioning substrate is adhered to the base by an adhesive placed in the grooves.  
     
     
         4 . The device according to  claim 1 , wherein a hardening process is applied to the surface of the conditioning substrate.  
     
     
         5 . The device according to  claim 4 , wherein the hardening process is an ion-nitride treatment process.  
     
     
         6 . The device according to  claim 1 , wherein the pattern on the surface of the conditioning substrate is formed by a chemical etching process.  
     
     
         7 . The device according to  claim 1 , wherein the pattern on the surface of the conditioning substrate is formed by a casting process.  
     
     
         8 . The device according to  claim 1 , wherein the pattern on the surface of the conditioning substrate is formed by a forging process.  
     
     
         9 . The device according to  claim 1 , wherein the pattern on the surface of the conditioning substrate is formed by machining.  
     
     
         10 . The device according to  claim 1 , wherein the pattern on the surface of the conditioning substrate is formed in a diamond shape.  
     
     
         11 . The device according to  claim 1 , wherein the pattern on the surface of the conditioning substrate is formed in a circular shape.  
     
     
         12 . The device according to  claim 1 , wherein the pattern on the surface of the conditioning substrate is formed in a triangular shape.  
     
     
         13 . The device according to  claim 1 , wherein the pattern on the surface of the conditioning substrate is formed in a spiral shape.  
     
     
         14 . The device according to  claim 9 , wherein the pattern on the surface of the conditioning substrate is formed in a pyramid shape.  
     
     
         15 . A method of producing a chemical mechanical polish pad conditioning device, comprising: 
 forming a predetermined pattern on a stainless steel conditioning substrate. applying a hardening process to the surface of the conditioning substrate.    
     
     
         16 . The method according to  claim 15 , further comprising fixing the conditioning in flat relation to a base.  
     
     
         17 . The method according to  claim 16 , disposing a plurality of grooves in a surface of the base; and adhering the conditioning substrate to the base by an adhesive placed in the grooves.  
     
     
         18 . The method according to  claim 15 , wherein the hardening process is an ion-nitride treatment process.  
     
     
         19 . The method according to  claim 15 , further comprising: 
 the pattern on the surface of the conditioning substrate by a chemical etching process.    
     
     
         20 . The method according to  claim 15 , further comprising: 
 the pattern on the surface of the conditioning substrate by a casting process.    
     
     
         21 . The method according to  claim 15 , wherein the pattern on the surface of the conditioning substrate is formed by using a forging process.  
     
     
         22 . The method according to  claim 15 , further comprising: 
 forming the pattern on the surface of the conditioning substrate by machining.    
     
     
         23 . The method according to  claim 15 , further comprising: 
 forming the pattern on the surface of the conditioning substrate in a diamond shape.    
     
     
         24 . The method according to  claim 15 , further comprising: 
 forming the pattern on the surface of the conditioning substrate in a circular shape.    
     
     
         25 . The method according to  claim 15 , further comprising: 
 forming the pattern on the surface of the conditioning substrate in a triangular shape.    
     
     
         26 . The method according to  claim 15 , further comprising: 
 forming the pattern on the surface of the conditioning substrate in a spiral shape.    
     
     
         27 . The method according to  claim 22 , further comprising: 
 forming the pattern on the surface of the conditioning substrate in a pyramid shape.    
     
     
         28 . A method of conditioning a chemical mechanical polish pad, comprising: 
 forming a predetermined pattern on a surface of a conditioning substrate;    fixing the conditioning substrate to a conditioning arm;    contacting the surface of the conditioning substrate with the polish pad; and    moving the conditioning substrate on the polish pad with a predetermined downforce at a predetermined rate of speed.    
     
     
         29 . The method according to  claim 28 , further comprising: 
 fixing the substrate in flat relation to a base connected to the conditioning arm.    
     
     
         30 . The method according to  claim 29 , further comprising: 
 providing a plurality of grooves in a surface of the base and adhering the conditioning substrate to the base by an adhesive placed in the grooves.    
     
     
         31 . The method according to  claim 28 , further comprising: 
 applying a hardening process to the surface of the conditioning substrate.    
     
     
         32 . The method according to  claim 31 , wherein the hardening process is an ion-nitride treatment process.  
     
     
         33 . The method according to  claim 28 , further comprising: 
 forming the pattern on the surface of the conditioning substrate by a chemical etching process.    
     
     
         34 . The method according to  claim 28 , further comprising: 
 forming the pattern on the surface of the conditioning substrate by a casting process.    
     
     
         35 . The method according to  claim 28 , further comprising: 
 forming the pattern on the surface of the conditioning substrate by a forging process.    
     
     
         36 . The method according to  claim 28 , further comprising: 
 forming the pattern on the surface of the conditioning substrate by machining.    
     
     
         37 . The method according to  claim 28 , further comprising: 
 forming the pattern on the surface of the conditioning substrate in a diamond shape.    
     
     
         38 . The method according to  claim 28 , further comprising: 
 forming the pattern on the surface of the conditioning substrate in a circular shape.    
     
     
         39 . The method according to  claim 28 , further comprising: 
 forming the pattern on the surface of the conditioning substrate in a triangular shape.    
     
     
         40 . The method according to  claim 28 , further comprising: 
 forming the pattern on the surface of the conditioning substrate in a spiral shape.    
     
     
         41 . The method according to  claim 36 , further comprising: 
 forming the pattern on the surface of the conditioning substrate in a pyramid shape.

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