Copper alloy material for parts of electronic and electric machinery and tools

Abstract

A copper alloy material for parts of electronic and electric machinery and tools contains 1.0 to 3.0 mass % of Ni, 0.2 to 0.7 mass % of Si, 0.01 to 0.2 mass % of Mg, 0.05 to 1.5 mass % of Sn, 0.2 to 1.5 mass % of Zn, and less than 0.005 mass % (including 0 mass %) of S, with the balance being Cu and inevitable impurities, wherein the copper alloy material has: (1) a specific crystal grain diameter, and a specific ratio between the longer diameters of a crystal grain on a cross section parallel or perpendicular to a direction of final plastic working; and/or (2) a specific surface roughness after the final plastic working.

1 . A copper alloy material for parts of electronic and electric machinery and tools, comprising 1.0 to 3.0% by mass of Ni, 0.2 to 0.7% by mass of Si, 0.01 to 0.2% by mass of Mg, 0.05 to 1.5% by mass of Sn, 0.2 to 1.5% by mass of Zn, and less than 0.005% by mass (including 0% by mass) of S, with the balance being Cu and inevitable impurities,  
       wherein a crystal grain diameter is more than 0.001 mm and 0.025 mm or less; and the ratio (a/b), between a longer diameter a of a crystal grain on a cross section parallel to a direction of final plastic working, and a longer diameter b of a crystal grain on a cross section perpendicular to the direction of final plastic working, is 1.5 or less.  
     
     
         2 . A copper alloy material for parts of electronic and electric machinery and tools, comprising 1.0 to 3.0% by mass of Ni, 0.2 to 0.7% by mass of Si, 0.01 to 0.2% by mass of Mg, 0.05 to 1.5% by mass of Sn, 0.2 to 1.5% by mass of Zn, 0.005 to 2.0% by mass in a total amount of at least one selected from the group consisting of Ag, Co and Cr (with the proviso that the Cr content is 0.2% by mass or less), and less than 0.005% by mass (including 0% by mass) of S, with the balance being Cu and inevitable impurities,  
       wherein a crystal grain diameter is more than 0.001 mm and 0.025 mm or less; and the ratio (a/b), between a longer diameter a of a crystal grain on a cross section parallel to a direction of final plastic working, and a longer diameter b of a crystal grain on a cross section perpendicular to the direction of final plastic working, is 1.5 or less.  
     
     
         3 . A copper alloy material for parts of electronic and electric machinery and tools, comprising 1.0 to 3.0% by mass of Ni, 0.2 to 0.7% by mass of Si, 0.01 to 0.2% by mass of Mg, 0.05 to 1.5% by mass of Sn, 0.2 to 1.5% by mass of Zn, and less than 0.005% by mass (including 0% by mass) of S, with the balance being Cu and inevitable impurities,  
       wherein a surface roughness Ra after final plastic working is more than 0 μm and less than 0.1 μm, or a surface roughness Rmax is more than 0 μm and less than 2.0 μm.  
     
     
         4 . The copper alloy material for parts of electronic and electric machinery and tools according to  claim 3 , wherein the copper alloy material for parts of electronic and electric machinery and tools is being plated with Sn or a Sn alloy.  
     
     
         5 . The copper alloy material for parts of electronic and electric machinery and tools according to  claim 3 , wherein the copper alloy material for parts of electronic and electric machinery and tools is being plated with Sn or a Sn alloy, and is being subjected to a reflow treatment.  
     
     
         6 . The copper alloy material for parts of electronic and electric machinery and tools according to  claim 3 , wherein the copper alloy material for parts of electronic and electric machinery and tools is being plated with Cu or a Cu alloy as an underlayer, and is being plated with Sn or a Sn alloy thereon.  
     
     
         7 . The copper alloy material for parts of electronic and electric machinery and tools according to  claim 3 , wherein the copper alloy material for parts of electronic and electric machinery and tools is being plated with Cu or a Cu alloy as an underlayer, and is being plated with Sn or a Sn alloy thereon, and is being subjected to a reflow treatment.  
     
     
         8 . The copper alloy material for parts of electronic and electric machinery and tools according to  claim 3 , wherein the copper alloy material for parts of electronic and electric machinery and tools is being plated with Ni or a Ni alloy as an underlayer, and is being plated with Au or a Au alloy thereon.  
     
     
         9 . A copper alloy material for parts of electronic and electric machinery and tools, comprising 1.0 to 3.0% by mass of Ni, 0.2 to 0.7% by mass of Si, 0.01 to 0.2% by mass of Mg, 0.05 to 1.5% by mass of Sn, 0.2 to 1.5% by mass of Zn, 0.005 to 2.0% by mass in a total amount of at least one selected from the group consisting of Ag, Co and Cr (with the proviso that the Cr content is 0.2% by mass or less), and less than 0.005% by mass (including 0% by mass) of S, with the balance being Cu and inevitable impurities,  
       wherein a surface roughness Ra after final plastic working is more than 0 μm and less than 0.1 μm, or a surface roughness Rmax is more than 0 μm and less than 2.0 μm.  
     
     
         10 . The copper alloy material for parts of electronic and electric machinery and tools according to  claim 9 , wherein the copper alloy material for parts of electronic and electric machinery and tools is being plated with Sn or a Sn alloy.  
     
     
         11 . The copper alloy material for parts of electronic and electric machinery and tools according to  claim 9 , wherein the copper alloy material for parts of electronic and electric machinery and tools is being plated with Sn or a Sn alloy, and is being subjected to a reflow treatment.  
     
     
         12 . The copper alloy material for parts of electronic and electric machinery and tools according to  claim 9 , wherein the copper alloy material for parts of electronic and electric machinery and tools is being plated with Cu or a Cu alloy as an underlayer, and is being plated with Sn or a Sn alloy thereon.  
     
     
         13 . The copper alloy material for parts of electronic and electric machinery and tools according to  claim 9 , wherein the copper alloy material for parts of electronic and electric machinery and tools is being plated with Cu or a Cu alloy as an underlayer, and is being plated with Sn or a Sn alloy thereon, and is being subjected to a reflow treatment.  
     
     
         14 . The copper alloy material for parts of electronic and electric machinery and tools according to  claim 9 , wherein the copper alloy material for parts of electronic and electric machinery and tools is being plated with Ni or a Ni alloy as an underlayer, and is being plated with Au or a Au alloy thereon.