Method of manufacturing semiconductor device

Abstract

A semiconductor device including a semiconductor chip having plural electrode pads at the peripheral edge portion thereof, a frame-shaped package substrate in which the semiconductor chip is mounted and which has plural electrode portions corresponding to the respective electrode pads, a lead terminal for connecting each of the electrode pads of the semiconductor chip and each corresponding electrode portion of the package substrate, and sealing resin for sealing the semiconductor chip. In a method of manufacturing the semiconductor device, a lead terminal is connected to each of plural electrode pads of a semiconductor chip while setting a lead connection angle in accordance with the chip size, the lead terminal is cut to a predetermined length in accordance with an electrode forming position of the frame-shaped package substrate on which the semiconductor chip can be mounted, the cut portion of the lead terminal is connected to the electrode portion of the package substrate while the semiconductor chip is mounted on the package substrate, and then the semiconductor chip mounted on the package substrate is sealed with sealing resin.

What is claimed is:  
     
         1 . A semiconductor device including: 
 a semiconductor chip having plural electrode pads at the peripheral edge portion thereof;    a frame-shaped package substrate in which said semiconductor chip is mounted and which has plural electrode portions corresponding to said respective electrode pads;    a lead terminal for connecting each of said electrode pads of said semiconductor chip and each corresponding electrode portion of said package substrate; and    sealing resin for sealing said semiconductor chip.    
     
     
         2 . The semiconductor device as claimed in  claim 1 , wherein said package substrate has embedded through holes.  
     
     
         3 . The semiconductor device as claimed in  claim 2 , wherein one end portion of each of said embedded through holes serves as an electrode portion for lead connection, and the other end portion thereof serves as an electrode portion for external connection.  
     
     
         4 . The semiconductor device as claimed in  claim 1 , wherein said electrode pads of said semiconductor chip are located substantially at the same height as said electrode portions of said package substrate, and the non circuit forming face of said semiconductor chip is located more inwardly as compared with said electrode pads for external connection of said package substrate.  
     
     
         5 . The semiconductor device as claimed in  claim 1 , wherein a sealing member is disposed through said lead terminals.  
     
     
         6 . The semiconductor device as claimed in  claim 1 , wherein a bump is provided at the tip of each of said lead terminals.  
     
     
         7 . A semiconductor device manufacturing method including: 
 a first lead connecting step of connecting a lead terminal to each of plural electrode pads of a semiconductor chip which has the plural electrode pads at the chip peripheral edge portion while setting a lead connection angle in accordance with the chip size;    a lead cutting step of cutting the lead terminal to a predetermined length in accordance with an electrode forming position of the frame-shaped package substrate on which the semiconductor chip can be mounted;    a second lead connecting step of connecting the cut portion of the lead terminal to the electrode portion of the package substrate while the semiconductor chip is mounted on the package substrate; and    a resin sealing step of sealing the semiconductor chip mounted on the package substrate with sealing resin.    
     
     
         8 . The semiconductor device manufacturing method as claimed in  claim 7 , wherein the package substrate has embedded through holes.  
     
     
         9 . The semiconductor device manufacturing method as claimed in  claim 8 , wherein one end portion of each of the embedded through holes serves as an electrode portion for lead connection, and the other end portion thereof serves as an electrode portion for external connection.  
     
     
         10 . The semiconductor device manufacturing device as claimed in  claim 7 , wherein the electrode pads of the semiconductor chip are located substantially at the same height as the electrode portions of the package substrate, and the non circuit forming face of the semiconductor chip is located more inwardly as compared with the electrode pads for external connection of the package substrate.  
     
     
         11 . The semiconductor device manufacturing method as claimed in  claim 7 , wherein a sealing member is disposed through the lead terminals.  
     
     
         12 . The semiconductor device manufacturing method as claimed in  claim 7 , wherein a bump is provided at the tip of each of the lead terminals.