Multiple connection socket assembly for semiconductor fabrication equipment and methods employing same

Abstract

A multiple connection socket assembly for operatively associating semiconductor device fabrication equipment with a plurality of external facilities. The multiple connection socket assembly includes a connective structure configured to substantially simultaneously connect at least two different external facilities selected from a power supply, a computer, a vacuum, a chemical source, a source of water vapor, a source of liquid water, a pressurized air source, a hydraulic fluid source, and a ventilation system. The connective structure itself may include interconnectable first and second members with corresponding connector elements disposed on the faces of each member. The connector elements of the first member are in communication with various conduits extending from corresponding external facilities, and the connector elements of the second member are in communication with various conduits extending into corresponding components of the semiconductor device fabrication equipment, and the connector elements are arranged in such a way that when the first and second members are interconnected, the corresponding pairs of connector elements align and engage. When the connector elements disposed upon the faces of the first and second members are engaged, each of the conduits extending from the various external facilities and their corresponding conduits extending into the components of the semiconductor device fabrication equipment communicate. Thus, the multiple connection socket assembly facilitates the substantially simultaneous connection or disconnection of the semiconductor device fabrication equipment to or from a plurality of external facilities, thereby reducing the time necessary to connect or disconnect such equipment to and from the various external facilities. CROSS REFERENCE TO RELATED APPLICATION This application is a divisional of application Ser. No. 09/137,719 , filed Aug. 21, 1998 , pending.

What is claimed is:  
     
         1 . A multiple connection socket assembly for operatively associating semiconductor device fabrication equipment with a plurality of external facilities, the multiple connection socket assembly comprising: 
 a connective structure configured to substantially simultaneously connect to the semiconductor device fabrication equipment at least two different external facilities selected from a power supply, a computer, a vacuum source, a process liquid source, a process gas source, a source of water vapor, a source of liquid water, a pressurized air source, a hydraulic fluid source, and a ventilation source.    
     
     
         2 . The multiple connection socket assembly according to  claim 1 , wherein said connective structure comprises: 
 a first member including a first face with a first plurality of connector elements disposed thereon, each of said first plurality of connector elements in communication with a corresponding one of a first plurality of conduits.    
     
     
         3 . The multiple connection socket assembly according to  claim 2 , wherein said connective structure further comprises: 
 a second member interconnectable with said first member and including a second face with a second plurality of connector elements disposed thereon, each of said second plurality of connector elements alignable with and connectable to a corresponding one of said first plurality of connector elements upon interconnection of said first member and said second member, each of said second plurality of connector elements in communication with a corresponding one of a second plurality of conduits.    
     
     
         4 . The multiple connection socket assembly of  claim 3 , further comprising a securing component for mutually securing said first and second members.  
     
     
         5 . The multiple connection socket assembly of  claim 4 , wherein said securing component comprises a first element disposed on said first member and a second element securable to said first element and disposed on said second member.  
     
     
         6 . The multiple connection socket assembly of  claim 3 , wherein said first and second members further include first and second mutually engageable alignment elements.  
     
     
         7 . The multiple connection socket assembly of  claim 3 , wherein said second member is rigidly secured to the semiconductor device fabrication equipment.  
     
     
         8 . A semiconductor device fabrication system, comprising: 
 a piece of semiconductor device fabrication equipment; and    a multiple connection socket assembly for operatively associating the semiconductor device fabrication equipment with a plurality of external facilities, the multiple connection socket assembly comprising a connective structure configured to substantially simultaneously connect at least two different external facilities selected from a power supply, a computer, a vacuum source, a process liquid source, a process gas source, a source of water vapor, a source of liquid water, a pressurized air source, a hydraulic fluid source, and a ventilation source.    
     
     
         9 . The semiconductor device fabrication system of  claim 8 , wherein said connective structure further comprises: 
 a first member including a first face with a first plurality of connector elements disposed thereon, each of said first plurality of connector elements in communication with a corresponding one of a first plurality of conduits.    
     
     
         10 . The semiconductor device fabrication system of  claim 9 , wherein said connective structure further comprises: 
 a second member interconnectable with said first member and including a second face with a second plurality of connector elements disposed thereon, each of said second plurality of connector elements alignable with and connectable to a corresponding one of said first plurality of connector elements upon interconnection of said first member and said second member, each of said second plurality of connector elements in communication with a corresponding one of a second plurality of conduits.    
     
     
         11 . The semiconductor device fabrication system of  claim 10 , wherein said multiple connection socket assembly further comprises a securing component for mutually securing said first and second members.  
     
     
         12 . The semiconductor device fabrication system of  claim 11 , wherein said securing component comprises a first element disposed on said first member and a second element securable to said first element and disposed on said second member.  
     
     
         13 . The semiconductor device fabrication system of  claim 10 , wherein said first and second members further include first and second mutually engageable alignment elements.  
     
     
         14 . The semiconductor device fabrication system of  claim 10 , wherein said second member is rigidly secured to the semiconductor device fabrication equipment.  
     
     
         15 . A semiconductor device fabrication system, comprising: 
 a base for at least one semiconductor device fabrication module cooperative therewith, at least one module being replaceable with another like module; and    at least one multiple connection socket assembly for operatively associating the at least one semiconductor device fabrication module with a plurality of external facilities through the base comprising a connective structure configured to substantially simultaneously connect at least two different external facilities selected from a power supply, a computer, a vacuum source, a process liquid source, a process gas source, a source of water vapor, a source of liquid water, a pressurized air source, a hydraulic fluid source, and a ventilation source.    
     
     
         16 . The semiconductor device fabrication system of  claim 15 , wherein said semiconductor fabrication system further comprises at least one semiconductor device fabrication module.  
     
     
         17 . The semiconductor device fabrication system of  claim 16 , wherein said connective structure further comprises: 
 a first member including a first face with a first plurality of connector elements disposed thereon, each of said first plurality of connector elements in communication with a corresponding one of a first plurality of conduits.    
     
     
         18 . The semiconductor device fabrication system of  claim 17 , wherein said connective structure further comprises: 
 a second member interconnectable with said first member and including a second face with a second plurality of connector elements disposed thereon, each of said second plurality of connector elements alignable with and connectable to a corresponding one of said first plurality of connector elements upon interconnection of said first member and said second member, each of said second plurality of connector elements in communication with a corresponding one of a second plurality of conduits.    
     
     
         19 . The semiconductor device fabrication system of  claim 18 , wherein said second member is rigidly attached to said at least one semiconductor device fabrication module and said first member is rigidly attached to said base.  
     
     
         20 . The semiconductor device fabrication system of  claim 18 , wherein said at least one multiple connection socket assembly further comprises a securing component for mutually securing said first and second members.  
     
     
         21 . The semiconductor device fabrication system of  claim 20 , wherein said securing component comprises a first element disposed on said first member and a second element securable to said first element and disposed on said second member.  
     
     
         22 . The semiconductor device fabrication system of  claim 18 , wherein said first and second members further include first and second mutually engageable alignment elements.