Molded flip chip package

Abstract

A method for producing a molded flip chip package is described. The incomplete flip chip package comprising a thin substrate and a silicon chip is placed in a mold. A resin, such as an epoxy, is injected into the mold filling the gap between the surface of the flip chip and the adjacent substrate. Additionally, a stiffening structure is formed to increase the overall rigidity of the thin substrate specifically and the package as a whole.

What is claimed is:  
     
         1 . A flip chip package comprising: 
 a chip, the chip comprising a top surface, a bottom surface and one or more side surfaces disposed between the top and bottom surfaces;    a substrate, the substrate comprising an upper surface;    a plurality of reflowed solder bumps, the reflowed solder bumps electrically coupling the top surface with an adjacent portion of the upper surface; and    a monolithic element comprising solidified resin, the monolithic element encapsulating and adhesively bonded to (i) substantially all of the one or more side surfaces, (ii) a substantial portion of the upper surface, and (iii) the plurality of reflowed solder bumps located in a gap between the top surface and the upper surface.    
     
     
         2 . The flip chip package of  claim 1 , wherein the solidified resin does not encapsulate the bottom surface.  
     
     
         3 . The flip chip package of  claim 2 , wherein the resin further comprises a filler material.  
     
     
         4 . The flip chip package of  claim 3 , wherein the filler material comprises silica micro spheres.  
     
     
         5 . The flip chip package of  claim 1 , wherein the resin encapsulates substantially all of the one or more side surfaces.  
     
     
         6 . The flip chip package of  claim 5 , wherein the resin does not encapsulate the bottom surface.  
     
     
         7 . The flip chip package of the  claim 1 , wherein the solidified resin comprises an epoxy.  
     
     
         8 . The flip chip package of  claim 1 , wherein the substrate is a thin substrate.  
     
     
         9 . The flip chip package of  claim 1 , wherein the substrate is comprised of a polymeric material.  
     
     
         10 . The flip chip package of  claim 8 , wherein the substrate is approximately 0.05 mm to 0.5 mm thick.  
     
     
         11 . The flip chip package of  claim 1 , further comprising at least one passive component electrically coupled with the substrate.  
     
     
         12 . The flip chip package of  claim 11 , wherein the solidified resin fills a gap between a first surface of the at least one passive component and an adjacent surface of the substrate.  
     
     
         13 . The flip chip package of  claim 11 , wherein the solidified resin fully encapsulates the at least one passive component.