Laser-assisted cutting method

Abstract

The present invention provides a method for cutting polymer material or other materials by separating the material along a line of controlled failure through the application of mechanical force in combination with laser light to break molecular bonds holding the material together along the line of controlled failure. The method includes the use of a generally broad wedge-shaped blade having planar lower and upper surfaces which converge toward each other to terminate along a leading edge. The blade is generally hollow with a cavity for passing optical fibers carrying laser light to a transparent window attached to the leading edge of the blade. Laser light passes through the window and is directed to a line of controlled failure in the material being cut to break the molecular bonds and locally weaken the material while mechanical force is applied to the blade to separate the material and advance the line of controlled failure into the material thereby separating a slice of the material.

What is claimed is:  
     
         1 . A method for separating a slice of polymer material from a block of polymer material along a line of controlled failure in the block of polymer material through the application of force in combination with a laser light comprising the steps of: 
 thrusting a cutting device comprising a wedge-shaped blade into the block of polymer material;    directing laser light from at least a portion of a leading edge of the blade onto the block of polymer material along a line of controlled failure; and    applying force to the blade in the direction of the line of controlled failure thereby advancing the blade and the laser light into the block of polymer material separating the slice of polymer material from the block of polymer material along the line of controlled failure.    
     
     
         2 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 1  wherein the cutting device further comprises: 
 a laser source for providing the laser light; and  
 a means for directing the laser light forward of the leading edge of the blade onto the line of controlled failure.  
 
     
     
         3 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 2  wherein the means for directing the laser light is a window.  
     
     
         4 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 1  wherein the cutting device further comprises: 
 a means for transporting the laser light to the leading edge of the blade; and  
 at least one opening on the leading edge of the blade.  
 
     
     
         5 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 4  wherein the cutting device further comprises: 
 a laser source for providing the laser light; and  
 a means for directing the laser light forward of the leading edge of the blade onto the line of controlled failure.  
 
     
     
         6 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 5  wherein the means for directing the laser light is a window.  
     
     
         7 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 2  wherein the laser light is within a wavelength range of between ultraviolet and infrared, inclusive.  
     
     
         8 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 2  wherein the laser source further comprises a laser oscillator and an amplifier.  
     
     
         9 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 2  wherein the laser source produces laser light of suitable power, wavelength and pulse to break molecular bonds in the polymer material without burning the polymer material.  
     
     
         10 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 5  wherein the laser light is within a wavelength range of between ultraviolet and infrared, inclusive.  
     
     
         11 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 5  wherein the laser source further comprises a laser oscillator and an amplifier.  
     
     
         12 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 5  wherein the laser source produces laser light of suitable power, wavelength and pulse to break molecular bonds in the polymer material without burning the polymer material.  
     
     
         13 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 3  wherein the window is made of at least one ingredient selected from the group consisting of quartz and glass.  
     
     
         14 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 6  wherein the window is made of at least one ingredient selected from the group consisting of quartz and glass.  
     
     
         15 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 7  wherein the laser source further comprises a laser oscillator and an amplifier.  
     
     
         16 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 15  wherein the laser source produces laser light of suitable power, wavelength and pulse to break molecular bonds in the polymer material without burning the polymer material.  
     
     
         17 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 16  wherein the means for directing the laser light is a window made of at least one ingredient selected from the group consisting of quartz and glass.  
     
     
         18 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 10  wherein the laser source further comprises a laser oscillator and an amplifier.  
     
     
         19 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 18  wherein the laser source produces laser light of suitable power, wavelength and pulse to break molecular bonds in the polymer material without burning the polymer material.  
     
     
         20 . A method for separating a slice of polymer material from a block of polymer material as described in  claim 19  wherein the means for directing the laser light is a window made of at least one ingredient selected from the group consisting of quartz and glass.