US2002110637A1PendingUtilityA1
Conductive pattern producing method and its applications
Priority: Dec 24, 1986Filed: Nov 26, 2001Published: Aug 15, 2002
Est. expiryDec 24, 2006(expired)· nominal 20-yr term from priority
Inventors:Akira Mase
H10W 72/354H10W 72/352H10W 72/325H10W 72/241H10W 72/074H10W 72/072H10W 70/098Y10T29/49137H05K 3/245Y10T29/4913H05K 1/095G02F 1/13452Y10T29/49155H05K 2201/0326H05K 2201/035G02F 1/13439G02F 1/1345
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Claims
Abstract
An improved method of forming an electrode pattern on a substrate is described. The substrate is coated with a first conductive film and subjected to baking. On the first conductive film is then overlied a second conductive film which mends possible fissures of the first conductive film which, besides, would produce open circuits in the pattern.
Claims
exact text as granted — not AI-modified1 . A method for producing an electrode pattern on a substrate comprising: coating said substrate with a first conductive film in the form of an electrode pattern for circuitry; and coating said substrate with a second conductive film overlying said first conductive film, said second conductive film being designed to function as a complete pattern for said circuitry even if it were not for said first conductive film.
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