US2002108318A1PendingUtilityA1
Apparatus and method for applying setting material
Priority: Feb 15, 2001Filed: Feb 15, 2001Published: Aug 15, 2002
Est. expiryFeb 15, 2021(expired)· nominal 20-yr term from priority
E04F 21/00E04F 21/20E04F 21/04
36
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Claims
Abstract
An apparatus and method is provided for use in laying stone and the like onto floors. The number of apertures in the apparatus may vary, and a wall surrounds the plate of the apparatus as set forth. There are four articles for adjusting the height of the apparatus above a supporting floor to adjust the amount and level of setting material to be applied. In an alternate embodiment, the thickness of the plate of the apparatus determines how thick the setting material to be applied.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An apparatus for applying setting material comprising:
a. a plate having a plurality of apertures; b. a circumferential wall coupled to a top portion of said plate; c. at least four hollow sleeves coupled to said wall; and d. a leg inserted through each of said sleeves.
2 . The apparatus of claim 1 , wherein said apertures are circular.
3 . The apparatus of claim 1 , wherein said sleeves are threadedly hollow.
4 . The apparatus of claim 3 , wherein said legs are threaded.
5 . The apparatus of claim 1 , wherein said sleeves further comprise:
a. a threaded hole, substantially perpendicular to said sleeve; b. a threaded stud engaged in the threaded hole; and c. a knob coupled to said threaded stud.
6 . The apparatus of claim 1 , wherein said legs further comprise a spherical head.
7 . A method for applying setting material using the apparatus of claim 1 , comprising the steps of:
a. placing said apparatus on a surface such that the plate is disposed at a predetermined height above such surface; b. placing setting material on the plate within said wall; c. smoothing said setting material over said plate and allowing the setting material to fall through said apertures onto said surface; and d. removing said apparatus.Join the waitlist — get patent alerts
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